US20100027269A1 - Even luminance, high heat dissipation efficiency, high power led lamp structure - Google Patents

Even luminance, high heat dissipation efficiency, high power led lamp structure Download PDF

Info

Publication number
US20100027269A1
US20100027269A1 US12/241,668 US24166808A US2010027269A1 US 20100027269 A1 US20100027269 A1 US 20100027269A1 US 24166808 A US24166808 A US 24166808A US 2010027269 A1 US2010027269 A1 US 2010027269A1
Authority
US
United States
Prior art keywords
heat dissipation
led lamp
high power
dissipation efficiency
lamp structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/241,668
Inventor
Wei-Hung Lo
Chi-Ruei Tsai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Assigned to LO, WEI-HUNG reassignment LO, WEI-HUNG ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LO, WEI-HUNG, TSAI, CHI-RUEI
Assigned to CHIANG, SHOEI-SHING, LO, WEI-HUNG reassignment CHIANG, SHOEI-SHING CORRECTIVE ASSIGNMENT TO CORRECT THE ADDITION OF A SECOND ASSIGNEE PREVIOUSLY RECORDED ON REEL 021608 FRAME 0487. ASSIGNOR(S) HEREBY CONFIRMS THE SHOEI-SHING CHIANG 4F, NO. 13, LANE 372, SEC. 5, ZHONGXIAO E. RD., XINYI DISTRICT, TAIPEI CITY 110, TAIWAN. Assignors: LO, WEI-HUNG, TSAI, CHI-RUEI
Publication of US20100027269A1 publication Critical patent/US20100027269A1/en
Assigned to LO, WEI-HUNG reassignment LO, WEI-HUNG ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHIANG, SHOEI-SHING, LO, WEI-HUNG
Abandoned legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/005—Sealing arrangements therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F21V15/015—Devices for covering joints between adjacent lighting devices; End coverings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to LED lamps and more particularly, to an even luminance, high heat dissipation efficiency, high power LED lamp structure that is practical for mass production to reduce the cost.
  • high brightness LEDs (light emitting diodes) have the advantages of small size, low power consumption and long service life. Therefore, high brightness LEDs are currently regarded as the next generation light source for illumination.
  • the first type uses a regular lampshell for conventional high power lamp and has LEDs be bonded to the inside of the lampshell so that the lampshell dissipates heat from the LEDs during operation of the LEDs.
  • the second type has LEDs and a heat sink (aluminum extrusion) be incorporated into a LED light source module, and then uses a regular lampshell for conventional high power lamp to hold the LED light source module on the inside.
  • the third type has considered the problem of LED heat dissipation before designing the lampshell so that the heat dissipation structure is visible from the outside.
  • This design employs a conventional lampshell fabrication technique, i.e., an aluminum die casting technique to make a lampshell for high power LED lamp.
  • the fourth type is based on LED heat dissipation considerations, employing an aluminum extrusion technique to make the lampshell for high power LED lamp.
  • the aforesaid four types of high power LED lamps are still not satisfactory in function and have drawbacks as follows:
  • the first type of high power LED lamp uses a conventional lampshell for high power lamp without considering the problem of LED heat dissipation. Because the problem of LED heat dissipation is not taken into consideration, iron or aluminum is used for making the lampshell. However, iron has poor heat dissipation efficiency.
  • aluminum alloy 1000 series should be used for making the lampshell by means of employing a die casting technique. However, the die cast aluminum alloy lampshell has a low heat dissipation efficiency.
  • the die cast aluminum alloy lampshell may be painted with a powder paint or coating with a layer of plastic coating. The powder paint or plastic coating makes dissipation of heat worse.
  • the second type of high power LED lamp has LEDs and a heat sink (aluminum extrusion) be incorporated into a LED light source module, and then uses a regular lampshell for conventional high power lamp to hold the LED light source module. It seems that the heat sink can dissipate heat from the LEDs. However, because the lampshell has a low heat dissipation efficiency, this second type of high power LED lamp encounters the same problems as the aforesaid first type.
  • the third type has considered the problem of LED heat dissipation before designing the lampshell, and the heat dissipation structure is visible from the outside.
  • the lampshell is made of aluminum alloy 1000 series by means of die casting, the heat dissipation efficiency of the lampshell is low. To provide a relatively greater heat dissipation surface area, much aluminum alloy material should be used. In consequence, the lampshell is heavy and big. Therefore, this is not a good choice. Further, for the sake of beauty, the lampshell may be coated with a layer of powder paint or coated with a layer of plastic coating, lowering the heat dissipation efficiency.
  • the fourth type of high power LED lamp is based on LED heat dissipation considerations, employing an aluminum extrusion technique to make the lampshell.
  • Aluminum alloy series 5000 or 6000 is usually used for the advantage of excellent heat dissipation efficiency.
  • the lampshell is simply a tow-dimensional design, its structure is simple and monotonous. Therefore, the shape design of the lampshell cannot satisfy consumers.
  • the present invention has been accomplished under the circumstances in view. It is one object of the present invention to provide an even luminance, high heat dissipation efficiency, high power LED lamp structure, which has the lamp housing thereof formed of an aluminum die cast front casing, an aluminum die cast and an aluminum extrusion body, providing an enhanced heat dissipation efficiency and causing a sense of beauty. Further, the aluminum extrusion type body has a substantially M-shaped cross section (see FIG. 3 ) that facilitates LED optical design to provide even illumination. Further, this arrangement facilitates mass production to lower the cost.
  • the even luminance, high heat dissipation efficiency, high power LED lamp structure comprises a front casing; a body, the body comprising a first end, a second end opposite to the first end, and an accommodation space, the first end being connected with the front casing; a rear casing, the rear casing comprising a first end connected to the second end of the body, a second end opposite to the first end of the rear casing, and a connection means provided at the second end of the rear casing; a printed circuit board mounted in the accommodation space inside the body; at least one light emitting diode installed in the printed circuit board for emitting light; a light transmissive outer cover fastened to a bottom side of the body and covered over the printed circuit board for output of light from the at least one light emitting diode; and a retaining device provided at a bottom side of the light transmissive outer cover to secure the light transmissive outer cover to the body, the retaining device comprising a connection means connected to the connection means
  • FIG. 1 is an exploded view of an even luminance, high heat dissipation efficiency, high power LED lamp structure according to the present invention.
  • FIG. 2 is an elevational assembly view of the even luminance, high heat dissipation efficiency, high power LED lamp structure according to the present invention.
  • FIG. 3 is a schematic cross-sectional view of the body and printed circuit board of the even luminance, high heat dissipation efficiency, high power LED lamp structure according to the present invention.
  • FIG. 1 is an exploded view of an even luminance, high heat dissipation efficiency, high power LED lamp structure according to the present invention.
  • FIG. 2 is an elevational assembly view of the even luminance, high heat dissipation efficiency, high power LED lamp structure according to the present invention.
  • the even luminance, high heat dissipation efficiency, high power LED lamp structure according to the present invention comprises a front casing 10 , a body 30 , a rear casing 40 , a printed circuit board 50 , at least one light emitting diode 60 , an inner cover plate 70 , at least one optical member 75 , a water seal 80 , a transparent outer cover 90 , and a retaining device 100 .
  • the front casing 10 can be, for example, but not limited, an aluminum die cast for the consideration of the shape design of the LED lamp structure.
  • the heat dissipation efficiency of the aluminum die cast is not high.
  • the front casing 10 needs not to have a heat dissipation function, and the LED lamp structure can be made having a three-dimensional configuration to satisfy consumers' demands and to facilitate the promotion of the LED lamp structure.
  • the body 30 has its one end connectable with the front casing 10 for heat dissipation. Further, the body 30 defines an accommodation space 31 .
  • the body 30 can be extruded from aluminum for the advantage of excellent heat dissipation efficiency. However, this is not a limitation. Further, radiation fins 32 are protruded from the outer wall of the body 30 to enhance heat dissipation.
  • the rear casing 40 has one end thereof connectable to the other end of the body 20 , an opposite end thereof provided with a first connection means 41 .
  • the rear casing 40 can be, for example, but not limited, an aluminum die cast for the consideration of the shape design of the LED lamp structure.
  • the heat dissipation efficiency of the aluminum die cast is not high.
  • the rear casing 40 needs not to have a heat dissipation function, and the LED lamp structure can be made having a three-dimensional configuration to satisfy consumers' demands and to facilitate the promotion of the LED lamp structure.
  • An aluminum die cast lampshell for high power LED lamp is heavy and big.
  • the manufacturing cost of an aluminum die cast lampshell for high power LED lamp is high. Therefore, the invention has the front casing 10 and rear casing 40 made of aluminum through a die cast technique, and the body 30 extruded from aluminum.
  • the size of the LED lamp structure can be minimized to below one-third of original and the related tooling cost can be greatly reduced while, and the shape of the LED lamp structure can be made attractive.
  • the printed circuit board 50 can be, for example, but not limited to, an aluminum printed circuit board using an aluminum substrate and mounted in the accommodation space 31 inside the body 30 .
  • the printed circuit board 50 provides the necessary circuits for the light emitting diodes 60 and dissipates heat from the light emitting diodes 60 initially.
  • the light emitting diodes 60 are high-brightness LEDs for providing the necessary light source for illumination.
  • the number of the light emitting diodes 60 can be changed subject to actual requirement.
  • the inner cover plate 70 is mounted inside the front casing 10 to beautify the internal arrangement.
  • the optical member 75 is for example but not limited to a lens or a light reflection cup, and disposed below the light emitting diodes 60 for changing the radiating angle of the light emitting diodes 60 and further for adjusting the light distributed curve, so as to meet the requirement.
  • the water seal 80 can be, for example, but not limited to, a rubber packing strip provided at the bottom side of the body 30 to prevent penetration of rainwater.
  • the transparent outer cover 90 is provided at the bottom side of the water seal 80 for output of the light source.
  • the transparent outer cover 90 can be made of, for example, but not limited to glass or plastics.
  • the retaining device 100 is provided at the bottom side of the transparent outer cover 90 , having a second connection means 101 for the connection of the first connection means 41 .
  • the even luminance, high heat dissipation efficiency, high power LED lamp structure further comprises a gasket plate 110 set between the front casing 10 and the body 30 to prevent penetration of outside rainwater into the inside of the body 30 , thereby protecting the internal printed circuit board 50 and the light emitting diodes 60 .
  • the even luminance, high heat dissipation efficiency, high power LED lamp structure further comprises a power supply circuit (not shown) mounted, either wholly or partially, in the front casing 10 or on the outside the front casing 10 , the body 30 and the rear casing 40 , to provide the light emitting diodes 60 with the necessary working voltage.
  • a power supply circuit (not shown) mounted, either wholly or partially, in the front casing 10 or on the outside the front casing 10 , the body 30 and the rear casing 40 , to provide the light emitting diodes 60 with the necessary working voltage.
  • the front casing and rear casing of the even luminance, high heat dissipation efficiency, high power LED lamp structure are aluminum die cast members and the body is an aluminum extrusion component.
  • the front casing, the rear casing and the body are assembled together, they provide excellent heat dissipation efficiency.
  • the aluminum extrusion type body has a substantially M-shaped cross section (see FIG. 3 ) that facilitates LED optical design to provide even illumination. Further, this arrangement facilitates mass production to lower the cost.
  • the invention involves an inventive step.
  • FIG. 3 is a schematic cross-sectional view of the body and printed circuit board of the even luminance, high heat dissipation efficiency, high power LED lamp structure according to the present invention.
  • the printed circuit board 50 has multiple LED mounting faces 51 - 55 disposed at different angles for holding LEDs at different angles.
  • the LED mounting faces 52 and 54 slope leftwards or rightwards at 30-degrees respectively; the LED mounting faces 51 and 55 slope rightwards or leftwards at 45-degrees respectively; the LED mounting faces 53 extends in horizontal.
  • the even luminance, high heat dissipation efficiency, high power LED lamp structure of the present invention eliminates the drawbacks of the prior art designs and has advantages including: a) the arrangement of the aluminum die cast front casing and rear casing and aluminum extrusion body provides an enhanced heat dissipation efficiency, causes a sense of beauty, and lowers the manufacturing cost of the lamp structure, and b) the printed circuit board provides multiple LED mounting faces for supporting LEDs at different angles to satisfy high power light source lighting arrangement.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

An even luminance, high heat dissipation efficiency, high power LED lamp structure includes an aluminum extrusion body, an aluminum die cast front casing and an aluminum die cast rear casing respectively provided at two distal ends of the aluminum extrusion body, a PC board mounted inside the aluminum extrusion body, LEDs mounted in different LED mounting faces of the PC board at different angles, an inner cover plate decorating the inside of the aluminum die cast front casing, a transparent outer cover covering the bottom side of the aluminum extrusion body and sealed with a water seal, and a retaining device fastened to the aluminum extrusion body to secure the transparent outer cover in place.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to LED lamps and more particularly, to an even luminance, high heat dissipation efficiency, high power LED lamp structure that is practical for mass production to reduce the cost.
  • 2. Description of the Related Art
  • Conventional light fixtures commonly use incandescent lamp bulbs or high-voltage sodium (mercuric) lamp bulbs as light source means to give off light. However, these lamp bulbs have high power consumption, low luminance efficiency and environmental unfriendly characteristics. However, because these light sources emit light in all directions, reflector means is necessary to reflect light toward a specific direction for floodlight illumination. Therefore, the effective utility of light is low.
  • Further, high brightness LEDs (light emitting diodes) have the advantages of small size, low power consumption and long service life. Therefore, high brightness LEDs are currently regarded as the next generation light source for illumination.
  • Commercial high power LED lamps include four types. The first type uses a regular lampshell for conventional high power lamp and has LEDs be bonded to the inside of the lampshell so that the lampshell dissipates heat from the LEDs during operation of the LEDs. The second type has LEDs and a heat sink (aluminum extrusion) be incorporated into a LED light source module, and then uses a regular lampshell for conventional high power lamp to hold the LED light source module on the inside. The third type has considered the problem of LED heat dissipation before designing the lampshell so that the heat dissipation structure is visible from the outside. This design employs a conventional lampshell fabrication technique, i.e., an aluminum die casting technique to make a lampshell for high power LED lamp. The fourth type is based on LED heat dissipation considerations, employing an aluminum extrusion technique to make the lampshell for high power LED lamp.
  • The aforesaid four types of high power LED lamps are still not satisfactory in function and have drawbacks as follows: The first type of high power LED lamp uses a conventional lampshell for high power lamp without considering the problem of LED heat dissipation. Because the problem of LED heat dissipation is not taken into consideration, iron or aluminum is used for making the lampshell. However, iron has poor heat dissipation efficiency. When aluminum is selected, aluminum alloy 1000 series should be used for making the lampshell by means of employing a die casting technique. However, the die cast aluminum alloy lampshell has a low heat dissipation efficiency. Further, for the sake of beauty, the die cast aluminum alloy lampshell may be painted with a powder paint or coating with a layer of plastic coating. The powder paint or plastic coating makes dissipation of heat worse.
  • The second type of high power LED lamp has LEDs and a heat sink (aluminum extrusion) be incorporated into a LED light source module, and then uses a regular lampshell for conventional high power lamp to hold the LED light source module. It seems that the heat sink can dissipate heat from the LEDs. However, because the lampshell has a low heat dissipation efficiency, this second type of high power LED lamp encounters the same problems as the aforesaid first type.
  • The third type has considered the problem of LED heat dissipation before designing the lampshell, and the heat dissipation structure is visible from the outside. However, because the lampshell is made of aluminum alloy 1000 series by means of die casting, the heat dissipation efficiency of the lampshell is low. To provide a relatively greater heat dissipation surface area, much aluminum alloy material should be used. In consequence, the lampshell is heavy and big. Therefore, this is not a good choice. Further, for the sake of beauty, the lampshell may be coated with a layer of powder paint or coated with a layer of plastic coating, lowering the heat dissipation efficiency.
  • The fourth type of high power LED lamp is based on LED heat dissipation considerations, employing an aluminum extrusion technique to make the lampshell. Aluminum alloy series 5000 or 6000 is usually used for the advantage of excellent heat dissipation efficiency. However, because the lampshell is simply a tow-dimensional design, its structure is simple and monotonous. Therefore, the shape design of the lampshell cannot satisfy consumers.
  • Further, conventional high power LED light source designs have another common drawback, i.e., uneven luminance. Therefore, these high power LED light source signs cannot satisfy user's requirements or meet law requirements on lighting arrangements.
  • Therefore, it is desirable to provide a high power LED lamp structure that eliminates the aforesaid problems.
    • SUMMARY OF THE INVENTION
  • The present invention has been accomplished under the circumstances in view. It is one object of the present invention to provide an even luminance, high heat dissipation efficiency, high power LED lamp structure, which has the lamp housing thereof formed of an aluminum die cast front casing, an aluminum die cast and an aluminum extrusion body, providing an enhanced heat dissipation efficiency and causing a sense of beauty. Further, the aluminum extrusion type body has a substantially M-shaped cross section (see FIG. 3) that facilitates LED optical design to provide even illumination. Further, this arrangement facilitates mass production to lower the cost.
  • It is another object of the present invention to provide an even luminance, high heat dissipation efficiency, high power LED lamp structure, which has the printed circuit board thereof provide multiple LED mounting faces for supporting LEDs at different angles to satisfy high power light source lighting arrangement.
  • To achieve these and other objects of the present invention, the even luminance, high heat dissipation efficiency, high power LED lamp structure comprises a front casing; a body, the body comprising a first end, a second end opposite to the first end, and an accommodation space, the first end being connected with the front casing; a rear casing, the rear casing comprising a first end connected to the second end of the body, a second end opposite to the first end of the rear casing, and a connection means provided at the second end of the rear casing; a printed circuit board mounted in the accommodation space inside the body; at least one light emitting diode installed in the printed circuit board for emitting light; a light transmissive outer cover fastened to a bottom side of the body and covered over the printed circuit board for output of light from the at least one light emitting diode; and a retaining device provided at a bottom side of the light transmissive outer cover to secure the light transmissive outer cover to the body, the retaining device comprising a connection means connected to the connection means of the rear casing.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an exploded view of an even luminance, high heat dissipation efficiency, high power LED lamp structure according to the present invention.
  • FIG. 2 is an elevational assembly view of the even luminance, high heat dissipation efficiency, high power LED lamp structure according to the present invention.
  • FIG. 3 is a schematic cross-sectional view of the body and printed circuit board of the even luminance, high heat dissipation efficiency, high power LED lamp structure according to the present invention.
    •  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
  • FIG. 1 is an exploded view of an even luminance, high heat dissipation efficiency, high power LED lamp structure according to the present invention. FIG. 2 is an elevational assembly view of the even luminance, high heat dissipation efficiency, high power LED lamp structure according to the present invention. As illustrated, the even luminance, high heat dissipation efficiency, high power LED lamp structure according to the present invention comprises a front casing 10, a body 30, a rear casing 40, a printed circuit board 50, at least one light emitting diode 60, an inner cover plate 70, at least one optical member 75, a water seal 80, a transparent outer cover 90, and a retaining device 100.
  • The front casing 10 can be, for example, but not limited, an aluminum die cast for the consideration of the shape design of the LED lamp structure. The heat dissipation efficiency of the aluminum die cast is not high. However, because the major part of the heat dissipation function of the LED lamp structure is done through the body 30, the front casing 10 needs not to have a heat dissipation function, and the LED lamp structure can be made having a three-dimensional configuration to satisfy consumers' demands and to facilitate the promotion of the LED lamp structure.
  • The body 30 has its one end connectable with the front casing 10 for heat dissipation. Further, the body 30 defines an accommodation space 31. The body 30 can be extruded from aluminum for the advantage of excellent heat dissipation efficiency. However, this is not a limitation. Further, radiation fins 32 are protruded from the outer wall of the body 30 to enhance heat dissipation.
  • The rear casing 40 has one end thereof connectable to the other end of the body 20, an opposite end thereof provided with a first connection means 41. The rear casing 40 can be, for example, but not limited, an aluminum die cast for the consideration of the shape design of the LED lamp structure. The heat dissipation efficiency of the aluminum die cast is not high. However, because the major part of the heat dissipation function of the LED lamp structure is done through the body 30, the rear casing 40 needs not to have a heat dissipation function, and the LED lamp structure can be made having a three-dimensional configuration to satisfy consumers' demands and to facilitate the promotion of the LED lamp structure. An aluminum die cast lampshell for high power LED lamp is heavy and big. Further, the manufacturing cost of an aluminum die cast lampshell for high power LED lamp is high. Therefore, the invention has the front casing 10 and rear casing 40 made of aluminum through a die cast technique, and the body 30 extruded from aluminum. Thus, the size of the LED lamp structure can be minimized to below one-third of original and the related tooling cost can be greatly reduced while, and the shape of the LED lamp structure can be made attractive.
  • The printed circuit board 50 can be, for example, but not limited to, an aluminum printed circuit board using an aluminum substrate and mounted in the accommodation space 31 inside the body 30. The printed circuit board 50 provides the necessary circuits for the light emitting diodes 60 and dissipates heat from the light emitting diodes 60 initially.
  • The light emitting diodes 60 are high-brightness LEDs for providing the necessary light source for illumination. The number of the light emitting diodes 60 can be changed subject to actual requirement.
  • The inner cover plate 70 is mounted inside the front casing 10 to beautify the internal arrangement.
  • The optical member 75 is for example but not limited to a lens or a light reflection cup, and disposed below the light emitting diodes 60 for changing the radiating angle of the light emitting diodes 60 and further for adjusting the light distributed curve, so as to meet the requirement.
  • The water seal 80 can be, for example, but not limited to, a rubber packing strip provided at the bottom side of the body 30 to prevent penetration of rainwater.
  • The transparent outer cover 90 is provided at the bottom side of the water seal 80 for output of the light source. The transparent outer cover 90 can be made of, for example, but not limited to glass or plastics.
  • The retaining device 100 is provided at the bottom side of the transparent outer cover 90, having a second connection means 101 for the connection of the first connection means 41.
  • The even luminance, high heat dissipation efficiency, high power LED lamp structure further comprises a gasket plate 110 set between the front casing 10 and the body 30 to prevent penetration of outside rainwater into the inside of the body 30, thereby protecting the internal printed circuit board 50 and the light emitting diodes 60.
  • The even luminance, high heat dissipation efficiency, high power LED lamp structure further comprises a power supply circuit (not shown) mounted, either wholly or partially, in the front casing 10 or on the outside the front casing 10, the body 30 and the rear casing 40, to provide the light emitting diodes 60 with the necessary working voltage. Because the power supply circuit design is of the known art and not within the scope of the claims of the present invention, no further detailed description in this regard is necessary.
  • Thus, the front casing and rear casing of the even luminance, high heat dissipation efficiency, high power LED lamp structure are aluminum die cast members and the body is an aluminum extrusion component. When the front casing, the rear casing and the body are assembled together, they provide excellent heat dissipation efficiency. Further, the aluminum extrusion type body has a substantially M-shaped cross section (see FIG. 3) that facilitates LED optical design to provide even illumination. Further, this arrangement facilitates mass production to lower the cost. When compared to conventional high power LED lamp designs, the invention involves an inventive step.
  • FIG. 3 is a schematic cross-sectional view of the body and printed circuit board of the even luminance, high heat dissipation efficiency, high power LED lamp structure according to the present invention. As illustrated, the printed circuit board 50 has multiple LED mounting faces 51-55 disposed at different angles for holding LEDs at different angles. For example, the LED mounting faces 52 and 54 slope leftwards or rightwards at 30-degrees respectively; the LED mounting faces 51 and 55 slope rightwards or leftwards at 45-degrees respectively; the LED mounting faces 53 extends in horizontal.
  • Therefore, the even luminance, high heat dissipation efficiency, high power LED lamp structure of the present invention eliminates the drawbacks of the prior art designs and has advantages including: a) the arrangement of the aluminum die cast front casing and rear casing and aluminum extrusion body provides an enhanced heat dissipation efficiency, causes a sense of beauty, and lowers the manufacturing cost of the lamp structure, and b) the printed circuit board provides multiple LED mounting faces for supporting LEDs at different angles to satisfy high power light source lighting arrangement.
  • Although particular embodiments of the invention have been described in detail for purposes of illustration, various modifications and enhancements may be made without departing from the spirit and scope of the invention. Accordingly, the invention is not to be limited except as by the appended claims.

Claims (16)

1. An even luminance, high heat dissipation efficiency, high power LED lamp structure, comprising:
a front casing;
a body, said body comprising a first end, a second end opposite to said first end, and an accommodation space, said first end being connected with said front casing;
a rear casing, said rear casing comprising a first end connected to the second end of said body, a second end opposite to the first end of said rear casing, and a connection means provided at the second end of said rear casing;
a printed circuit board mounted in said accommodation space inside said body; and
at least one light emitting diode installed in said printed circuit board for emitting light.
2. The even luminance, high heat dissipation efficiency, high power LED lamp structure as claimed in claim 1, wherein said front casing and said rear casing are aluminum die cast members.
3. The even luminance, high heat dissipation efficiency, high power LED lamp structure as claimed in claim 1, wherein said body is an aluminum extrusion member.
4. The even luminance, high heat dissipation efficiency, high power LED lamp structure as claimed in claim 1, further comprising an inner cover plate mounted in said front casing for decoration.
5. The even luminance, high heat dissipation efficiency, high power LED lamp structure as claimed in claim 1, further comprising a gasket plate set in between said front casing and said body to prevent penetration of rainwater into said body.
6. The even luminance, high heat dissipation efficiency, high power LED lamp structure as claimed in claim 1, further comprising water seal means peripherally sealed between said body and said light transmissive outer cover.
7. The even luminance, high heat dissipation efficiency, high power LED lamp structure as claimed in claim 6, further comprising a light transmissive outer cover fastened to a bottom side of said body and covered over said printed circuit board for output of light from said at least one light emitting diode.
8. The even luminance, high heat dissipation efficiency, high power LED lamp structure as claimed in claim 1, further comprising a retaining device provided at a bottom side of said light transmissive outer cover to secure said light transmissive outer cover to said body, said retaining device comprising a connection means connected to the connection means of said rear casing.
9. The even luminance, high heat dissipation efficiency, high power LED lamp structure as claimed in claim 1, wherein said printed circuit board is an aluminum printed circuit board formed of an aluminum substrate for providing circuit means for the installation of said at least one light emitting diode and for dissipating heat from said at least one light emitting diode.
10. The even luminance, high heat dissipation efficiency, high power LED lamp structure as claimed in claim 1, wherein said body comprises a plurality of radiation fins protruded from an outside wall thereof for heat dissipation.
11. The even luminance, high heat dissipation efficiency, high power LED lamp structure as claimed in claim 1, wherein said at least one light emitting diode each is a high power light emitting diode.
12. The even luminance, high heat dissipation efficiency, high power LED lamp structure as claimed in claim 7, wherein said light transmissive outer cover is a transparent cover selectively made of one of the materials of transparent glass and transparent plastics.
13. The even luminance, high heat dissipation efficiency, high power LED lamp structure as claimed in claim 6, wherein said water seal means is formed of a rubber packing strip and
14. The even luminance, high heat dissipation efficiency, high power LED lamp structure as claimed in claim 1, wherein said printed circuit board comprises a plurality of LED mounting faces disposed at different angles for supporting a plurality of light emitting diodes of said at least one light emitting diode at different angles.
15. The even luminance, high heat dissipation efficiency, high power LED lamp structure as claimed in claim 1, further comprising at least one optical member disposed below said light emitting diodes for changing the radiating angle of said light emitting diodes.
16. The even luminance, high heat dissipation efficiency, high power LED lamp structure as claimed in claim 15, wherein said optical member is a lens or a light reflection cup.
US12/241,668 2008-07-29 2008-09-30 Even luminance, high heat dissipation efficiency, high power led lamp structure Abandoned US20100027269A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW097213398 2008-07-29
TW097213398U TWM348905U (en) 2008-07-29 2008-07-29 High power LED (light emitting diode) light source structure with uniform illumination and high efficiency heat dissipation

Publications (1)

Publication Number Publication Date
US20100027269A1 true US20100027269A1 (en) 2010-02-04

Family

ID=41608165

Family Applications (1)

Application Number Title Priority Date Filing Date
US12/241,668 Abandoned US20100027269A1 (en) 2008-07-29 2008-09-30 Even luminance, high heat dissipation efficiency, high power led lamp structure

Country Status (3)

Country Link
US (1) US20100027269A1 (en)
JP (1) JP3154353U (en)
TW (1) TWM348905U (en)

Cited By (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100157610A1 (en) * 2008-12-22 2010-06-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Led lamp
US20100277920A1 (en) * 2009-05-04 2010-11-04 Led Folio Corporation Light emitting diode lamp for street lighting
US20110075415A1 (en) * 2009-09-29 2011-03-31 Meng Hsieh Chou Led illumination apparatus for spot lighting
AU2011101306B4 (en) * 2011-10-11 2012-06-07 Weidmuller Pty Ltd Lighting assembly
AU2011101305B4 (en) * 2011-10-11 2012-06-07 Weidmuller Pty Ltd Headlight assembly
US20120146512A1 (en) * 2010-12-14 2012-06-14 Duk-Yong Kim Led lighting module and lighting device using the module
US20120162982A1 (en) * 2010-12-28 2012-06-28 Foxconn Technology Co., Ltd. Led lamp
CN102809078A (en) * 2012-08-15 2012-12-05 苏州金科信汇光电科技有限公司 Integrally formed down lamp
US20130032323A1 (en) * 2011-08-02 2013-02-07 Hsu Takeho Heat sink structure
US20130063934A1 (en) * 2011-09-09 2013-03-14 Llyod E. VERMELAND Water resistant lighting fixture
CN103196061A (en) * 2013-04-18 2013-07-10 广东国晟投资有限公司 Anti-dazzling LED down lamp
CN103256540A (en) * 2013-05-27 2013-08-21 光明国际（镇江）电气有限公司 High-power LED light source street lamp holder
US8696154B2 (en) 2011-08-19 2014-04-15 Lsi Industries, Inc. Luminaires and lighting structures
USD704375S1 (en) * 2010-10-07 2014-05-06 Hubbell Incorporated Luminaire housing
US9091402B2 (en) 2012-03-28 2015-07-28 Milwaukee Electric Tool Corporation Area light
US9121580B1 (en) 2012-05-04 2015-09-01 Cooper Technologies Company Power door lighting fixture
US9157585B2 (en) 2012-03-28 2015-10-13 Milwaukee Electric Tool Corporation Area light
US9163808B1 (en) * 2012-05-04 2015-10-20 Cooper Technologies Company Outdoor lighting fixture
US9261251B1 (en) 2012-05-04 2016-02-16 Cooper Technologies Company Door for outdoor lighting fixture
US20170003009A1 (en) 2015-07-01 2017-01-05 Milwaukee Electric Tool Corporation Area light
USD779694S1 (en) 2013-08-27 2017-02-21 Milwaukee Electric Tool Corporation Portable light
USD786469S1 (en) * 2016-01-18 2017-05-09 AMLED Technologies, Inc. Street light
CN106641748A (en) * 2016-10-11 2017-05-10 武汉长江半导体照明科技股份有限公司 COB integrated light source module
US9851088B2 (en) 2015-02-04 2017-12-26 Milwaukee Electric Tool Corporation Light including a heat sink and LEDs coupled to the heat sink
USD816252S1 (en) 2016-05-16 2018-04-24 Milwaukee Electric Tool Corporation Light
USD850689S1 (en) 2015-04-24 2019-06-04 Milwaukee Electric Tool Corporation Stand light
US10323831B2 (en) 2015-11-13 2019-06-18 Milwaukee Electric Tool Corporation Utility mount light
WO2021140060A1 (en) * 2020-01-10 2021-07-15 Eaton Intelligent Power Limited Thermally conductive polymer luminaire
CN113587059A (en) * 2021-08-06 2021-11-02 广西保力星照明科技有限公司 Light superconductive heat dissipation street lamp body
USD1069210S1 (en) 2020-01-14 2025-04-01 Eaton Intelligent Power Limited Luminaire

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070285930A1 (en) * 2006-06-12 2007-12-13 Grand Halo Technology Co., Ltd. Heat-dissipating module
US7513639B2 (en) * 2006-09-29 2009-04-07 Pyroswift Holding Co., Limited LED illumination apparatus
US7513659B2 (en) * 2005-09-01 2009-04-07 Star Headlight & Lantern Co., Inc. Light emitter sub-assemblies especially containing an array of light emitting devices (LEDs) and modules containing such sub-assemblies which provide lighting apparatuses, especially light bars for mounting on a vehicle
US7674012B1 (en) * 2009-04-17 2010-03-09 Cpumate Inc. LED lighting device capable of uniformly dissipating heat
US7674010B2 (en) * 2006-09-21 2010-03-09 Hogarth Fine Art Limited Light fixture having light emitting diode (LED) and resilient member
US7744247B2 (en) * 2007-12-27 2010-06-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. LED lamp having double-side heat sink
US7771087B2 (en) * 2006-09-30 2010-08-10 Ruud Lighting, Inc. LED light fixture with uninterruptible power supply

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7513659B2 (en) * 2005-09-01 2009-04-07 Star Headlight & Lantern Co., Inc. Light emitter sub-assemblies especially containing an array of light emitting devices (LEDs) and modules containing such sub-assemblies which provide lighting apparatuses, especially light bars for mounting on a vehicle
US20070285930A1 (en) * 2006-06-12 2007-12-13 Grand Halo Technology Co., Ltd. Heat-dissipating module
US7674010B2 (en) * 2006-09-21 2010-03-09 Hogarth Fine Art Limited Light fixture having light emitting diode (LED) and resilient member
US7513639B2 (en) * 2006-09-29 2009-04-07 Pyroswift Holding Co., Limited LED illumination apparatus
US7771087B2 (en) * 2006-09-30 2010-08-10 Ruud Lighting, Inc. LED light fixture with uninterruptible power supply
US7744247B2 (en) * 2007-12-27 2010-06-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. LED lamp having double-side heat sink
US7674012B1 (en) * 2009-04-17 2010-03-09 Cpumate Inc. LED lighting device capable of uniformly dissipating heat

Cited By (69)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8075164B2 (en) * 2008-12-22 2011-12-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. LED lamp
US20100157610A1 (en) * 2008-12-22 2010-06-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Led lamp
US20100277920A1 (en) * 2009-05-04 2010-11-04 Led Folio Corporation Light emitting diode lamp for street lighting
US20110075415A1 (en) * 2009-09-29 2011-03-31 Meng Hsieh Chou Led illumination apparatus for spot lighting
USD704375S1 (en) * 2010-10-07 2014-05-06 Hubbell Incorporated Luminaire housing
US8998441B2 (en) * 2010-12-14 2015-04-07 K. M. W. Inc. LED Lighting module and lighting device using the module
US20120146512A1 (en) * 2010-12-14 2012-06-14 Duk-Yong Kim Led lighting module and lighting device using the module
US20120162982A1 (en) * 2010-12-28 2012-06-28 Foxconn Technology Co., Ltd. Led lamp
US20130032323A1 (en) * 2011-08-02 2013-02-07 Hsu Takeho Heat sink structure
US8696154B2 (en) 2011-08-19 2014-04-15 Lsi Industries, Inc. Luminaires and lighting structures
US8770785B2 (en) * 2011-09-09 2014-07-08 555 International, Inc. Water resistant lighting fixture
US20130063934A1 (en) * 2011-09-09 2013-03-14 Llyod E. VERMELAND Water resistant lighting fixture
AU2011101306B4 (en) * 2011-10-11 2012-06-07 Weidmuller Pty Ltd Lighting assembly
AU2011101305B4 (en) * 2011-10-11 2012-06-07 Weidmuller Pty Ltd Headlight assembly
US9091402B2 (en) 2012-03-28 2015-07-28 Milwaukee Electric Tool Corporation Area light
US9157585B2 (en) 2012-03-28 2015-10-13 Milwaukee Electric Tool Corporation Area light
US9121580B1 (en) 2012-05-04 2015-09-01 Cooper Technologies Company Power door lighting fixture
US10215371B1 (en) 2012-05-04 2019-02-26 Cooper Technologies Company Outdoor lighting fixture
US9163808B1 (en) * 2012-05-04 2015-10-20 Cooper Technologies Company Outdoor lighting fixture
US9261251B1 (en) 2012-05-04 2016-02-16 Cooper Technologies Company Door for outdoor lighting fixture
CN102809078A (en) * 2012-08-15 2012-12-05 苏州金科信汇光电科技有限公司 Integrally formed down lamp
CN103196061A (en) * 2013-04-18 2013-07-10 广东国晟投资有限公司 Anti-dazzling LED down lamp
CN103256540A (en) * 2013-05-27 2013-08-21 光明国际（镇江）电气有限公司 High-power LED light source street lamp holder
USD779694S1 (en) 2013-08-27 2017-02-21 Milwaukee Electric Tool Corporation Portable light
US10627100B2 (en) 2015-02-04 2020-04-21 Milwaukee Electric Tool Corporation Light
US10386057B2 (en) 2015-02-04 2019-08-20 Milwaukee Electric Tool Corporation Light including a heat sink and LEDs coupled to the heat sink
US9851088B2 (en) 2015-02-04 2017-12-26 Milwaukee Electric Tool Corporation Light including a heat sink and LEDs coupled to the heat sink
US12247729B2 (en) 2015-02-04 2025-03-11 Milwaukee Electric Tool Corporation Light
US10066827B2 (en) 2015-02-04 2018-09-04 Milwaukee Electric Tool Corporation Light including a heat sink and LEDs coupled to the heat sink
US20180340683A1 (en) 2015-02-04 2018-11-29 Milwaukee Electric Tool Corporation Light
US11408605B2 (en) 2015-02-04 2022-08-09 Milwaukee Electric Tool Corporation Light
US11415310B2 (en) 2015-02-04 2022-08-16 Milwaukee Electric Tool Corporation Light including a heat sink and LEDs coupled to the heat sink and light intensity management thereof
US11536444B2 (en) 2015-02-04 2022-12-27 Milwaukee Electric Tool Corporation Light
US11796166B1 (en) 2015-02-04 2023-10-24 Milwaukee Electric Tool Corporation Light
USD1037521S1 (en) 2015-04-24 2024-07-30 Milwaukee Electric Tool Corporation Stand light
US10378739B2 (en) 2015-04-24 2019-08-13 Milwaukee Electric Tool Corporation Stand light
USD883549S1 (en) 2015-04-24 2020-05-05 Milwaukee Electric Tool Corporation Stand light
US11725807B2 (en) 2015-04-24 2023-08-15 Milwaukee Electric Tool Corporation Stand light
US12000572B2 (en) 2015-04-24 2024-06-04 Milwaukee Electric Tool Corporation Stand light
US11530799B2 (en) 2015-04-24 2022-12-20 Milwaukee Electric Tool Corporation Stand light
USD902463S1 (en) 2015-04-24 2020-11-17 Milwaukee Electric Tool Corporation Stand light
US10907809B2 (en) 2015-04-24 2021-02-02 Milwaukee Electric Tool Corporation Stand light
USD850689S1 (en) 2015-04-24 2019-06-04 Milwaukee Electric Tool Corporation Stand light
US11306904B1 (en) 2015-04-24 2022-04-19 Milwaukee Electric Tool Corporation Stand light
US11112096B2 (en) 2015-04-24 2021-09-07 Milwaukee Electric Tool Corporation Stand light
USD936880S1 (en) 2015-07-01 2021-11-23 Milwaukee Electric Tool Corporation Light
US10775032B2 (en) 2015-07-01 2020-09-15 Milwaukee Electric Tool Corporation Area light
US20170003009A1 (en) 2015-07-01 2017-01-05 Milwaukee Electric Tool Corporation Area light
US11619372B2 (en) 2015-07-01 2023-04-04 Milwaukee Electric Tool Corporation Area light
US11149930B2 (en) 2015-07-01 2021-10-19 Milwaukee Electric Tool Corporation Area light
US11073265B2 (en) 2015-11-13 2021-07-27 Milwaukee Electric Tool Corporation Utility mount light
US10753585B2 (en) 2015-11-13 2020-08-25 Milwaukee Electric Tool Corporation Utility mount light
US10323831B2 (en) 2015-11-13 2019-06-18 Milwaukee Electric Tool Corporation Utility mount light
US11448383B2 (en) 2015-11-13 2022-09-20 Milwaukee Electric Tool Corporation Utility mount light
USD1020062S1 (en) 2015-11-13 2024-03-26 Milwaukee Electric Tool Corporation Light
US11525562B2 (en) 2015-11-13 2022-12-13 Milwaukee Electric Tool Corporation Utility mount light
USD1020061S1 (en) 2015-11-13 2024-03-26 Milwaukee Electric Tool Corporation Light
US11365872B1 (en) 2015-11-13 2022-06-21 Milwaukee Electric Tool Corporation Utility mount light
US11262055B2 (en) 2015-11-13 2022-03-01 Milwaukee Electric Tool Corporation Utility mount light
US11754266B2 (en) 2015-11-13 2023-09-12 Milwaukee Electric Tool Corporation Utility mount light
USD786469S1 (en) * 2016-01-18 2017-05-09 AMLED Technologies, Inc. Street light
USD899650S1 (en) 2016-05-16 2020-10-20 Milwaukee Electric Tool Corporation Light
USD816252S1 (en) 2016-05-16 2018-04-24 Milwaukee Electric Tool Corporation Light
CN106641748A (en) * 2016-10-11 2017-05-10 武汉长江半导体照明科技股份有限公司 COB integrated light source module
US11473768B2 (en) 2020-01-10 2022-10-18 Eaton Intelligent Power Limited Thermally conductive polymer luminaire
WO2021140060A1 (en) * 2020-01-10 2021-07-15 Eaton Intelligent Power Limited Thermally conductive polymer luminaire
US12152767B2 (en) 2020-01-10 2024-11-26 Eaton Intelligent Power Limited Thermally conductive polymer luminaire
USD1069210S1 (en) 2020-01-14 2025-04-01 Eaton Intelligent Power Limited Luminaire
CN113587059A (en) * 2021-08-06 2021-11-02 广西保力星照明科技有限公司 Light superconductive heat dissipation street lamp body

Also Published As

Publication number Publication date
JP3154353U (en) 2009-10-15
TWM348905U (en) 2009-01-11

Similar Documents

Publication Publication Date Title
US20100027269A1 (en) Even luminance, high heat dissipation efficiency, high power led lamp structure
EP2095014B1 (en) Light engine assemblies
US8220977B2 (en) Solid state light unit and heat sink, and method for thermal management of a solid state light unit
US8465178B2 (en) LED lighting fixture
US7267461B2 (en) Directly viewable luminaire
US8251546B2 (en) LED lamp with a plurality of reflectors
JP6204194B2 (en) Troffer optical assembly
CN101828069A (en) Light emitting element lamp and lighting equipment
JP2009129809A (en) Lighting device
KR101324700B1 (en) A double-sealed led flood light and the sealing method
TW201520474A (en) LED streetlamp
CN201041338Y (en) Light emitting diode lighting device
JP3171093U (en) LED bulb
KR200443110Y1 (en) LED Street Light
CN201302117Y (en) Led lighting bulb
TW201307731A (en) Light emitting diode bulb
CN202327741U (en) LED module structure
JP2012124109A (en) Cover member mounting device, base-attached lamp, and lighting fixture
TWI391602B (en) Lamp
JP5649462B2 (en) Lighting device
JP5636790B2 (en) Lighting device
CN104373850B (en) Integrated LED light module and assembly method thereof
CN109519731B (en) Double layer bulb
CN102392947A (en) LED (light emitting diode) pattern assembly structure
CN217402357U (en) Radiating projecting lamp of logical groove formula

Legal Events

Date Code Title Description
AS Assignment

Owner name: LO, WEI-HUNG,TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LO, WEI-HUNG;TSAI, CHI-RUEI;SIGNING DATES FROM 20080920 TO 20080922;REEL/FRAME:021608/0487

AS Assignment

Owner name: LO, WEI-HUNG,TAIWAN

Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE ADDITION OF A SECOND ASSIGNEE PREVIOUSLY RECORDED ON REEL 021608 FRAME 0487. ASSIGNOR(S) HEREBY CONFIRMS THE SHOEI-SHING CHIANG 4F, NO. 13, LANE 372, SEC. 5, ZHONGXIAO E. RD., XINYI DISTRICT, TAIPEI CITY 110, TAIWAN;ASSIGNORS:LO, WEI-HUNG;TSAI, CHI-RUEI;SIGNING DATES FROM 20080920 TO 20080922;REEL/FRAME:022505/0293

Owner name: CHIANG, SHOEI-SHING,TAIWAN

Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE ADDITION OF A SECOND ASSIGNEE PREVIOUSLY RECORDED ON REEL 021608 FRAME 0487. ASSIGNOR(S) HEREBY CONFIRMS THE SHOEI-SHING CHIANG 4F, NO. 13, LANE 372, SEC. 5, ZHONGXIAO E. RD., XINYI DISTRICT, TAIPEI CITY 110, TAIWAN;ASSIGNORS:LO, WEI-HUNG;TSAI, CHI-RUEI;SIGNING DATES FROM 20080920 TO 20080922;REEL/FRAME:022505/0293

AS Assignment

Owner name: LO, WEI-HUNG, TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LO, WEI-HUNG;CHIANG, SHOEI-SHING;REEL/FRAME:025973/0133

Effective date: 20110314

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION