JP4505543B2 - Collective LED lamp - Google Patents

Collective LED lamp Download PDF

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JP4505543B2
JP4505543B2 JP2009246947A JP2009246947A JP4505543B2 JP 4505543 B2 JP4505543 B2 JP 4505543B2 JP 2009246947 A JP2009246947 A JP 2009246947A JP 2009246947 A JP2009246947 A JP 2009246947A JP 4505543 B2 JP4505543 B2 JP 4505543B2
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collective
led lamp
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JP2010021156A (en
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俊次 松本
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光電気通信システム株式会社
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  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Securing Globes, Refractors, Reflectors Or The Like (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Description

この発明は屋外スポット照明、看板照明、建物の壁照明、庭園灯、作業灯（室内外）、集魚灯、水中照明等に用いられる集合型ＬＥＤランプに関する。   The present invention relates to a collective LED lamp used for outdoor spot lighting, signboard lighting, building wall lighting, garden lights, work lights (indoors and outdoors), fish collection lights, underwater lighting, and the like.

従来多数のＬＥＤを基板上に配設した集合型ランプとしては特許文献１に示されるように、信号機等の視認性のみが求められるものが多く、本来の照明としては長時間点灯させるものは少なかった。   Conventional collective lamps in which a large number of LEDs are arranged on a substrate, as disclosed in Patent Document 1, are often required only for visibility of traffic lights, etc., and there are few that can be lit for a long time as the original illumination. It was.

また信号機の照明は一般に防水性は重視されるが、風通しが良い場所に設置され、構造上も放熱性が問題となることも少なく、基板自体の放熱には一般にヒートシンクが裏面全体又は表面に部分的に装着されることが公知である。   In addition, the lighting of traffic lights is generally considered waterproof, but it is installed in a well-ventilated place, and there is little problem with heat dissipation in terms of structure. It is known to be mounted on the surface.

特開平８−３１２２１号JP-A-8-31221

しかしＬＥＤの集合型ランプを本来の照明として使用する場合、１枚の基板に相当数のＬＥＤを集合させて装着する必要があるほか、できるだけ厚み（又は奥行き）を小さくして集合型ランプ自体をプレート状に形成することが取付位置等の関係で汎用性があるため、基板の放熱性が求められる。
特に屋外照明のように防水性を求められるものは放熱が難しいという問題がある。
この発明は放熱性、防水性共に優れた集合型ＬＥＤランプを提供するものである。 However, when using a collective lamp of LEDs as the original illumination, it is necessary to collect and mount a considerable number of LEDs on a single substrate, and to reduce the thickness (or depth) as much as possible to reduce the collective lamp itself. Since the formation in a plate shape is versatile due to the attachment position and the like, heat dissipation of the substrate is required.
Especially, there is a problem that it is difficult to radiate heat from outdoor lighting that requires waterproofness.
The present invention provides a collective LED lamp having excellent heat dissipation and waterproofness.

上記課題を解決するための本発明は、第１に、基板２の表面に多数のＬＥＤ１を突設し、該ＬＥＤ１の表面側を透光性のカバー３で覆い、基板２の背面側に放熱板８を装着した集合型ランプにおいて、基板２と放熱板８との間に放熱性及び防水性を備えた樹脂からなり、カバー３の周壁３ａ内面と基板２とに付着する接着機能を備えてなる放熱層７を介在させて基板２と放熱板８を固着したことを特徴としている。   In the present invention for solving the above problems, first, a large number of LEDs 1 project from the surface of the substrate 2, the surface side of the LEDs 1 is covered with a translucent cover 3, and heat is radiated to the back side of the substrate 2. The collective lamp equipped with the plate 8 is made of a resin having heat dissipation and waterproof properties between the substrate 2 and the heat radiating plate 8, and has a bonding function to adhere to the inner surface of the peripheral wall 3 a of the cover 3 and the substrate 2. The substrate 2 and the heat radiating plate 8 are fixed with the heat radiating layer 7 interposed therebetween.

第２に、樹脂が放熱性シリコン樹脂と防水性シリコン樹脂を混合したものであることを特徴としている。   Second, the resin is a mixture of a heat-dissipating silicone resin and a waterproof silicone resin.

第３に、ＬＥＤ１の装着及び配線接続状態において基板２の表面及び裏面に耐熱性防水樹脂をコーティングして防水膜１１を形成してなることを特徴としている。   Third, the waterproof film 11 is formed by coating the front and back surfaces of the substrate 2 with a heat-resistant waterproof resin when the LED 1 is mounted and connected.

第４に、カバー３が周壁３ａを備えた皿状又は箱状であり、周壁３ａの端縁内に基板２及び放熱層７を収容してなることを特徴としている。   Fourthly, the cover 3 has a dish shape or a box shape provided with the peripheral wall 3a, and is characterized in that the substrate 2 and the heat dissipation layer 7 are accommodated in the edge of the peripheral wall 3a.

第５に、カバー３の周壁３ａ内端側に切欠状の段部４を形成し、該段部４内に基板２を収容して固定するとともに放熱層７を形成してなることを特徴としている。   Fifth, it is characterized in that a notch-shaped step portion 4 is formed on the inner end side of the peripheral wall 3a of the cover 3, the substrate 2 is accommodated and fixed in the step portion 4, and a heat radiation layer 7 is formed. Yes.

第６に、段部４の内周面に、基板２を段部４内に挿入した際に基板２の周端に当接して嵌合状態を係止する複数の係止突起６を形成してなることを特徴としている。   Sixth, a plurality of locking projections 6 are formed on the inner peripheral surface of the stepped portion 4 to contact the peripheral end of the substrate 2 and lock the fitting state when the substrate 2 is inserted into the stepped portion 4. It is characterized by.

以上のように構成される本発明の集合型ランプは、基板背面の放熱層を介した放熱板の放熱により基板面の温度を大幅に下げることができ、ＬＥＤの寿命も延ばすことができるほか、放熱層の接着作用により防水のシール性も高まり、透光性のカバーと基板との固定性も良くなる。また放熱層にカバー及び基板側との接着機能を持たせることにより集合型ランプ全体をねじ等の固定具を用いないで構成することができ、そのための孔空け作業等も不要になる。   The collective lamp of the present invention configured as described above can greatly reduce the temperature of the substrate surface by the heat radiation of the heat dissipation plate via the heat dissipation layer on the back surface of the substrate, and can extend the life of the LED. The adhesive property of the heat radiation layer also increases the waterproof sealing property, and the fixing property between the translucent cover and the substrate is improved. Further, by providing the heat dissipation layer with an adhesive function to the cover and the substrate side, the entire collective lamp can be configured without using a fixing tool such as a screw, so that a hole making operation and the like are not required.

本発明のランプの表面を表す平面図である。It is a top view showing the surface of the lamp | ramp of this invention. 本発明のランプの正面断面図である。It is front sectional drawing of the lamp | ramp of this invention. 本発明のランプの側面断面図である。It is side surface sectional drawing of the lamp | ramp of this invention. 本発明のランプの部分拡大側面断面図である。It is a partial expanded side surface sectional view of the lamp | ramp of this invention.

以下図示する本発明の実施形態につき説明すると、図面はいずれも本発明の集合型ＬＥＤランプの一実施形態を表し、図１はランプ配置面（表面）を、図２は正面断面を、図３は側面断面を、図４は部分拡大正面断面をそれぞれ表す。   DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below. The drawings all represent one embodiment of the collective LED lamp of the present invention, FIG. 1 is a lamp arrangement surface (surface), FIG. 2 is a front sectional view, and FIG. Represents a side section, and FIG. 4 represents a partially enlarged front section.

この例ではランプ全体は１５０×１５０×４０程度の直方体を形成しており、表面に多数（１８×１８個）のＬＥＤ１を装着し、裏面にプリント配線された（図示しない）ガラスエポキシ製の樹脂製の基板２が透明なアクリル樹脂製の箱状のカバー３の周壁端縁内に収容固定されている。カバー３の設置時下方になる位置には、カバー３内の圧力解放及び水抜き孔５が設けられている。   In this example, the entire lamp forms a rectangular parallelepiped of about 150 × 150 × 40, and a glass epoxy resin (not shown) with a large number (18 × 18) of LEDs 1 mounted on the front surface and printed wiring on the rear surface. A substrate 2 made of metal is accommodated and fixed in the edge of the peripheral wall of a transparent acrylic resin box-shaped cover 3. A pressure release and drainage hole 5 in the cover 3 is provided at a position which becomes lower when the cover 3 is installed.

カバー３の周壁の開口端内側には切欠状の段部４が全周にわたって形成され、該段部４内に若干のクリアランスを介して基板２が収容されている。上記段部４に基板２が押圧挿入されると、段部４の各辺の内周の複数箇所に突設された小突起からなる球面状の係合突起６の下方に入って係止固定され、基板２の反り返りが防止される。   A notch-shaped step portion 4 is formed over the entire inner periphery of the opening end of the peripheral wall of the cover 3, and the substrate 2 is accommodated in the step portion 4 via a slight clearance. When the substrate 2 is pressed and inserted into the stepped portion 4, it enters below the spherical engaging projections 6 formed of small projections projecting at a plurality of locations on the inner periphery of each side of the stepped portion 4 and is fixed. Thus, warping of the substrate 2 is prevented.

基板２の背面側には放熱性（熱伝導性）に富んだシリコン樹脂と防水性に優れたシリコン樹脂を混合したカバー３及び基板２側と接着力のある樹脂が２ｍｍ程度の厚みでモールド等によって充填され、放熱層７が形成されている。この放熱層７は基板２の背面に接着するとともにその外周と段部４内周とのクリアランス部分にも浸入して接着することにより、基板２を固定しカバー３内の防水性も高める。   On the back side of the substrate 2, a resin 3 having a thickness of about 2 mm is formed with a resin 3 having an adhesive force with the cover 3 and the substrate 2 side mixed with a silicone resin with excellent heat dissipation and thermal resistance. The heat dissipation layer 7 is formed. The heat radiation layer 7 is adhered to the back surface of the substrate 2 and also penetrates and adheres to the clearance portion between the outer periphery and the inner periphery of the step portion 4, thereby fixing the substrate 2 and improving the waterproofness in the cover 3.

さらに上記放熱層７の背面には、アルミ押出成形材等よりなるヒートシンク（放熱板）８の底面が押接状態で接着固定され、放熱層７はＬＥＤによって過熱した基板２の熱を高い熱伝導によってヒートシンク８に伝導し、放熱を促進する。ヒートシンク８の側面にはランプ取付用の金具（図示しない）を締着するためのボルト孔９が穿設されている。   Further, a bottom surface of a heat sink (heat radiating plate) 8 made of an aluminum extrusion molding material or the like is bonded and fixed to the back surface of the heat radiating layer 7 in a pressed state. Is conducted to the heat sink 8 to promote heat dissipation. Bolt holes 9 are formed in the side surface of the heat sink 8 for fastening a lamp mounting bracket (not shown).

また前記基板２は、ＬＥＤ１を装着し且つその背面でプリント配線に接続された状態で、表面側及び裏面側共に耐熱性・耐水性を備えた防水塗料又は接着剤で予めコーティングされた防水膜１１が形成されており、ＬＥＤの基端部や基板背面のハンダ付部や端子部分からの浸水が防止される。１２はカバー３内への配線孔である。   The substrate 2 has a waterproof film 11 that is pre-coated with a waterproof paint or adhesive having heat resistance and water resistance on both the front side and the back side, with the LED 1 mounted and connected to the printed wiring on the back side. Is formed, so that water from the base end portion of the LED, the soldered portion on the back surface of the substrate, and the terminal portion is prevented. Reference numeral 12 denotes a wiring hole into the cover 3.

本実施形態ではＤＣ１１〜１３．５Ｖ、平均１．６Ａ下でＬＥＤ全体の消費電力は平均１９．６Ｗのものが使用されているが、上記放熱層７がない場合の基板２表面温度８０℃に対し、放熱層７を設けたものでは約５０℃に低下させることができた。   In this embodiment, the average LED power consumption is 19.6 W under DC 11 to 13.5 V, average 1.6 A, but the surface temperature of the substrate 2 when the heat dissipation layer 7 is not provided is 80 ° C. On the other hand, when the heat dissipation layer 7 was provided, the temperature could be lowered to about 50 ° C.

１ ＬＥＤ
２ 基板
３ カバー
３ａ 周壁
４ 段部
６ 係止突起
７ 放熱層
８ 放熱板 1 LED
2 Substrate 3 Cover 3a Peripheral wall 4 Step part 6 Locking projection 7 Heat radiation layer 8 Heat radiation plate

Claims (6)

基板（２）の表面に多数のＬＥＤ（１）を突設し、該ＬＥＤ（１）の表面側を透光性のカバー（３）で覆い、基板（２）の背面側に放熱板（８）を装着した集合型ランプにおいて、基板（２）と放熱板（８）との間に放熱性及び防水性を備えた樹脂からなり、カバー（３）の周壁（３ａ）内面と基板（２）とに付着する接着機能を備えてなる放熱層（７）を介在させて基板（２）と放熱板（８）を固着した集合型ＬＥＤランプ。   A number of LEDs (1) are projected from the surface of the substrate (2), the surface side of the LEDs (1) is covered with a translucent cover (3), and a heat sink (8 ), A heat sink and a waterproof resin between the substrate (2) and the heat radiating plate (8), and the inner surface of the peripheral wall (3a) of the cover (3) and the substrate (2). A collective type LED lamp in which a substrate (2) and a heat radiating plate (8) are fixed with a heat radiating layer (7) having an adhesive function attached to the substrate. 樹脂が放熱性シリコン樹脂と防水性シリコン樹脂を混合したものである請求項１の集合型ＬＥＤランプ。   2. The collective LED lamp according to claim 1, wherein the resin is a mixture of a heat-dissipating silicone resin and a waterproof silicone resin. ＬＥＤ（１）の装着及び配線接続状態において基板（２）の表面及び裏面に耐熱性防水樹脂をコーティングして防水膜（１１）を形成してなる請求項１又は２の集合型ＬＥＤランプ。   The collective LED lamp according to claim 1 or 2, wherein a waterproof film (11) is formed by coating a heat-resistant waterproof resin on the front and back surfaces of the substrate (2) when the LED (1) is mounted and connected. カバー（３）が周壁（３ａ）を備えた皿状又は箱状であり、周壁（３ａ）の端縁内に基板（２）及び放熱層（７）を収容してなる請求項１，２又は３の集合型ＬＥＤランプ。   The cover (3) is dish-shaped or box-shaped with a peripheral wall (3a), and the substrate (2) and the heat dissipation layer (7) are accommodated in the edge of the peripheral wall (3a). 3 collective LED lamps. カバー（３）の周壁（３ａ）内端側に切欠状の段部（４）を形成し、該段部（４）内に基板（２）を収容して固定するとともに放熱層（７）を形成してなる請求項４の集合型ＬＥＤランプ。   A notch-shaped step portion (4) is formed on the inner end side of the peripheral wall (3a) of the cover (3), and the substrate (2) is accommodated and fixed in the step portion (4) and the heat radiation layer (7) is provided. The collective type LED lamp according to claim 4 formed. 段部（４）の内周面に、基板（２）を段部（４）内に挿入した際に基板（２）の周端に当接して嵌合状態を係止する複数の係止突起（６）を形成してなる請求項５の集合型ＬＥＤランプ。   A plurality of locking protrusions that contact the peripheral edge of the substrate (2) and lock the fitting state when the substrate (2) is inserted into the step (4) on the inner peripheral surface of the step (4) The collective LED lamp according to claim 5, wherein (6) is formed.
JP2009246947A 2006-12-07 2009-10-27 Collective LED lamp Active JP4505543B2 (en)

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