JP2010021156A - Set-type led lamp - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a set-type LED lamp high in heat radiating property and waterproof. <P>SOLUTION: The invention provides the set type lamp in which many LEDs 1 are protruded from the front surface of a substrate 2, the front surface side of the LEDs 1 is covered with a transparent cover 3 and a heat radiation plate 8 is attached to the back surface side of the substrate 2. A heat radiation layer 7 made of a heat radiative and waterproof resin and having an adhering function to adhere to an inner surface of a peripheral wall 3a of the cover 3 and the substrate 2 is interposed between the substrate 2 and the heat radiation plate 8 to fix together the substrate 2 and the heat radiation plate 8. A waterproof film 11 is formed by coating the front and back surfaces of the substrate 2 with a heatproof and waterproof resin in a state that the LEDs 1 are mounted and wiring is connected. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a collective LED lamp used for outdoor spot lighting, signboard lighting, building wall lighting, garden lights, work lights (indoors and outdoors), fish collection lights, underwater lighting, and the like.

  Conventional collective lamps in which a large number of LEDs are arranged on a substrate, as disclosed in Patent Document 1, are often required only for visibility of traffic lights, etc., and there are few that can be lit for a long time as the original illumination. It was.

  In addition, the lighting of traffic lights is generally considered waterproof, but it is installed in a well-ventilated place, and there is little problem with heat dissipation in terms of structure. It is known to be mounted on the surface.

JP-A-8-31221

However, when using a collective LED lamp as the original illumination, it is necessary to collect and mount a considerable number of LEDs on a single substrate, and to reduce the thickness (or depth) as much as possible. Since the formation in a plate shape is versatile due to the attachment position and the like, heat dissipation of the substrate is required.
Especially, there is a problem that it is difficult to radiate heat from outdoor lighting that requires waterproofness.
The present invention provides a collective LED lamp having excellent heat dissipation and waterproofness.

  In the present invention for solving the above problems, first, a large number of LEDs 1 project from the surface of the substrate 2, the surface side of the LEDs 1 is covered with a translucent cover 3, and heat is radiated to the back side of the substrate 2. The collective lamp equipped with the plate 8 is made of a resin having heat dissipation and waterproof properties between the substrate 2 and the heat radiating plate 8, and has a bonding function to adhere to the inner surface of the peripheral wall 3 a of the cover 3 and the substrate 2. The substrate 2 and the heat radiating plate 8 are fixed with a heat radiating layer 7 interposed therebetween.

  Second, the resin is a mixture of a heat-dissipating silicone resin and a waterproof silicone resin.

  Third, the waterproof film 11 is formed by coating the front and back surfaces of the substrate 2 with a heat-resistant waterproof resin when the LED 1 is mounted and connected.

  Fourthly, the cover 3 has a dish shape or a box shape provided with the peripheral wall 3a, and is characterized in that the substrate 2 and the heat dissipation layer 7 are accommodated in the edge of the peripheral wall 3a.

  Fifth, it is characterized in that a notch-shaped step portion 4 is formed on the inner end side of the peripheral wall 3a of the cover 3, the substrate 2 is accommodated and fixed in the step portion 4, and a heat radiation layer 7 is formed. Yes.

  Sixth, a plurality of locking projections 6 are formed on the inner peripheral surface of the stepped portion 4 to contact the peripheral end of the substrate 2 and lock the fitting state when the substrate 2 is inserted into the stepped portion 4. It is characterized by.

  The collective lamp of the present invention configured as described above can greatly reduce the temperature of the substrate surface by the heat radiation of the heat dissipation plate via the heat dissipation layer on the back surface of the substrate, and can extend the life of the LED. The adhesive property of the heat radiation layer increases the waterproof sealing property, and the fixing property between the translucent cover and the substrate is improved. Further, by providing the heat dissipation layer with an adhesive function to the cover and the substrate side, the entire collective lamp can be configured without using a fixing tool such as a screw, so that a hole making operation and the like are not required.

It is a top view showing the surface of the lamp | ramp of this invention. It is front sectional drawing of the lamp | ramp of this invention. It is side surface sectional drawing of the lamp | ramp of this invention. It is a partial expanded side surface sectional view of the lamp | ramp of this invention.

  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below. The drawings all represent one embodiment of the collective LED lamp of the present invention, FIG. 1 is a lamp arrangement surface (surface), FIG. 2 is a front sectional view, and FIG. Represents a side section, and FIG. 4 represents a partially enlarged front section.

  In this example, the entire lamp forms a rectangular parallelepiped of about 150 × 150 × 40, and a glass epoxy resin (not shown) with a large number (18 × 18) of LEDs 1 mounted on the front surface and printed wiring on the rear surface. A substrate 2 made of metal is accommodated and fixed in the edge of the peripheral wall of a transparent acrylic resin box-shaped cover 3. A pressure release and drainage hole 5 in the cover 3 is provided at a position which becomes lower when the cover 3 is installed.

  A notch-shaped step portion 4 is formed over the entire inner periphery of the opening end of the peripheral wall of the cover 3, and the substrate 2 is accommodated in the step portion 4 via a slight clearance. When the substrate 2 is pressed and inserted into the stepped portion 4, it enters below the spherical engaging projections 6 formed of small projections projecting at a plurality of locations on the inner periphery of each side of the stepped portion 4 and is fixed. Thus, warping of the substrate 2 is prevented.

  On the back side of the substrate 2, a resin 3 having a thickness of about 2 mm is formed with a resin 3 having an adhesive force with the cover 3 and the substrate 2 side mixed with a silicone resin with excellent heat dissipation and thermal resistance. The heat dissipation layer 7 is formed. The heat radiation layer 7 is adhered to the back surface of the substrate 2 and also penetrates and adheres to the clearance portion between the outer periphery and the inner periphery of the step portion 4, thereby fixing the substrate 2 and improving the waterproofness in the cover 3.

  Further, a bottom surface of a heat sink (heat radiating plate) 8 made of an aluminum extrusion molding material or the like is bonded and fixed to the back surface of the heat radiating layer 7 in a pressed state, and the heat radiating layer 7 conducts heat of the substrate 2 overheated by the LED with high heat conduction. Is conducted to the heat sink 8 to promote heat dissipation. Bolt holes 9 are formed in the side surfaces of the heat sink 8 for fastening a lamp mounting bracket (not shown).

  The substrate 2 has a waterproof film 11 that is pre-coated with a waterproof paint or adhesive having heat resistance and water resistance on both the front side and the back side, with the LED 1 mounted and connected to the printed wiring on the back side. Is formed, so that water from the base end portion of the LED, the soldered portion on the back surface of the substrate, and the terminal portion is prevented. Reference numeral 12 denotes a wiring hole into the cover 3.

  In this embodiment, the average LED power consumption is 19.6 W under DC 11 to 13.5 V, average 1.6 A, but the surface temperature of the substrate 2 when the heat dissipation layer 7 is not provided is 80 ° C. On the other hand, when the heat dissipation layer 7 was provided, the temperature could be lowered to about 50 ° C.

1 LED
2 Substrate 3 Cover 3a Peripheral wall 4 Step part 6 Locking projection 7 Heat radiation layer 8 Heat radiation plate

Claims (6)

  A number of LEDs (1) are projected from the surface of the substrate (2), the surface side of the LEDs (1) is covered with a translucent cover (3), and a heat sink (8 ), A heat sink and a waterproof resin between the substrate (2) and the heat radiating plate (8), and the inner surface of the peripheral wall (3a) of the cover (3) and the substrate (2). A collective type LED lamp in which a substrate (2) and a heat radiating plate (8) are fixed with a heat radiating layer (7) having an adhesive function attached to the substrate.   2. The collective LED lamp according to claim 1, wherein the resin is a mixture of a heat-dissipating silicone resin and a waterproof silicone resin.   The collective LED lamp according to claim 1 or 2, wherein a waterproof film (11) is formed by coating a heat-resistant waterproof resin on the front and back surfaces of the substrate (2) when the LED (1) is mounted and connected.   The cover (3) is dish-shaped or box-shaped with a peripheral wall (3a), and the substrate (2) and the heat dissipation layer (7) are accommodated in the edge of the peripheral wall (3a). 3 collective LED lamps.   A notch-shaped step portion (4) is formed on the inner end side of the peripheral wall (3a) of the cover (3), and the substrate (2) is accommodated and fixed in the step portion (4) and the heat radiation layer (7) is provided. The collective LED lamp according to claim 4 formed.   A plurality of locking protrusions that contact the peripheral edge of the substrate (2) and lock the fitting state when the substrate (2) is inserted into the step (4) on the inner peripheral surface of the step (4) The collective LED lamp according to claim 5, wherein (6) is formed.

Images