JP4451280B2 - リソグラフィ装置及び物品支持体 - Google Patents

リソグラフィ装置及び物品支持体 Download PDF

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Publication number
JP4451280B2
JP4451280B2 JP2004321463A JP2004321463A JP4451280B2 JP 4451280 B2 JP4451280 B2 JP 4451280B2 JP 2004321463 A JP2004321463 A JP 2004321463A JP 2004321463 A JP2004321463 A JP 2004321463A JP 4451280 B2 JP4451280 B2 JP 4451280B2
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JP
Japan
Prior art keywords
support
article
filling gas
lithographic apparatus
region
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Expired - Fee Related
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JP2004321463A
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English (en)
Japanese (ja)
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JP2005142570A (ja
Inventor
イェロエン オッテンス ヨーシュト
ニコラース ラムベルテュス ドンデルス ショエルト
Original Assignee
エーエスエムエル ネザーランズ ビー．ブイ．
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Publication of JP2005142570A publication Critical patent/JP2005142570A/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • H10P72/0432—

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2004321463A 2003-11-05 2004-11-05 リソグラフィ装置及び物品支持体 Expired - Fee Related JP4451280B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP03078504 2003-11-05

Publications (2)

Publication Number Publication Date
JP2005142570A JP2005142570A (ja) 2005-06-02
JP4451280B2 true JP4451280B2 (ja) 2010-04-14

Family

ID=34626394

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004321463A Expired - Fee Related JP4451280B2 (ja) 2003-11-05 2004-11-05 リソグラフィ装置及び物品支持体

Country Status (8)

Country Link
US (1) US7307696B2 (enExample)
EP (1) EP1530088B1 (enExample)
JP (1) JP4451280B2 (enExample)
KR (1) KR100700372B1 (enExample)
CN (1) CN100504607C (enExample)
DE (1) DE602004008009T2 (enExample)
SG (1) SG111314A1 (enExample)
TW (1) TW200527153A (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100382275C (zh) * 2004-10-29 2008-04-16 东京毅力科创株式会社 基板载置台、基板处理装置及基板的温度控制方法
US7834974B2 (en) 2005-06-28 2010-11-16 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7978308B2 (en) * 2006-05-15 2011-07-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7593096B2 (en) * 2006-05-15 2009-09-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2008013443A2 (en) * 2006-07-28 2008-01-31 Mapper Lithography Ip B.V. Lithography system, method of heat dissipation and frame
US8705010B2 (en) 2007-07-13 2014-04-22 Mapper Lithography Ip B.V. Lithography system, method of clamping and wafer table
TWI541615B (zh) 2007-07-13 2016-07-11 瑪波微影Ｉｐ公司 在微影裝置中交換晶圓的方法
JP5766758B2 (ja) * 2007-07-13 2015-08-19 マッパー・リソグラフィー・アイピー・ビー．ブイ． リソグラフィシステム、クランプ方法及びウェーハテーブル
NL2003258A1 (nl) * 2008-08-08 2010-02-09 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
NL2008845A (en) * 2011-05-24 2012-11-27 Asml Netherlands Bv Lithographic apparatus and component.
NL2008980A (en) 2011-07-11 2013-01-14 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
JP5778093B2 (ja) * 2011-08-10 2015-09-16 エーエスエムエル ネザーランズ ビー．ブイ． 基板テーブルアセンブリ、液浸リソグラフィ装置及びデバイス製造方法
NL2009189A (en) 2011-08-17 2013-02-19 Asml Netherlands Bv Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method.
WO2014084060A1 (ja) * 2012-11-28 2014-06-05 京セラ株式会社 載置用部材およびその製造方法
US10339260B2 (en) * 2013-09-06 2019-07-02 Asml Netherlands B.V. Methodology to generate guiding templates for directed self-assembly
CN105683839B (zh) 2013-09-27 2017-08-08 Asml荷兰有限公司 用于光刻设备的支撑台、光刻设备以及器件制造方法
JP6139698B2 (ja) 2013-11-22 2017-05-31 京セラ株式会社 静電チャック
NL2014516A (en) * 2014-04-30 2016-03-08 Asml Netherlands Bv Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method.
CN107077078B (zh) 2014-10-23 2019-04-09 Asml荷兰有限公司 用于光刻设备的支撑台、加载衬底的方法、光刻设备和器件制造方法
US10599049B2 (en) * 2015-09-28 2020-03-24 Asml Netherlands B.V. Substrate holder, a lithographic apparatus and method of manufacturing devices
CN108292109B (zh) * 2015-12-15 2020-05-12 Asml荷兰有限公司 衬底保持器、光刻设备及制造器件的方法
WO2019187785A1 (ja) * 2018-03-26 2019-10-03 日本碍子株式会社 静電チャックヒータ
EP3903152A1 (en) * 2018-12-28 2021-11-03 ASML Netherlands B.V. Substrate holder for use in a lithographic apparatus and a method of manufacturing a substrate holder
EP3851916A1 (en) 2020-01-17 2021-07-21 ASML Netherlands B.V. Suction clamp, object handler, stage apparatus and lithographic apparatus

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09172055A (ja) * 1995-12-19 1997-06-30 Fujitsu Ltd 静電チャック及びウエハの吸着方法
JP3814359B2 (ja) * 1996-03-12 2006-08-30 キヤノン株式会社 Ｘ線投影露光装置及びデバイス製造方法
US5835334A (en) * 1996-09-30 1998-11-10 Lam Research Variable high temperature chuck for high density plasma chemical vapor deposition
US6033478A (en) * 1996-11-05 2000-03-07 Applied Materials, Inc. Wafer support with improved temperature control
US5997963A (en) * 1998-05-05 1999-12-07 Ultratech Stepper, Inc. Microchamber
JP2000091220A (ja) * 1998-09-08 2000-03-31 Nikon Corp 投影露光装置及び投影露光方法
JP3983387B2 (ja) * 1998-09-29 2007-09-26 日本碍子株式会社 静電チャック
US6570752B2 (en) * 1999-12-28 2003-05-27 Nikon Corporation Wafer chucks and the like including substrate-adhesion detection and adhesion correction
TW473792B (en) * 2000-01-20 2002-01-21 Ngk Insulators Ltd Electrostatic chuck
WO2001056074A1 (en) * 2000-01-28 2001-08-02 Hitachi Tokyo Electronics Co., Ltd. Wafer chuck, exposure system, and method of manufacturing semiconductor device
JP2001332609A (ja) * 2000-03-13 2001-11-30 Nikon Corp 基板保持装置及び露光装置
JP4312394B2 (ja) * 2001-01-29 2009-08-12 日本碍子株式会社 静電チャックおよび基板処理装置
US6628503B2 (en) * 2001-03-13 2003-09-30 Nikon Corporation Gas cooled electrostatic pin chuck for vacuum applications
JP4288694B2 (ja) * 2001-12-20 2009-07-01 株式会社ニコン 基板保持装置、露光装置及びデバイス製造方法
US6905984B2 (en) * 2003-10-10 2005-06-14 Axcelis Technologies, Inc. MEMS based contact conductivity electrostatic chuck

Also Published As

Publication number Publication date
TWI331703B (enExample) 2010-10-11
DE602004008009D1 (de) 2007-09-20
DE602004008009T2 (de) 2008-04-30
US7307696B2 (en) 2007-12-11
US20050122503A1 (en) 2005-06-09
JP2005142570A (ja) 2005-06-02
KR20050043673A (ko) 2005-05-11
TW200527153A (en) 2005-08-16
EP1530088A1 (en) 2005-05-11
CN100504607C (zh) 2009-06-24
CN1614511A (zh) 2005-05-11
EP1530088B1 (en) 2007-08-08
SG111314A1 (en) 2005-05-30
KR100700372B1 (ko) 2007-03-27

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