TWI331703B - - Google Patents
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- Publication number
- TWI331703B TWI331703B TW093133668A TW93133668A TWI331703B TW I331703 B TWI331703 B TW I331703B TW 093133668 A TW093133668 A TW 093133668A TW 93133668 A TW93133668 A TW 93133668A TW I331703 B TWI331703 B TW I331703B
- Authority
- TW
- Taiwan
- Prior art keywords
- backfill gas
- gas discharge
- discharge zone
- support
- backfill
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims description 65
- 238000000059 patterning Methods 0.000 claims description 45
- 238000001459 lithography Methods 0.000 claims description 31
- 230000005855 radiation Effects 0.000 claims description 30
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 230000002829 reductive effect Effects 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- 238000005286 illumination Methods 0.000 claims description 5
- 239000004973 liquid crystal related substance Substances 0.000 claims description 3
- 230000005381 magnetic domain Effects 0.000 claims description 3
- 230000015654 memory Effects 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 206010011224 Cough Diseases 0.000 claims 1
- 210000002784 stomach Anatomy 0.000 claims 1
- 239000007789 gas Substances 0.000 description 75
- 238000007789 sealing Methods 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 230000002452 interceptive effect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 244000144730 Amygdalus persica Species 0.000 description 1
- 244000046052 Phaseolus vulgaris Species 0.000 description 1
- 235000010627 Phaseolus vulgaris Nutrition 0.000 description 1
- 235000006040 Prunus persica var persica Nutrition 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 210000003128 head Anatomy 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 235000021251 pulses Nutrition 0.000 description 1
- 210000001747 pupil Anatomy 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 235000019640 taste Nutrition 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
- G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Public Health (AREA)
- Epidemiology (AREA)
- Environmental & Geological Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP03078504 | 2003-11-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200527153A TW200527153A (en) | 2005-08-16 |
| TWI331703B true TWI331703B (enExample) | 2010-10-11 |
Family
ID=34626394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093133668A TW200527153A (en) | 2003-11-05 | 2004-11-04 | Lithographic apparatus and device manufacturing method |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7307696B2 (enExample) |
| EP (1) | EP1530088B1 (enExample) |
| JP (1) | JP4451280B2 (enExample) |
| KR (1) | KR100700372B1 (enExample) |
| CN (1) | CN100504607C (enExample) |
| DE (1) | DE602004008009T2 (enExample) |
| SG (1) | SG111314A1 (enExample) |
| TW (1) | TW200527153A (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100382275C (zh) * | 2004-10-29 | 2008-04-16 | 东京毅力科创株式会社 | 基板载置台、基板处理装置及基板的温度控制方法 |
| US7834974B2 (en) | 2005-06-28 | 2010-11-16 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7978308B2 (en) * | 2006-05-15 | 2011-07-12 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7593096B2 (en) | 2006-05-15 | 2009-09-22 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| CN101495922B (zh) * | 2006-07-28 | 2012-12-12 | 迈普尔平版印刷Ip有限公司 | 光刻系统、热消散方法和框架 |
| TWI541615B (zh) * | 2007-07-13 | 2016-07-11 | 瑪波微影Ｉｐ公司 | 在微影裝置中交換晶圓的方法 |
| JP5866323B2 (ja) * | 2007-07-13 | 2016-02-17 | マッパー・リソグラフィー・アイピー・ビー．ブイ． | リソグラフィシステム、クランプ方法及びウェーハテーブル |
| US8705010B2 (en) | 2007-07-13 | 2014-04-22 | Mapper Lithography Ip B.V. | Lithography system, method of clamping and wafer table |
| CN102067039B (zh) * | 2008-08-08 | 2014-04-09 | Asml荷兰有限公司 | 光刻设备和器件制造方法 |
| JP6099883B2 (ja) * | 2011-05-24 | 2017-03-22 | エーエスエムエル ネザーランズ ビー．ブイ． | リソグラフィ装置及び部品 |
| NL2008980A (en) | 2011-07-11 | 2013-01-14 | Asml Netherlands Bv | A fluid handling structure, a lithographic apparatus and a device manufacturing method. |
| JP5778093B2 (ja) * | 2011-08-10 | 2015-09-16 | エーエスエムエル ネザーランズ ビー．ブイ． | 基板テーブルアセンブリ、液浸リソグラフィ装置及びデバイス製造方法 |
| NL2009189A (en) | 2011-08-17 | 2013-02-19 | Asml Netherlands Bv | Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method. |
| US10937684B2 (en) | 2012-11-28 | 2021-03-02 | Kyocera Corporation | Placement member and method of manufacturing the same |
| US10339260B2 (en) * | 2013-09-06 | 2019-07-02 | Asml Netherlands B.V. | Methodology to generate guiding templates for directed self-assembly |
| JP6244454B2 (ja) | 2013-09-27 | 2017-12-06 | エーエスエムエル ネザーランズ ビー．ブイ． | リソグラフィ装置のための支持テーブル、リソグラフィ装置、及び、デバイス製造方法 |
| US10418266B2 (en) | 2013-11-22 | 2019-09-17 | Kyocera Corporation | Electrostatic chuck |
| JP6317825B2 (ja) * | 2014-04-30 | 2018-04-25 | エーエスエムエル ネザーランズ ビー．ブイ． | リソグラフィ装置のためのサポートテーブル、リソグラフィ装置及びデバイス製造方法 |
| CN110068991B (zh) * | 2014-10-23 | 2021-03-12 | Asml荷兰有限公司 | 用于光刻设备的支撑台和光刻设备 |
| NL2017357A (en) * | 2015-09-28 | 2017-09-01 | Asml Netherlands Bv | A Substrate Holder, a Lithographic Apparatus and Method of Manufacturing Devices |
| WO2017102162A1 (en) | 2015-12-15 | 2017-06-22 | Asml Netherlands B.V. | A substrate holder, a lithographic apparatus and method of manufacturing devices |
| KR102411272B1 (ko) | 2018-03-26 | 2022-06-22 | 엔지케이 인슐레이터 엘티디 | 정전척 히터 |
| US20220082945A1 (en) * | 2018-12-28 | 2022-03-17 | Asml Netherlands B.V. | Substrate holder for use in a lithographic apparatus and a method of manufacturing a substrate holder |
| EP3851916A1 (en) | 2020-01-17 | 2021-07-21 | ASML Netherlands B.V. | Suction clamp, object handler, stage apparatus and lithographic apparatus |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09172055A (ja) * | 1995-12-19 | 1997-06-30 | Fujitsu Ltd | 静電チャック及びウエハの吸着方法 |
| JP3814359B2 (ja) * | 1996-03-12 | 2006-08-30 | キヤノン株式会社 | Ｘ線投影露光装置及びデバイス製造方法 |
| US5835334A (en) * | 1996-09-30 | 1998-11-10 | Lam Research | Variable high temperature chuck for high density plasma chemical vapor deposition |
| US6033478A (en) * | 1996-11-05 | 2000-03-07 | Applied Materials, Inc. | Wafer support with improved temperature control |
| US5997963A (en) * | 1998-05-05 | 1999-12-07 | Ultratech Stepper, Inc. | Microchamber |
| JP2000091220A (ja) * | 1998-09-08 | 2000-03-31 | Nikon Corp | 投影露光装置及び投影露光方法 |
| JP3983387B2 (ja) * | 1998-09-29 | 2007-09-26 | 日本碍子株式会社 | 静電チャック |
| US6570752B2 (en) * | 1999-12-28 | 2003-05-27 | Nikon Corporation | Wafer chucks and the like including substrate-adhesion detection and adhesion correction |
| TW473792B (en) * | 2000-01-20 | 2002-01-21 | Ngk Insulators Ltd | Electrostatic chuck |
| KR100804006B1 (ko) * | 2000-01-28 | 2008-02-18 | 히다치 도쿄 에렉트로닉스 가부시키가이샤 | 웨이퍼 척 |
| JP2001332609A (ja) * | 2000-03-13 | 2001-11-30 | Nikon Corp | 基板保持装置及び露光装置 |
| JP4312394B2 (ja) * | 2001-01-29 | 2009-08-12 | 日本碍子株式会社 | 静電チャックおよび基板処理装置 |
| US6628503B2 (en) * | 2001-03-13 | 2003-09-30 | Nikon Corporation | Gas cooled electrostatic pin chuck for vacuum applications |
| JP4288694B2 (ja) * | 2001-12-20 | 2009-07-01 | 株式会社ニコン | 基板保持装置、露光装置及びデバイス製造方法 |
| US6905984B2 (en) * | 2003-10-10 | 2005-06-14 | Axcelis Technologies, Inc. | MEMS based contact conductivity electrostatic chuck |
-
2004
- 2004-10-25 EP EP04077933A patent/EP1530088B1/en not_active Expired - Lifetime
- 2004-10-25 DE DE602004008009T patent/DE602004008009T2/de not_active Expired - Lifetime
- 2004-11-02 SG SG200407087A patent/SG111314A1/en unknown
- 2004-11-04 TW TW093133668A patent/TW200527153A/zh not_active IP Right Cessation
- 2004-11-04 KR KR1020040089338A patent/KR100700372B1/ko not_active Expired - Fee Related
- 2004-11-04 US US10/980,833 patent/US7307696B2/en not_active Expired - Fee Related
- 2004-11-04 CN CNB2004100903705A patent/CN100504607C/zh not_active Expired - Fee Related
- 2004-11-05 JP JP2004321463A patent/JP4451280B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN100504607C (zh) | 2009-06-24 |
| DE602004008009D1 (de) | 2007-09-20 |
| JP4451280B2 (ja) | 2010-04-14 |
| EP1530088B1 (en) | 2007-08-08 |
| EP1530088A1 (en) | 2005-05-11 |
| JP2005142570A (ja) | 2005-06-02 |
| CN1614511A (zh) | 2005-05-11 |
| KR100700372B1 (ko) | 2007-03-27 |
| TW200527153A (en) | 2005-08-16 |
| SG111314A1 (en) | 2005-05-30 |
| KR20050043673A (ko) | 2005-05-11 |
| US20050122503A1 (en) | 2005-06-09 |
| DE602004008009T2 (de) | 2008-04-30 |
| US7307696B2 (en) | 2007-12-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |