KR101851761B1 - Heat conductivity structure of LED for display apparatus - Google Patents
Heat conductivity structure of LED for display apparatus Download PDFInfo
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- KR101851761B1 KR101851761B1 KR1020160147910A KR20160147910A KR101851761B1 KR 101851761 B1 KR101851761 B1 KR 101851761B1 KR 1020160147910 A KR1020160147910 A KR 1020160147910A KR 20160147910 A KR20160147910 A KR 20160147910A KR 101851761 B1 KR101851761 B1 KR 101851761B1
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- light source
- led light
- heat
- heat dissipation
- cnt sheet
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 67
- 239000010439 graphite Substances 0.000 claims abstract description 56
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 56
- 230000017525 heat dissipation Effects 0.000 claims abstract description 46
- 229920005989 resin Polymers 0.000 claims abstract description 41
- 239000011347 resin Substances 0.000 claims abstract description 41
- 230000008878 coupling Effects 0.000 claims abstract description 9
- 238000010168 coupling process Methods 0.000 claims abstract description 9
- 238000005859 coupling reaction Methods 0.000 claims abstract description 9
- 239000002041 carbon nanotube Substances 0.000 claims description 13
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 239000011231 conductive filler Substances 0.000 claims description 10
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 6
- 229920002050 silicone resin Polymers 0.000 claims description 6
- 239000008096 xylene Substances 0.000 claims description 6
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 claims description 5
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 4
- 239000012454 non-polar solvent Substances 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 239000003513 alkali Substances 0.000 claims description 2
- 239000003054 catalyst Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims 13
- 239000012790 adhesive layer Substances 0.000 claims 6
- 229910021393 carbon nanotube Inorganic materials 0.000 description 11
- 239000006185 dispersion Substances 0.000 description 7
- 239000004973 liquid crystal related substance Substances 0.000 description 7
- 230000005855 radiation Effects 0.000 description 7
- 239000002390 adhesive tape Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 239000002270 dispersing agent Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
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- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
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- 229910010271 silicon carbide Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Planar Illumination Modules (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The present invention relates to a heat dissipation structure of an LED light source that can efficiently dissipate heat generated from an LED light source by improving heat transfer characteristics. The LED light source dissipation structure according to an embodiment of the present invention includes an LED light source A light source securing member having a seating surface to be attached; A CNT sheet interposed between the LED light source and the seating surface and lapped along the outer surface of the coupling member including the seating surface; And a graphite resin layer formed on an outer surface of the CNT sheet outside the coupling member, wherein the CNT sheet absorbs the heat of the LED light source and transmits the heat in the horizontal direction, and the graphite resin layer contacts the heat of the CNT sheet Absorbing and releasing it to the outside. A CNT sheet excellent in horizontal heat conduction characteristics and a graphite resin excellent in vertical thermal conduction characteristics are combined with each other to absorb and discharge heat of an LED light source, thereby efficiently emitting heat.
Description
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a display device, and more particularly, to a heat dissipation structure of an LED light source capable of efficiently emitting heat generated from an LED light source by improving heat transfer characteristics.
2. Description of the Related Art Generally, a display device is a device for receiving and displaying an image signal, and includes a TV, a monitor, and the like. As means for displaying an image, an OLED (Organic Light Emitting Display) Display Device), and Plasma Display Panel (PDP).
Unlike other display devices, a liquid crystal display (hereinafter, referred to as 'LCD') can not emit light by itself, and an external light source is necessarily required to realize an image. Accordingly, the LCD further includes a backlight unit including an LED light source, a light guide plate, and a light control sheet in addition to the liquid crystal panel. The LED light source is coupled to the back cover at the side or bottom of the light guide plate to provide a plurality of point light sources with light to the light guide plate.
1 is an assembled cross-sectional view illustrating a schematic structure of a display device according to a conventional technique. The
On the other hand, the LED light source generates a lot of heat when driven due to the characteristics of the LED device, heat causes an overload of the LED itself, and adversely affects devices on the PCB for driving the LED. Therefore, the display device needs a heat dissipating structure for quickly releasing heat generated from the LED light source to the outside in order to protect each component from heat. For example, a heat sink having an excellent heat- Or a heat-dissipating fan for forcibly discharging the heat.
However, since the heat dissipation structure as described above requires additional heat sinks or heat dissipation fans, the structure of the display device is complicated, and thus it is difficult to apply to a display device that is slim and light in weight.
In recent years, heat-radiating sheets of various materials for heat dissipation of high-heating element devices such as LED light sources have been developed. For example, Korea Patent No. 10-1240662 (Prior Art 1) discloses a heat sink using carbon nanotubes And Korean Patent No. 10-0755014 (Prior Art 2) disclose a 'graphite heat-radiating sheet'.
Generally, a heat dissipating member using a carbon nanotube exhibits a high thermal conductivity in the longitudinal direction (horizontal direction) due to the nature of the carbon nanotube, but hardly shows the thermal conductivity in the radial direction (vertical direction). In recent years, a carbon nanotube heat dissipating member capable of conducting heat in both the horizontal and vertical directions has been developed. However, it is very expensive to use as a heat dissipation sheet of a display device.
In order to rapidly emit heat generated from the LED light source in the display device, it is necessary to perform heat emission in various directions. However, currently, the heat radiation members of the prior art are not efficiently applied to a display device.
SUMMARY OF THE INVENTION It is an object of the present invention to provide a heat dissipation structure for an LED light source that quickly absorbs and emits heat generated from an LED light source.
It is another object of the present invention to provide a heat dissipation structure of an LED light source that can efficiently generate heat by transmitting heat generated from an LED light source in a horizontal and vertical direction, and at low cost.
According to an aspect of the present invention, there is provided an LED light source heat dissipation structure including: a light source fastening member having a seating surface on which an LED light source is mounted; A CNT sheet interposed between the LED light source and the seating surface and lapped along the outer surface of the coupling member including the seating surface; And a graphite resin formed on an outer surface of the CNT sheet outside the fastening member, wherein the CNT sheet absorbs heat of the LED light source and transmits the heat in a horizontal direction, and the graphite resin absorbs heat of the CNT sheet And is discharged to the outside.
In addition, the heat dissipating structure according to the second embodiment of the present invention comprises: a light source fastening member having a seating surface on which an LED light source is mounted; A CNT sheet interposed between the LED light source and the seating surface and lapped along an inner surface of the coupling member including the seating surface; And a graphite resin formed on an outer rear surface of the fastening member, wherein the CNT sheet absorbs heat of the LED light source and transmits the heat in a horizontal direction, and the graphite resin is transferred from the CNT sheet through the fastening member Absorbing the heat and discharging it to the outside.
Here, the LED light source is bonded to the surface of the CNT by an adhesive using a graphite resin.
The CNT sheet is characterized in that the CNT sheet is formed with a thickness of 1
Also, the graphite resin may be produced by reacting 10 to 30% by weight of graphite-sprayed non-polar solvent, 40 to 60% by weight of xylene or buthyl cellosolve and 20 to 30% by weight of silicone resin under an alkali catalyst And 45 to 75% by weight of the obtained silicone pressure-sensitive adhesive and 25 to 55% by weight of the thermally conductive filler.
The fastening member may be a back cover for supporting the display panel or an LED housing for supporting the LED light source.
A CNT sheet excellent in horizontal heat conduction characteristics and a graphite resin excellent in vertical thermal conduction characteristics are combined with each other to absorb and discharge heat of an LED light source, thereby efficiently emitting heat of a display device.
In addition, since the CNT sheet and the graphite resin are bonded to each other on the inner and outer surfaces of the back cover of the present invention, the manufacturing cost of the display device due to the heat dissipation structure can be reduced.
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an assembled cross-sectional view showing a schematic structure of a display device according to a conventional technique,
2 is a cross-sectional view illustrating a heat dissipation structure of an LED light source according to a first embodiment of the present invention,
3 is a cross-sectional view illustrating a heat dissipation structure of an LED light source according to a second embodiment of the present invention,
4 is a cross-sectional view illustrating a heat dissipation structure of an LED light source according to a third embodiment of the present invention, and Fig.
5 is a view illustrating heat dissipation characteristics of a conventional LED light source according to an embodiment of the present invention.
BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features and advantages of the present invention will be more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 2 is a cross-sectional view illustrating a heat dissipation structure of an LED light source according to a first embodiment of the present invention, and shows a main configuration of a light source of a display device.
First, a display device according to an embodiment of the present invention is a liquid crystal display device that employs a liquid crystal panel as a display panel, wherein a backlight unit for irradiating light of a surface light source is provided on the back surface of the liquid crystal panel, LED light sources (see FIG. 1). The light source unit of the display device has a structure in which the
The
The
The
The
A carbon nanotube sheet 130 (hereinafter referred to as "CNT sheet") for heat dissipation is joined to the outer surface of the
The
The
The
(W / mK)
As can be seen from Table 1 above, the aluminum plate exhibits the same thermal conductivity characteristics of approximately 200 to 300 W / mK for the vertical and horizontal directions without thermal conductivity, whereas the CNT sheet has a thermal conductivity of 1500 to 1800 W / mK Of the thermal conductivity. On the other hand, an adhesive (e.g., 5571 adhesive manufactured by 3M Company) that bonds the LED light source to the back cover exhibits a thermal conductivity of 2 W / mK in the horizontal and vertical directions, and contributes little to thermal conduction.
In the heat dissipation structure of the present invention, the
The layer of
Generally, graphite has a structure in which graphenes, which are sheet-like two-dimensional sheets formed in a hexagonal shape with carbon atoms, are laminated, have excellent thermal conductivity and excellent mechanical strength and can be used for various purposes. Sheet- It is also widely used as a heat dissipation material. In particular, unlike CNTs, graphite exhibits high thermal conductivity in the thickness direction (i.e., vertical direction) of the sheet.
The amount of radiant heat is controlled by the amount of graphite in the graphite resin (140). The graphite resin (140) of the present invention may be composed of 10 to 30% by weight of a graphite dispersion solution, 45 to 75% by weight of a silicone pressure-sensitive adhesive, and 15 to 45% by weight of a thermally conductive filler dispersion solution. When the graphite dispersion solution is mixed in an amount of less than 10% by weight, thermal conductivity and heat radiation function are deteriorated. When the graphite dispersion solution is added in an amount of more than 30% by weight, thermal conductivity and heat radiation function may be improved. If the thermally conductive filler dispersion solution is mixed in an amount of less than 15% by weight, the thermal conductivity is inhibited. If the amount is more than 45% by weight, thermal barrier properties may be impaired and the dense film may be weakened.
The graphite dispersion solution may be prepared by dispersing 25 to 35% by weight of graphite and 5 to 10% by weight of dispersant in 60 to 70% by weight of a nonpolar solvent, preferably 30 to 30% by weight of graphite and 5% by weight of dispersant % Is dispersed. Graphite improves thermal radiation and emissivity by thermal radiation.
The silicone pressure sensitive adhesive may be prepared by mixing 40 to 60% by weight of xylene or butyl cellosolve with 40 to 60% by weight of silicone resin. Xylene or butyl cellosolve functions to stably disperse silicone resin, graphite and heat conductive filler, and silicone resin functions to improve adhesion and high heat resistance of structures and fillers. When the drying speed is high, the denseness of the film is low, and when the drying speed is low, the denseness of the film is increased, but the hardening is delayed and the production yield is low. Xylene or butyl cellosolve disperses silicone resin, graphite, and heat conductive fillers stably to allow rapid curing while maintaining the compactness of the film. When xylene or butyl cellosolve is mixed at less than 40% by weight, the viscosity of the solution is high, which is disadvantageous to the coating. When the viscosity exceeds 60% by weight, the viscosity of the solution is low and precipitation of graphite or thermally conductive filler may occur during storage of the solution. It is difficult to control the thickness of the film.
The thermally conductive filler dispersion solution may be prepared by dispersing 25 to 35% by weight of a thermally conductive filler and 5 to 10% by weight of a dispersing agent in 60 to 70% by weight of a non-polar solvent, 30 wt% and 5 wt% of the dispersing agent are dispersed. The thermally conductive filler may be selected from the group consisting of Alumina, Boron Nitride, Talc, SiC, and mixtures thereof, and may be selected from the group consisting of Alumina, Boron Nitride, Talc, Function.
The
The
3 is a cross-sectional view illustrating a heat dissipation structure of an LED light source according to a second embodiment of the present invention. The heat dissipation structure of the LED light source according to the second embodiment of the present invention is such that the
The
Considering such characteristics of the
In the second embodiment, the heat generated from the LED
4 is a cross-sectional view illustrating a heat dissipation structure of an LED light source according to an embodiment of the present invention. The heat dissipation structure of the LED light source according to the third embodiment of the present invention is such that the
In general, an LED light source is bonded to a substrate or a back cover using a double-sided adhesive tape, and a material having a very low thermal conductivity is used as an adhesive tape used for bonding an LED light source. As shown in Table 1, '3M's 5571' used as an adhesive tape of the LED
However, since the graphite resin exhibits a high thermal conductivity with respect to the vertical direction, it can contribute greatly to the heat emission of the LED
Particularly, when the CNT sheet is laminated on the inner surface of the back cover in the process of fastening the
5 is a view illustrating heat dissipation characteristics of a conventional LED light source according to an embodiment of the present invention.
In the experiment of heat dissipation characteristics of the LED light source, the conventional technique was a back cover composed of only an aluminum plate (comparative example). In the present invention, a back cover (Experimental Example 1) in which a CNT sheet is laminated on the inner surface of an aluminum plate, (Example 2). The back cover was formed by laminating a CNT sheet and a graphite resin on the back surface. Further, in Experimental Example 1 and Experimental Example 2 of the present invention, the LED light source was bonded to the surface of the CNT sheet using graphite resin.
As shown in FIG. 5, the temperature change slightly increases in a state where about 100 seconds have elapsed after the emission of the LED light source. In a state where 180 seconds have elapsed after the light emission, the comparative example is about 75 deg. C, In Example 2, it can be confirmed that about 68 ° C is maintained.
Accordingly, it can be seen that the heat dissipation structure of the LED light source according to the embodiment of the present invention (Experimental Example 1 and Experimental Example 2) exhibits a high heat dissipation characteristic as compared with the conventional heat dissipation structure (Comparative Example) It can be seen that the heat dissipation effect is more excellent in Experiment 2 in which the sheet and the graphite resin are simultaneously applied.
Accordingly, the back cover for the heat dissipation of the LED light source in the display device according to the embodiment of the present invention can be manufactured at low cost by combining the CNT sheet and the graphite resin, and exhibits excellent heat radiation characteristics. In the description of the present invention, a heat dissipation structure in which the LED light source is directly fastened to the back cover is exemplified. However, the back cover corresponds to an example of the fastening member for fastening the LED light source. When the LED light source is fastened to the LED housing, A CNT sheet and a graphite resin may be applied.
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments.
110: back cover 120: LED light source
130: CNT sheet 140: graphite resin
150: graphite resin adhesive
Claims (6)
A light source fastening member having a seating surface on which an LED light source is seated;
A first heat dissipation layer interposed between the LED light source and the seating surface, the first heat dissipation layer of the CNT sheet being laminated along the outer surface of the coupling member including the seating surface;
A second heat dissipation layer of graphite resin formed on the outer surface of the CNT sheet outside the fastening member; And
And an adhesive layer of a graphite resin for bonding the LED light source to the CNT sheet on the seating surface,
Wherein the adhesive layer transfers heat generated from the LED light source to the first heat dissipation layer in a vertical direction and the first heat dissipation layer conducts heat transferred from the adhesive layer in a horizontal direction, And the heat absorbing layer is configured to absorb the heat of the heat dissipating layer and to discharge the heat to the outside in the vertical direction.
A light source securing member having a seating surface on which an inner surface of the LED light source is seated;
A first heat dissipation layer interposed between the LED light source and the seating surface, the first heat dissipation layer of the CNT sheet being laminated along the inner surface of the coupling member including the seating surface;
A second heat dissipation layer of graphite resin formed on the outer back surface of the fastening member; And
And an adhesive layer of a graphite resin for bonding the LED light source to the CNT sheet on the seating surface,
Wherein the adhesive layer transfers heat generated from the LED light source to the first heat dissipation layer in a vertical direction, and the first heat dissipation layer transmits the heat transferred from the adhesive layer in the horizontal direction to the fastening member, And the second heat dissipation layer absorbs the heat of the coupling member and emits the heat to the outside in the vertical direction.
Wherein the CNTs having a diameter of 1 to 50 nm and a length of 1 to 50 um are dispersed in a thickness of 1 to 200 um.
A silicone pressure sensitive adhesive obtained by reacting 10 to 30% by weight of a nonpolar solvent in which graphite has been sprayed, 40 to 60% by weight of xylene or butyl cellosolve and 40 to 60% by weight of a silicone resin under an alkali catalyst, And 15 to 45% by weight of a thermally conductive filler. The LED light source heat dissipation structure of the display device according to claim 1, wherein the thermally conductive adhesive is a thermally conductive adhesive.
Wherein the LED housing is an LED housing supporting a back cover or LED light source for supporting the display panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020160147910A KR101851761B1 (en) | 2016-11-08 | 2016-11-08 | Heat conductivity structure of LED for display apparatus |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020160147910A KR101851761B1 (en) | 2016-11-08 | 2016-11-08 | Heat conductivity structure of LED for display apparatus |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200130555A (en) | 2019-05-09 | 2020-11-19 | 희성전자 주식회사 | Heat dissipating structure for display |
| KR20200143543A (en) | 2019-06-13 | 2020-12-24 | 희성전자 주식회사 | Fixing structure of light guide plate using supporter |
| KR20210016157A (en) | 2019-08-01 | 2021-02-15 | 희성전자 주식회사 | Heat dissipating structure for display |
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- 2016-11-08 KR KR1020160147910A patent/KR101851761B1/en active IP Right Grant
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| KR100755014B1 (en) | 2006-10-25 | 2007-09-06 | 실리콘밸리(주) | The manufacturing method of heat-conductive adhesive graphite sheet and graphite sheet |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200130555A (en) | 2019-05-09 | 2020-11-19 | 희성전자 주식회사 | Heat dissipating structure for display |
| KR20200143543A (en) | 2019-06-13 | 2020-12-24 | 희성전자 주식회사 | Fixing structure of light guide plate using supporter |
| KR20210016157A (en) | 2019-08-01 | 2021-02-15 | 희성전자 주식회사 | Heat dissipating structure for display |
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