JP3133922U - Collective diffusion type LED lamp - Google Patents

Collective diffusion type LED lamp Download PDF

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JP3133922U
JP3133922U JP2007003586U JP2007003586U JP3133922U JP 3133922 U JP3133922 U JP 3133922U JP 2007003586 U JP2007003586 U JP 2007003586U JP 2007003586 U JP2007003586 U JP 2007003586U JP 3133922 U JP3133922 U JP 3133922U
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cover
led
led lamp
surface side
diffusion type
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俊次 松本
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光電気通信システム有限会社
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)

Abstract

【課題】光源の近距離範囲を照射するため、ＬＥＤランプの光拡散を簡単に行う。
【解決手段】この考案は、基板２の表面側の空間に多数のＬＥＤ１を突設し、該ＬＥＤ１の表面側を透光性のカバー３で覆う集合型ランプにおいて、上記カバー３をその内面でＬＥＤ１の突出端を密着状態で埋入させるように形成し、該カバー３断面内でＬＥＤ１の光を表面側に拡散させるものである。
またカバー３の内面側の一部又は全部をプラスチック材をモールドすることにより形成することもできる。
【選択図】図３To irradiate a short range of a light source, light diffusion of an LED lamp is easily performed.
In this collective lamp, a large number of LEDs 1 are projected in a space on the surface side of a substrate 2 and the surface side of the LEDs 1 is covered with a translucent cover 3. The protruding end of the LED 1 is formed so as to be embedded in a close contact state, and the light of the LED 1 is diffused to the surface side in the cross section of the cover 3.
Moreover, a part or all of the inner surface side of the cover 3 can be formed by molding a plastic material.
[Selection] Figure 3

Description

この考案は屋外スポット照明、看板照明、建物の壁照明、庭園灯、作業灯（室内外）、集魚灯、水中照明等に用いられる集合拡散型ＬＥＤランプに関する。   The present invention relates to a collective diffusion type LED lamp used for outdoor spot lighting, signboard lighting, building wall lighting, garden lights, work lights (indoors and outdoors), fish collection lights, underwater lighting, and the like.

従来上記のような用途で多数のＬＥＤを基盤上に配設し、防水性、放熱性を重視した主として屋外用の集合型ＬＥＤランプとして特許文献１が公知である。また一般にＬＥＤランプは光の直進性（集光性）が強いものが多いため、近距離範囲を照射するために光を拡散させる構造としては図５（Ｂ）に示すように、透光用のカバー３の内面に凹レンズ状の突起３ｄを一体的に突設したものや、同図（Ｃ）に示すようにカバー３の内面に光を拡散させて透過させるようにリフレクター状又は表面に微細な凹凸を付して拡散透過させるシート状等の拡散部材３ｅを貼着したものが知られている。
実用新案登録第３１２９６９３号 Conventionally, Patent Document 1 is known as a collective LED lamp mainly for outdoor use in which a large number of LEDs are arranged on a base for the above-described uses and importance is attached to waterproofness and heat dissipation. In general, many LED lamps have a strong light straightness (light condensing property). Therefore, as shown in FIG. 5B, a structure for diffusing light to irradiate a short distance range is used. A concave lens-shaped projection 3d is integrally projected on the inner surface of the cover 3, or a reflector or a minute surface on the surface so that light is diffused and transmitted through the inner surface of the cover 3 as shown in FIG. The thing which stuck the diffusion member 3e of the sheet form etc. which attaches unevenness and permeate | transmits and permeate | transmits is known.
Utility model registration No. 3129693

しかし、図５（Ｂ）の凹レンズ状突起を設けたものは、各突起毎に円形の光のリングが形成されるため照射面や光源の明るさが不自然に不均一になるほか、凹レンズ状突起形成のための型が必要となるという欠点がある。
また図５（Ｂ）のものは拡散部材内面で乱反射が生じ透光量が少なくなるほか、カバー内面に拡散部材を貼付け又はその他の方法で、しかも耐熱条件下で固定する必要がある。 However, in the case where the concave lens-shaped protrusions shown in FIG. 5B are provided, a circular light ring is formed for each protrusion, so that the brightness of the irradiation surface and the light source becomes unnatural and uneven, and a concave lens shape There is a drawback that a mold for forming the protrusion is required.
5 (B) requires diffuse reflection on the inner surface of the diffusing member to reduce the light transmission amount, and it is necessary to attach the diffusing member to the inner surface of the cover or to fix it under other heat-resistant conditions.

上記課題を解決するための本考案のＬＥＤランプは、第１に基板２の表面側の空間に多数のＬＥＤ１を突設し、該ＬＥＤ１の表面側を透光性のカバー３で覆う集合型ランプにおいて、上記カバー３をその内面でＬＥＤ１の突出端を密着状態で埋入させるように形成し、該カバー３断面内でＬＥＤ１の光を表面側に拡散させることを特徴としている。   The LED lamp of the present invention for solving the above problem is a collective lamp in which a number of LEDs 1 are first projected in a space on the surface side of a substrate 2 and the surface side of the LED 1 is covered with a translucent cover 3. The cover 3 is formed so that the protruding end of the LED 1 is embedded in a close contact state on the inner surface thereof, and the light of the LED 1 is diffused to the surface side in the cross section of the cover 3.

第２に、カバー３の内面側の一部又は全部をプラスチック材をモールドすることにより形成したことを特徴としている。   Second, it is characterized in that a part or all of the inner surface side of the cover 3 is formed by molding a plastic material.

第３に、カバー３を予め板状又は皿状に成形し、基板２側に直接又は間接的に固定される外カバー３ａと、外カバー３ａの内面側でモールドによって成形され、ＬＥＤ１の突出端を埋入させる内カバー３ｂとで構成することを特徴としている。   Thirdly, the cover 3 is formed in a plate shape or a dish shape in advance, and is formed by molding on the inner surface side of the outer cover 3a and the outer cover 3a that is directly or indirectly fixed to the substrate 2 side. And an inner cover 3b for embedding the material.

第４に、カバー３がＬＥＤ１の先端及び少なくとも周面の一部と一体的に密着するようにモールド成形されたことを特徴としている。   Fourth, the cover 3 is molded so as to be in close contact with the tip of the LED 1 and at least a part of the peripheral surface.

第５に、カバー３の少なくとも正面側が均一な厚みに形成され、ＬＥＤ１がカバー３の肉厚内に埋入されたことを特徴としている。   Fifth, at least the front side of the cover 3 is formed to have a uniform thickness, and the LED 1 is embedded in the thickness of the cover 3.

第６に、カバー３が透明なプラスチック材よりなることを特徴としている。   Sixth, the cover 3 is made of a transparent plastic material.

第７に、内カバー３ｂを基板２側の表面に至るまでモールド形成し、ＬＥＤ１の全体を埋入させてなることを特徴としている。   Seventh, the inner cover 3b is molded to reach the surface on the substrate 2 side, and the entire LED 1 is embedded.

以上のように構成される本考案のＬＥＤランプは、照明施工者等において光量及び集光性共に優れた小品種のＬＥＤを備えておけば、ＬＥＤ正面側のカバーへのＬＥＤの埋没深さやカバーの厚み、カバー材料を調節又は選択することにより、任意な光量や拡散率の光源を得ることができる。したがって拡散率や光量の異なる予め多品種のＬＥＤを準備（在庫）する必要がなく経済的である。
また従来のＬＥＤ光拡散技術のようにカバー側に凹レンズ状の突起を設ける必要もなく、カバー内面に拡散板を介挿する必要もない他、透明カバーを用いた時は最大限の光量で近距離範囲を照射できる利点がある。 If the LED lamp of the present invention configured as described above is equipped with a small-type LED that is excellent in both light quantity and light condensing by the lighting installer, etc., the depth of the LED embedded in the cover on the LED front side and the cover By adjusting or selecting the thickness and the cover material, it is possible to obtain a light source having an arbitrary light amount and diffusivity. Therefore, it is economical because it is not necessary to prepare (stock) various types of LEDs with different diffusivities and light amounts in advance.
Moreover, unlike the conventional LED light diffusion technology, there is no need to provide a concave lens-like protrusion on the cover side, and there is no need to insert a diffusion plate on the inner surface of the cover. There is an advantage that a distance range can be irradiated.

以下図示する本考案の実施形態につき説明すると、図面はいずれも本考案の集合拡散型ＬＥＤランプの一実施形態を表し、図１はランプＬの配置面（表面）を、図２は正面断面を、図３は部分拡大正面断面をそれぞれ表す。   DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention shown in the drawings will be described below. Each of the drawings represents an embodiment of the collective diffusion type LED lamp of the present invention. FIG. 1 shows an arrangement surface (surface) of the lamp L, and FIG. FIG. 3 shows a partially enlarged front section.

この例ではランプＬ全体は１５４×１５４×４０程度の直方体を形成しており、表面に多数（１８×１８個）のＬＥＤ１を装着し、裏面にプリント配線された（図示しない）ガラスエポキシ製の樹脂製の基板２が透明なアクリル樹脂製の箱状又は角皿状の外カバー３ａの周壁端縁内に収容固定されている。外カバー３ａの設置時下方になる位置には、カバー内の圧力解放及び水抜き孔５が設けられている。   In this example, the entire lamp L forms a rectangular parallelepiped of about 154 × 154 × 40, and a large number (18 × 18) of LEDs 1 are mounted on the front surface and printed wiring is provided on the back surface (not shown). A resin substrate 2 is accommodated and fixed in the edge of the peripheral wall of a transparent acrylic resin box-shaped or square dish-shaped outer cover 3a. A pressure release and drainage hole 5 in the cover is provided at a position which is located downward when the outer cover 3a is installed.

前記外カバー３ａの内面のＬＥＤ対向面には、例えばエポキシ樹脂等のプラスチック材を所定の厚みでプレート状にモールドして（流動性のあるプラスチックを流し込んだ（注入した）後硬化させて）なる内カバー３ｂが形成されている。上記カバー３ａと内カバー３ｂとでカバー３が構成される。   For example, a plastic material such as an epoxy resin is molded into a plate shape with a predetermined thickness on the LED facing surface of the inner surface of the outer cover 3a (flowing plastic is poured (injected) and then cured). An inner cover 3b is formed. The cover 3 is constituted by the cover 3a and the inner cover 3b.

上記内カバー３ｂのモールド材は次に述べるようにＬＥＤ１の光を外に向かって拡散透過させるもので、無色透明なものや黄色等任意なものが選択でき、必要に応じ濁りのある白色又はその他の着色をして透過光量を調節することもできる。そしてこの外カバー３ａと内カバー３ｂとは密着接合されるので同色系の材料の場合は両者の接合面は接着状態となって境界線（面）は形成されることはなく、境界面により光の透過が妨げられることはない。   The molding material of the inner cover 3b diffuses and transmits the light of the LED 1 outward as described below, and can be selected from any material such as colorless and transparent, yellow, or turbid white or others as necessary. The amount of transmitted light can be adjusted by coloring. Since the outer cover 3a and the inner cover 3b are tightly joined, in the case of materials of the same color, the joint surfaces of the two are bonded and no boundary line (surface) is formed. The permeation of is not hindered.

また上記内カバー３ｂの内面側には、モールド時にＬＥＤの突出端が所定の深さＳ（図５（Ａ）参照）だけ埋入（没）して密着しており、ここでもＬＥＤ１と内カバー３ｂとの接合面での境界線は表れず、両者は一体的に接合されている。   Further, the protruding end of the LED is embedded (submerged) by a predetermined depth S (see FIG. 5A) at the time of molding and is in close contact with the inner surface side of the inner cover 3b. The boundary line at the joint surface with 3b does not appear, and both are integrally joined.

この構造により各ＬＥＤ１の埋入部分から放射される光は、内カバー３ｂ及び外カバー３ａの断面内で全方向に拡散され、この拡散度合（率）は前記埋没深さＳの大小により異なり、Ｓが大きい程拡散度合も大きくなる。   With this structure, the light emitted from the embedded portion of each LED 1 is diffused in all directions within the cross section of the inner cover 3b and the outer cover 3a, and the degree of diffusion (rate) varies depending on the size of the buried depth S. The greater the S, the greater the degree of diffusion.

外カバー３ａの周壁の開口端内側には切欠状の段部４が全周にわたって形成され、該段部４内に若干のクリアランスを介して基板２が収容されている。上記段部４に基板２が押圧挿入されると、段部４の各辺の内周の複数箇所に突設された小突起からなる球面状の係合突起６の下方に入って係止固定され、基板２の反り返りが防止される。   A notch-shaped step 4 is formed on the entire inner periphery of the opening end of the peripheral wall of the outer cover 3a, and the substrate 2 is accommodated in the step 4 with a slight clearance. When the substrate 2 is pressed and inserted into the stepped portion 4, it enters below the spherical engaging projections 6 formed of small projections projecting at a plurality of locations on the inner periphery of each side of the stepped portion 4 and is fixed. Thus, warping of the substrate 2 is prevented.

基板２の背面側には放熱性（熱伝導性）に富んだシリコン樹脂と防水性に優れたシリコン樹脂を混合した外カバー３ａ及び基板２側と接着力のある樹脂が２ｍｍ程度の厚みでモールド等によって充填され、放熱層７が形成されている。この放熱層７は基板２の背面に接着するとともにその外周と段部４内周とのクリアランス部分にも浸入して接着することにより、基板２を固定しカバーの防水性も高める。   On the back side of the substrate 2, an outer cover 3a in which a silicone resin having excellent heat dissipation (thermal conductivity) and a silicone resin having excellent waterproof properties are mixed and a resin having an adhesive force with the substrate 2 side is molded with a thickness of about 2 mm. Etc., and the heat radiation layer 7 is formed. The heat radiation layer 7 is bonded to the back surface of the substrate 2 and also enters and adheres to a clearance portion between the outer periphery and the inner periphery of the step portion 4, thereby fixing the substrate 2 and improving the waterproofness of the cover.

さらに上記放熱層７の背面には、アルミ押出成形材等よりなるヒートシンク（放熱板）８の底面が押接状態で接着固定され、放熱層７はＬＥＤによって過熱した基板２の熱を高い熱伝導によってヒートシンク８に伝導し、放熱を促進する。ヒートシンク８の側面にはランプ取付用の金具（図示しない）を締着するためのボルト孔９が穿設されている。   Further, the bottom surface of a heat sink (heat radiating plate) 8 made of an aluminum extrusion molding material or the like is bonded and fixed to the back surface of the heat radiating layer 7 in a pressed state, and the heat radiating layer 7 conducts heat of the substrate 2 heated by the LED with high heat conduction. Is conducted to the heat sink 8 to promote heat dissipation. Bolt holes 9 are formed in the side surfaces of the heat sink 8 for fastening a lamp mounting bracket (not shown).

また前記基板２は、ＬＥＤ１を装着し且つその背面でプリント配線に接続された状態で、表面側及び裏面側共に耐熱性・耐水性を備えた防水塗料又は接着剤で予めコーティングされた防水膜１１が形成されており、ＬＥＤの基端部や基板背面のハンダ付部や端子部分からの浸水が防止される。１２はカバー３内への配線孔である。   The substrate 2 has a waterproof film 11 that is pre-coated with a waterproof paint or adhesive having heat resistance and water resistance on both the front side and the back side, with the LED 1 mounted and connected to the printed wiring on the back side. Is formed, so that water from the base end portion of the LED, the soldered portion on the back surface of the substrate, and the terminal portion is prevented. Reference numeral 12 denotes a wiring hole into the cover 3.

本実施形態ではＤＣ１１〜１３．５Ｖ、平均１．６Ａ下でＬＥＤ全体の消費電力は平均１９．６Ｗのものが使用されているが、上記放熱層７がない場合の基板２表面温度８０℃に対し、放熱層７を設けたものでは約５０℃に低下させることができた。   In this embodiment, the average LED power consumption is 19.6 W under DC 11 to 13.5 V, average 1.6 A, but the surface temperature of the substrate 2 when the heat dissipation layer 7 is not provided is 80 ° C. On the other hand, when the heat dissipation layer 7 was provided, the temperature could be lowered to about 50 ° C.

なお、図示する実施形態では基板２と内カバー３ｂとの間に空間が形成され、ＬＥＤ１の先端側のみが内カバー３ｂ内に埋入されたものを示したが、前述した埋入深さＳを最大限にすると上記空間はなくなり、光の拡散性及び放熱性も向上する。   In the illustrated embodiment, a space is formed between the substrate 2 and the inner cover 3b, and only the front end side of the LED 1 is embedded in the inner cover 3b. When the maximum is set, the above space is eliminated, and the light diffusibility and heat dissipation are improved.

図４（Ａ），（Ｂ）は本実施例の場合と内カバー３ｂを設けない特許文献１の場合の光の拡散状態のイメージの比較図である。本発明の光拡散状態図（Ａ）ではランプＬからの光の届く距離は短い（最先端のＰ2点約１．５ｍ）代わりに、このＰ2点での照度は約２０Luxあり、最大照射面積位置での中心Ｐ1点（約０．８ｍ）での照度は約１２００Luxある。 4A and 4B are comparison diagrams of images of light diffusion states in the case of the present embodiment and in Patent Document 1 in which the inner cover 3b is not provided. In the light diffusion state diagram (A) of the present invention, the distance that the light from the lamp L reaches is short (the most advanced P 2 point is about 1.5 m), but the illuminance at this P 2 point is about 20 Lux, and the maximum irradiation Illuminance at the center P 1 point (about 0.8 m) at the area position is about 1200 Lux.

これに対し、同図（Ｂ）に示す内カバー３ｂを設けないものでは、Ｐ2点（約１５．０ｍ）での照度が約５．０Luxで光軸回りの最大照射面積位置での中心Ｐ1点（約３．０ｍ）での照度は約７００Luxであり、図５（Ａ）の方が明らかにランプＬ前方の近距離位置が明るいことが判る。 In contrast, those of not provided cover 3b among shown in FIG. (B), the center P of the maximum illumination area position of the optical axis by the illuminance of about 5.0Lux at P 2 point (about 15.0 m) The illuminance at one point (about 3.0 m) is about 700 Lux, and it can be seen that the near distance position in front of the lamp L is clearly brighter in FIG.

本考案のランプの表面を表す平面図である。It is a top view showing the surface of the lamp | ramp of this invention. 本考案のランプの正面断面図である。It is front sectional drawing of the lamp | ramp of this invention. 本考案のランプの部分拡大側面断面図である。It is a partial expanded side sectional view of the lamp of the present invention. （Ａ），（Ｂ）は本考案のランプと内カバーを設けないランプの光の照射範囲のイメージ図である。(A), (B) is an image figure of the irradiation range of the light of the lamp | ramp of this invention and the lamp | ramp which does not provide an inner cover. （Ａ）は本考案のランプ、（Ｂ），（Ｃ）は従来のランプの光拡散構造を示す部分断面図である。(A) is the lamp | ramp of this invention, (B), (C) is a fragmentary sectional view which shows the light-diffusion structure of the conventional lamp | ramp.

符号の説明Explanation of symbols

１ ＬＥＤ
２ 基板
３ カバー
３ａ 外カバー
３ｂ 内カバー
Ｌ ランプ 1 LED
2 Board 3 Cover 3a Outer cover 3b Inner cover L Lamp

Claims (7)

基板（２）の表面側の空間に多数のＬＥＤ（１）を突設し、該ＬＥＤ（１）の表面側を透光性のカバー（３）で覆う集合型ランプにおいて、上記カバー（３）をその内面でＬＥＤ（１）の突出端を密着状態で埋入させるように形成し、該カバー（３）断面内でＬＥＤ（１）の光を表面側に拡散させる集合拡散型ＬＥＤランプ。   In the collective lamp in which a large number of LEDs (1) are protruded in the space on the surface side of the substrate (2) and the surface side of the LEDs (1) is covered with a translucent cover (3), the cover (3) Is formed so that the protruding end of the LED (1) is embedded in a close contact state on the inner surface thereof, and the light of the LED (1) is diffused to the surface side in the cross section of the cover (3). カバー（３）の内面側の一部又は全部をプラスチック材をモールドすることにより形成した請求項１の集合拡散型ＬＥＤランプ。   The collective diffusion type LED lamp according to claim 1, wherein a part or all of the inner surface side of the cover (3) is formed by molding a plastic material. カバー（３）を予め板状又は皿状に成形し、基板（２）側に直接又は間接的に固定される外カバー（３ａ）と、外カバー（３ａ）の内面側でモールドによって成形され、ＬＥＤ（１）の突出端を埋入させる内カバー（３ｂ）とで構成する請求項１又は２の集合拡散型ＬＥＤランプ。   The cover (3) is previously formed into a plate shape or a dish shape, and is molded by a mold on the inner surface side of the outer cover (3a) and the outer cover (3a) fixed directly or indirectly to the substrate (2) side, The collective diffusion type LED lamp according to claim 1 or 2, comprising an inner cover (3b) for embedding the protruding end of the LED (1). カバー（３）がＬＥＤ（１）の先端及び少なくとも周面の一部と一体的に密着するようにモールド成形された請求項１又は２又は３の集合拡散型ＬＥＤランプ。   The collective diffusion type LED lamp according to claim 1, wherein the cover (3) is molded so as to be in close contact with the tip of the LED (1) and at least a part of the peripheral surface. カバー（３）の少なくとも正面側が均一な厚みに形成され、ＬＥＤ（１）がカバー（３）の肉厚内に埋入された請求項１又は２又は３又は４の集合拡散型ＬＥＤランプ。   The collective diffusion type LED lamp according to claim 1, 2 or 3 or 4, wherein at least the front side of the cover (3) is formed to have a uniform thickness, and the LED (1) is embedded in the thickness of the cover (3). カバー（３）が透明なプラスチック材よりなる請求項１又は２又は３又は４又は５の集合拡散型ＬＥＤランプ。   The collective diffusion type LED lamp according to claim 1, wherein the cover (3) is made of a transparent plastic material. 内カバー（３ｂ）を基板（２）側の表面に至るまでモールド形成し、ＬＥＤ（１）の全体を埋入させてなる請求項３又は４又は５又は６の集合拡散型ＬＥＤランプ。   The collective diffusion type LED lamp according to claim 3, 4, 5, or 6, wherein the inner cover (3 b) is molded to reach the surface on the substrate (2) side, and the entire LED (1) is embedded.
JP2007003586U 2007-05-17 2007-05-17 Collective diffusion type LED lamp Ceased JP3133922U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007003586U JP3133922U (en) 2007-05-17 2007-05-17 Collective diffusion type LED lamp
KR1020080096548A KR20080101832A (en) 2007-05-17 2008-10-01 Set diffusion mold led lamp

Applications Claiming Priority (1)

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JP2007003586U JP3133922U (en) 2007-05-17 2007-05-17 Collective diffusion type LED lamp

Related Child Applications (1)

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JP2009246948A Continuation JP4505544B2 (en) 2009-10-27 2009-10-27 Collective diffusion type LED lamp

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JP3133922U true JP3133922U (en) 2007-07-26

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011510455A (en) * 2008-01-16 2011-03-31 ライツ、 キャメラ、 アクション エルエルシイ High light source assembly that can be used underwater

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8974077B2 (en) 2012-07-30 2015-03-10 Ultravision Technologies, Llc Heat sink for LED light source

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011510455A (en) * 2008-01-16 2011-03-31 ライツ、 キャメラ、 アクション エルエルシイ High light source assembly that can be used underwater

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