KR20080001733U - Set-type led lamp - Google Patents

Set-type led lamp Download PDF

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Publication number
KR20080001733U
KR20080001733U KR2020070018786U KR20070018786U KR20080001733U KR 20080001733 U KR20080001733 U KR 20080001733U KR 2020070018786 U KR2020070018786 U KR 2020070018786U KR 20070018786 U KR20070018786 U KR 20070018786U KR 20080001733 U KR20080001733 U KR 20080001733U
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South Korea
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substrate
led lamp
heat
heat dissipation
collective
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KR2020070018786U
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Korean (ko)
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슌지 마쓰모토
šœ지 마쓰모토
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히카리 덴키 츠신 시스템 컴퍼니 리미티드
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Priority to KR2020070018786U priority Critical patent/KR20080001733U/en
Publication of KR20080001733U publication Critical patent/KR20080001733U/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/04—Provision of filling media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

본 고안은 방열성 및 방수성의 높은 집합형 LED 램프를 제공한다.The present invention provides a high heat dissipation and waterproof high aggregation LED lamp.

본 고안은 기판(2)의 표면에 다수의 LED(l)가 돌설되고, 그 LED(l)의 표면측을 투광성의 커버(3)로 덮으며, 기판(2)의 배면 측에 방열판(8)을 장착한 집합형 램프로서, 기판(2)과 방열판(8) 사이에 방열성 및 방수성을 갖춘 수지로 된 방열층(7)을 개재시켜 기판(2)과 방열판(8)을 고착하고 있다.According to the present invention, a plurality of LEDs 1 protrude from the surface of the substrate 2, the surface side of the LED 1 is covered with a translucent cover 3, and the heat sink 8 is provided on the back side of the substrate 2. ), And the substrate 2 and the heat sink 8 are fixed between the substrate 2 and the heat sink 8 via a heat dissipation layer 7 made of a resin having heat dissipation and water resistance.

또 LED(l)의 장착 및 배선 접속 상태에 있어 기판(2)의 표면 및 이면에 내열성 방수 수지를 코팅한 방수막(11)을 형성한다.Further, in the mounting and wiring connection state of the LED 1, a waterproof film 11 coated with a heat resistant waterproof resin is formed on the front and rear surfaces of the substrate 2.

Description

집합형 ＬＥＤ 램프{SET-TYPE LED LAMP}Collective LED Lamps {SET-TYPE LED LAMP}

본 고안은 옥외 스폿 조명, 간판 조명, 건물의 벽조명, 정원등, 작업등불(실내외), 집어등, 수중 조명등에 이용되는 집합형 LED 램프에 관한 것이다.The present invention relates to a collective type LED lamp used for outdoor spot lighting, signage lighting, building wall lighting, garden lights, work lights (indoor and outdoor), fishing lamps, and underwater lights.

종래 다수의 LED를 기판상에 배설한 집합형 램프로서는 특허 문헌 1에 나타난 바와 같이, 신호기 등의 시인성만을 요구하는 것이 대부분이고, 본래의 조명으로서는 장시간 점등시키는 것은 적었다.As a collective type lamp in which a large number of LEDs are conventionally disposed on a substrate, as shown in Patent Document 1, most of them require only visibility such as a signal signal.

또 신호기의 조명은 일반적으로 방수성은 중시되지만, 통풍이 좋은 장소에 설치되어 구조상 방열성이 문제가 되는 것도 적고, 기판 자체의 방열에는 일반적으로 히트 싱크가 이면(裏面) 전체 또는 표면에 부분적으로 장착되는 것이 공지되어 있다.In addition, the lighting of the signal is generally emphasized to be waterproof, but it is installed in a well-ventilated place, so that the heat dissipation is not a problem in structure. It is known.

[특허 문헌 1] [Patent Document 1]

특개평 8-31221 호Japanese Patent Application Laid-Open No. 8-31221

그러나 LED의 집합형 램프를 본래의 조명으로서 사용하는 경우, 1매의 기판에 상당수의 LED를 집합시켜 장착할 필요가 있는 것 외에 가능한 한 두께 (또는 깊이)를 작게 해 집합형 램프 자체를 플레이트 형상으로 형성하는 것이 설치 위치 등의 관계로 범용성이 있기 때문에, 기판의 방열성이 요구된다.However, when using LED collective lamps as the original lighting, it is necessary to mount a large number of LEDs on a single substrate and mount them, and make the collective lamp itself a plate shape by making the thickness (or depth) as small as possible. Since it is versatile in relation to the installation position etc., the heat dissipation of a board | substrate is calculated | required.

특히 옥외 조명과 같이 방수성이 요구되는 것은 방열이 어렵다고 하는 문제가 있다.In particular, the need for waterproofing, such as outdoor lighting has a problem that heat dissipation is difficult.

본 고안은 방열성, 방수성이 모두 뛰어난 집합형 LED 램프를 제공하는 것이다.The present invention is to provide a collective type LED lamp excellent in both heat dissipation and waterproof.

상기 과제를 해결하기 위한 본 고안은, 제 1수단으로, 기판(2)의 표면에 다수의 LED(1)를 돌설하고, 그 LED(1)의 표면 측을 투광성의 커버(3)로 가리며, 기판(2)의 배후 측에 방열판(8)을 장착한 집합형 램프에 있어서, 기판(2)과 방열판(8)의 사이에 방열 및 방수성을 갖춘 수지로 된 방열층(7)을 개재시켜 기판(2)과 방열판(8)을 고착한 것을 특징으로 한다.The present invention for solving the above problems, as a first means, protrudes a plurality of LED (1) on the surface of the substrate 2, covering the surface side of the LED (1) with a transparent cover (3) In the collective lamp in which the heat sink 8 is attached to the rear side of the board | substrate 2, between the board | substrate 2 and the heat sink 8, the heat dissipation layer 7 which consists of resin with heat dissipation and waterproofness is interposed. The substrate 2 and the heat sink 8 are fixed.

제 2수단으로, LED(1)의 장착 및 배선접속 상태에 있어서 기판(2)의 표면 및 이면에 내열성 방수 수지를 코팅해 방수막(11)을 형성하게 되는 것을 특징으로 한다.As a second means, in the mounting and wiring connection state of the LED 1, the waterproof film 11 is formed by coating a heat resistant waterproof resin on the front and rear surfaces of the substrate 2.

제 3수단으로, 수지가 방열성 실리콘 수지와 방수성 실리콘 수지를 혼합하여 서 된 것을 특징으로 한다.As a third means, the resin is characterized by mixing a heat dissipating silicone resin and a water resistant silicone resin.

제 4수단으로, 커버(3)가 둘레 벽(3a)을 갖춘 접시 모양 또는 상자 모양이고, 둘레 벽(3a)의 끝 가장자리 내에 기판(2) 및 방열층(7)이 수용된 것을 특징으로 한다.As a fourth means, the cover 3 is characterized in that it is dish-shaped or box-shaped with a circumferential wall 3a, and the substrate 2 and the heat dissipating layer 7 are accommodated in the end edge of the circumferential wall 3a.

제 5수단으로, 커버(3)의 둘레 벽(3a) 내측 끝 부분에 절결 상태(잘라서 구부릴 수 있는 형태)의 단부(4)를 형성하고, 그 단부(4) 내에 기판(2)을 수용하여 고정함과 함께 방열층(7)을 형성하게 된 것을 특징으로 한다.As a fifth means, an end portion 4 of the cut-out state (cuttable shape) is formed at the inner end of the circumferential wall 3a of the cover 3, and the substrate 2 is received in the end portion 4 by Along with fixing it is characterized in that to form a heat dissipation layer (7).

제 6수단으로, 방열층(7)이 커버(3)의 둘레 벽(3a) 내면과 기판(2)을 부착하는 접착 기능이 구비된 것을 특징으로 한다.As a sixth means, the heat dissipation layer 7 is provided with an adhesive function for attaching the inner surface of the circumferential wall 3a of the cover 3 to the substrate 2.

제 7수단으로, 단부(4)의 내주면에, 기판(2)을 단부(4) 내에 삽입했을 때 기판(2)의 둘레 끝에 서로 접하여 감합 상태를 계지하는 복수의 걸림턱(6)이 형성된 것을 특징으로 한다. In the seventh means, when the substrate 2 is inserted into the end portion 4, the plurality of locking jaws 6 contacting each other at the circumferential ends of the substrate 2 and engaging the mating state are formed on the inner circumferential surface of the end portion 4. It features.

이상과 같이 구성되는 본 고안의 집합형 램프는, 기판 배후의 방열층을 개입시킨 방열판의 방열에 의해 기판 면의 온도를 큰 폭으로 내릴 수가 있어 LED의 수명을 연장할 수 있고 그 외에 방열층의 접착 작용에 의해 방수의 기밀(seal)성도 높아져, 투광성의 커버와 기판과의 고정성도 좋아진다. 또 방열층에 커버 및 기판측의 접착 기능을 갖게 하는 것으로 집합형 램프 전체를 나사 등의 고정구를 이용하지 않고 구성할 수가 있으므로 구멍 뚫기 작업등도 불필요하게 된다.The integrated lamp of the present invention configured as described above can greatly reduce the temperature of the surface of the substrate by heat dissipation of the heat sink through the heat dissipation layer behind the substrate, which can prolong the life of the LED, and By the adhesive action, the waterproof sealability is also increased, and the fixing property of the transparent cover and the substrate is also improved. In addition, by providing the cover and substrate side bonding functions in the heat dissipation layer, the entire assembly type lamp can be configured without using fasteners such as screws, so that a hole drilling operation or the like is also unnecessary.

이하 도시된 본 고안의 실시 형태에 대해 설명하면, 도면은 모두 본 고안의 집합형 LED 램프의 일실시 형태를 나타내고, 도 1은 램프 배치면(표면)을, 도 2는 정면 단면을, 도 3은 측면 단면을, 도 4는 부분 확대 정면 단면을 각각 나타낸다.DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention shown in the drawings, all of the drawings show an embodiment of the collective LED lamp of the present invention, FIG. 1 is a lamp arrangement surface (surface), FIG. 4 shows a side cross section, and FIG. 4 shows a partially enlarged front cross section.

실시예에서 램프 전체는 150 × 150 × 40 정도의 직방체를 형성하고 있고, 표면에 다수(18 × 18개)의 LED(1)가 장착되며, 이면에 프린트 배선(도시하지 않는다)된 글라스에폭시제의 수지제의 기판(2)이 투명한 아크릴 수지제의 상자 모양의 커버(3)의 둘레 벽 끝 가장자리 내에 수용 고정 있다. 커버(3)의 설치시 하측 방면의 위치에는, 커버(3) 내의 압력 제거 및 물기 제거구멍(5)이 설치되어 있다.In the embodiment, the entire lamp forms a rectangular parallelepiped of about 150 × 150 × 40, and a plurality of (18 × 18) LEDs 1 are mounted on a surface thereof, and a printed epoxy agent (not shown) is printed on the back side of the lamp. The resin substrate 2 is housed and fixed in the peripheral wall end edge of the transparent acrylic resin box-shaped cover 3. In the position of the lower side at the time of installation of the cover 3, the pressure removal and the water removal hole 5 in the cover 3 are provided.

커버(3)의 둘레 벽의 개구(개방된 구간) 끝 부분 내측에 절결 상태(잘라서 구부릴 수 있는 형태와 같이 절개된 상태)의 단부(4)가 사방에 걸쳐서 형성되고 상기 단부(4) 내에 약간의 클리어런스(clearance)를 개입시켜 기판(2)을 수용하고 있다. 상기 단부(4)에 기판(2)이 강제적으로 삽입되면, 단부(4)의 각 변의 내주 복수 곳에 돌설된 작은 돌기로 이루어진 구면 상태의 계합 돌기(6)의 하부에 들어가 계지 고정되어 기판(2)이 과다하게 휘는 것이 방지된다.Inside the opening (open section) end of the circumferential wall of the cover 3, an end 4 of the cutout state (a state cut out like a bendable form) is formed all around and slightly within the end 4. The substrate 2 is accommodated through the clearance of. When the board | substrate 2 is forcibly inserted in the said end part 4, it locks and locks in the lower part of the engagement protrusion 6 of the spherical state which consists of the small protrusion which protruded in the inner periphery of several sides of the edge part 4, and the board | substrate 2 ) Excessive bending is prevented.

기판(2)의 배후 측에는 방열성(열전도성)이 풍부한 실리콘 수지와 방수성이 뛰어난 실리콘 수지를 혼합한 커버(3) 및 기판(2)측과 접착력이 있는 수지가 2mm 정도의 두께로, 몰드 등에 의해 충전 있어 방열층(7)이 형성되어 있다. 상기 방열층(7)은 기판(2)의 배면에 접착함과 동시에 그 외주와 단부(4) 내주의 클리어런스(clearance) 부분에도 침입하여 접착하기 때문에 기판(2)을 고정한 커버(3) 내의 방수성도 높인다.On the back side of the substrate 2, a cover 3 mixed with a silicone resin rich in heat dissipation (heat conductivity) and a silicone resin excellent in waterproofing and a resin having adhesive strength with the substrate 2 side are formed at a thickness of about 2 mm. The heat dissipation layer 7 is formed by charging. The heat dissipating layer 7 adheres to the back surface of the substrate 2 and also penetrates and adheres to a clearance portion of the outer circumference and the end 4 inner circumference, and thus is waterproof in the cover 3 fixing the substrate 2. Also raises.

게다가 상기 방열층(7)의 배면에는, 알루미늄 압출 성형재 등으로 된 히트 싱크(방열판)(8)의 저면이 압착되어 접한 상태로 접착 고정되고, 방열층(7)은 LED에 의해 과열된 기판(2)의 열을 높은 열전도에 의해 히트 싱크(8)에 전도하며, 방열을 촉진한다. 히트 싱크(8)의 측면에는 램프를 고정하는 용도의 금속구(도시하지 않는다)를 장착하기 위한 볼트공(9)이 천설되어 있다.In addition, the bottom surface of the heat sink (heat sink) 8 made of aluminum extrusion molding material or the like is adhesively fixed to the back surface of the heat dissipation layer 7 in a state in which the heat dissipation layer 7 is overheated by the LED. The heat of (2) is conducted to the heat sink 8 by high thermal conductivity, which promotes heat dissipation. A bolt hole 9 is installed on the side surface of the heat sink 8 for attaching a metal ball (not shown) for fixing a lamp.

또 상기 기판(2)은, LED(1)를 장착하는 한편 그 배면에서 프린트 배선에 접속된 상태이고, 표면측 및 이면측 모두 내열성·내수성을 갖춘 방수 도료 또는 접착제로, 미리 코팅된 방수막(11)이 형성되고 있어서, LED의 기단부나 기판 배면의 땜납 부분이나 단자 부분으로 물이 침투하는 것이 방지된다. 12는 커버(3) 내에의 배선 구멍이다.The substrate 2 is a state in which the LED 1 is mounted and connected to the printed wirings on the back thereof, and both the front side and the back side are coated with a waterproof coating or adhesive having heat resistance and water resistance. 11) is formed, so that water is prevented from penetrating into the proximal end of the LED and the solder portion or the terminal portion of the substrate back surface. 12 is a wiring hole in the cover 3.

본 실시 형태에서는 DC 11~13. 5V, 평균 1.6A 하에서 LED 전체의 소비 전력은 평균 19.6W의 것이 사용되고 있지만, 상기 방열층(7)이 없는 경우의 기판(2) 표면 온도 80℃에 대해, 방열층(7)을 설치한 것에서는 약 50℃까지 저하시킬 수 있다.In this embodiment, DC 11-13. The average power consumption of the entire LED under 5 V and 1.6 A average is 19.6 W, but the heat dissipation layer 7 is provided with respect to the substrate 2 surface temperature of 80 ° C. when the heat dissipation layer 7 is not present. Can be lowered to about 50 ° C.

도 1은 본 고안의 램프의 표면을 나타내는 평면도이다.1 is a plan view showing the surface of the lamp of the present invention.

도 2는 본 고안의 램프의 정면 단면도이다.2 is a front sectional view of the lamp of the present invention.

도 3은 본 고안의 램프의 측면 단면도이다.3 is a side cross-sectional view of the lamp of the present invention.

도 4는 본 고안의 램프의 부분 확대 측면 단면도이다.4 is a partially enlarged side cross-sectional view of the lamp of the present invention.

[ 부호의 설명 ][Description of the Code]

1... LED1 ... LED

2... 기판2 ... Substrate

3... 커버3 ... cover

3a... 둘레 벽3a ... perimeter wall

4... 단부4 ... end

6... 걸림턱6 ... Jams

7... 방열층7 ... heat sink

8... 방열판8 ... heat sink

Claims (7)

기판(2)의 표면에 다수의 LED(1)를 돌설하고, 상기 LED(1)의 표면측을 투광성의 커버(3)로 덮고, 기판(2)의 배면측에 방열판(8)을 장착한 집합형 램프에 있어서, The plurality of LEDs 1 protrude from the surface of the substrate 2, the surface side of the LED 1 is covered with a translucent cover 3, and the heat sink 8 is mounted on the back side of the substrate 2. In the collective lamp, 기판(2)과 방열판(8) 사이에 방열성 및 방수성을 갖춘 수지로 이루어진 방열층(7)이 개재되어 기판(2)과 방열판(8)을 고착한 것을 특징으로 하는 집합형 LED 램프.An integrated LED lamp comprising a substrate (2) and a heat sink (8) secured between a substrate (2) and a heat sink (8) with a heat dissipation layer (7) made of a resin having heat dissipation and water resistance. 제 1항에 있어서, The method of claim 1, LED(1)의 장착 및 배선접속 상태에 있어 기판(2)의 표면 및 이면에 내열성 방수 수지를 코팅한 방수막(11)이 형성된 것을 특징으로 하는 집합형 LED 램프.A collective type LED lamp, characterized in that a waterproof film (11) coated with a heat resistant waterproof resin is formed on the front and rear surfaces of the substrate (2) in the mounting and wiring connection state of the LED (1). 제 1항 또는 제 2항에 있어서, The method according to claim 1 or 2, 수지가 방열성 실리콘 수지와 방수성 실리콘 수지가 혼합된 것을 특징으로 하는 집합형 LED 램프.A collective type LED lamp, wherein the resin is a heat-dissipating silicone resin and a water-resistant silicone resin. 제 1항 내지 제 3항 중 어느 한 항에 있어서, The method according to any one of claims 1 to 3, 커버(3)가 둘레 벽(3a)을 갖춘 접시 모양 또는 상자 모양이고, 둘레 벽(3a)의 끝 가장자리 내에 기판(2) 및 방열층(7)이 수용된 것을 특징으로 하는 집합형 LED 램프.A collective type LED lamp, characterized in that the cover (3) is dish-shaped or box-shaped with a circumferential wall (3a), and the substrate (2) and the heat dissipating layer (7) are housed in the end edge of the circumferential wall (3a). 제 4항에 있어서, The method of claim 4, wherein 커버(3)의 둘레 벽(3a) 내측 끝 부분에 절결 상태의 단부(4)를 형성하고, 그 단부(4) 내에 기판(2)을 수용하여 고정함과 함께 방열층(7)을 형성한 것을 특징으로 하는 집합형 LED 램프.The end portion 4 of the notched state is formed at the inner end portion of the circumferential wall 3a of the cover 3, the substrate 2 is accommodated in the end portion 4, and the heat dissipation layer 7 is formed. Collective LED lamp, characterized in that. 제 4항 또는 제 5항에 있어서, The method according to claim 4 or 5, 방열층(7)이 커버(3)의 둘레 벽(3a) 내면과 기판(2)을 부착하는 접착 기능이 구비된 것을 특징으로 하는 집합형 LED 램프.Collective LED lamp, characterized in that the heat dissipation layer (7) is provided with an adhesive function for attaching the inner surface of the circumferential wall (3a) of the cover (3) and the substrate (2). 제 5항에 있어서, The method of claim 5, 단부(4)의 내주면에, 기판(2)을 단부(4) 내에 삽입했을 때 기판(2)의 둘레 끝에 서로 접하여 감합 상태를 유지하는 복수의 걸림턱(6)이 형성된 것을 특징으로 하는 집합형 LED 램프.On the inner circumferential surface of the end 4, when the substrate 2 is inserted into the end 4, a plurality of engaging jaws 6 are formed in contact with each other at the circumferential end of the substrate 2 to maintain a fitted state. LED lamp.
KR2020070018786U 2006-12-07 2007-11-22 Set-type led lamp KR20080001733U (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100910634B1 (en) * 2008-07-04 2009-08-05 주식회사 엠시드텍 Waterproof led light
WO2010005155A1 (en) * 2008-07-07 2010-01-14 코스텍알 주식회사 Lighting apparatus using led
KR100949699B1 (en) * 2009-12-04 2010-03-29 엔 하이테크 주식회사 Fluorescent lamp of led
KR101331479B1 (en) * 2012-02-29 2013-11-21 주식회사 미강조명 Light-emitting diode lighting apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100910634B1 (en) * 2008-07-04 2009-08-05 주식회사 엠시드텍 Waterproof led light
WO2010005155A1 (en) * 2008-07-07 2010-01-14 코스텍알 주식회사 Lighting apparatus using led
KR100949699B1 (en) * 2009-12-04 2010-03-29 엔 하이테크 주식회사 Fluorescent lamp of led
KR101331479B1 (en) * 2012-02-29 2013-11-21 주식회사 미강조명 Light-emitting diode lighting apparatus

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