TW200527153A - Lithographic apparatus and device manufacturing method - Google Patents

Lithographic apparatus and device manufacturing method Download PDF

Info

Publication number
TW200527153A
TW200527153A TW093133668A TW93133668A TW200527153A TW 200527153 A TW200527153 A TW 200527153A TW 093133668 A TW093133668 A TW 093133668A TW 93133668 A TW93133668 A TW 93133668A TW 200527153 A TW200527153 A TW 200527153A
Authority
TW
Taiwan
Prior art keywords
support
area
backfill gas
gas
lithographic apparatus
Prior art date
Application number
TW093133668A
Other languages
English (en)
Chinese (zh)
Other versions
TWI331703B (enExample
Inventor
Joost Jeroen Ottens
Sjoerd Nicolaas Lambertus Donders
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of TW200527153A publication Critical patent/TW200527153A/zh
Application granted granted Critical
Publication of TWI331703B publication Critical patent/TWI331703B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • H10P72/0432—

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW093133668A 2003-11-05 2004-11-04 Lithographic apparatus and device manufacturing method TW200527153A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP03078504 2003-11-05

Publications (2)

Publication Number Publication Date
TW200527153A true TW200527153A (en) 2005-08-16
TWI331703B TWI331703B (enExample) 2010-10-11

Family

ID=34626394

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093133668A TW200527153A (en) 2003-11-05 2004-11-04 Lithographic apparatus and device manufacturing method

Country Status (8)

Country Link
US (1) US7307696B2 (enExample)
EP (1) EP1530088B1 (enExample)
JP (1) JP4451280B2 (enExample)
KR (1) KR100700372B1 (enExample)
CN (1) CN100504607C (enExample)
DE (1) DE602004008009T2 (enExample)
SG (1) SG111314A1 (enExample)
TW (1) TW200527153A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI587073B (zh) * 2013-09-06 2017-06-11 Ａｓｍｌ荷蘭公司 用於產生定向自組裝之引導模板之方法

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100382275C (zh) * 2004-10-29 2008-04-16 东京毅力科创株式会社 基板载置台、基板处理装置及基板的温度控制方法
US7834974B2 (en) 2005-06-28 2010-11-16 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7978308B2 (en) * 2006-05-15 2011-07-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7593096B2 (en) * 2006-05-15 2009-09-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2008013443A2 (en) * 2006-07-28 2008-01-31 Mapper Lithography Ip B.V. Lithography system, method of heat dissipation and frame
US8705010B2 (en) 2007-07-13 2014-04-22 Mapper Lithography Ip B.V. Lithography system, method of clamping and wafer table
TWI541615B (zh) 2007-07-13 2016-07-11 瑪波微影Ｉｐ公司 在微影裝置中交換晶圓的方法
JP5766758B2 (ja) * 2007-07-13 2015-08-19 マッパー・リソグラフィー・アイピー・ビー．ブイ． リソグラフィシステム、クランプ方法及びウェーハテーブル
NL2003258A1 (nl) * 2008-08-08 2010-02-09 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
NL2008845A (en) * 2011-05-24 2012-11-27 Asml Netherlands Bv Lithographic apparatus and component.
NL2008980A (en) 2011-07-11 2013-01-14 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
JP5778093B2 (ja) * 2011-08-10 2015-09-16 エーエスエムエル ネザーランズ ビー．ブイ． 基板テーブルアセンブリ、液浸リソグラフィ装置及びデバイス製造方法
NL2009189A (en) 2011-08-17 2013-02-19 Asml Netherlands Bv Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method.
WO2014084060A1 (ja) * 2012-11-28 2014-06-05 京セラ株式会社 載置用部材およびその製造方法
CN105683839B (zh) 2013-09-27 2017-08-08 Asml荷兰有限公司 用于光刻设备的支撑台、光刻设备以及器件制造方法
JP6139698B2 (ja) 2013-11-22 2017-05-31 京セラ株式会社 静電チャック
NL2014516A (en) * 2014-04-30 2016-03-08 Asml Netherlands Bv Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method.
CN107077078B (zh) 2014-10-23 2019-04-09 Asml荷兰有限公司 用于光刻设备的支撑台、加载衬底的方法、光刻设备和器件制造方法
US10599049B2 (en) * 2015-09-28 2020-03-24 Asml Netherlands B.V. Substrate holder, a lithographic apparatus and method of manufacturing devices
CN108292109B (zh) * 2015-12-15 2020-05-12 Asml荷兰有限公司 衬底保持器、光刻设备及制造器件的方法
WO2019187785A1 (ja) * 2018-03-26 2019-10-03 日本碍子株式会社 静電チャックヒータ
EP3903152A1 (en) * 2018-12-28 2021-11-03 ASML Netherlands B.V. Substrate holder for use in a lithographic apparatus and a method of manufacturing a substrate holder
EP3851916A1 (en) 2020-01-17 2021-07-21 ASML Netherlands B.V. Suction clamp, object handler, stage apparatus and lithographic apparatus

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09172055A (ja) * 1995-12-19 1997-06-30 Fujitsu Ltd 静電チャック及びウエハの吸着方法
JP3814359B2 (ja) * 1996-03-12 2006-08-30 キヤノン株式会社 Ｘ線投影露光装置及びデバイス製造方法
US5835334A (en) * 1996-09-30 1998-11-10 Lam Research Variable high temperature chuck for high density plasma chemical vapor deposition
US6033478A (en) * 1996-11-05 2000-03-07 Applied Materials, Inc. Wafer support with improved temperature control
US5997963A (en) * 1998-05-05 1999-12-07 Ultratech Stepper, Inc. Microchamber
JP2000091220A (ja) * 1998-09-08 2000-03-31 Nikon Corp 投影露光装置及び投影露光方法
JP3983387B2 (ja) * 1998-09-29 2007-09-26 日本碍子株式会社 静電チャック
US6570752B2 (en) * 1999-12-28 2003-05-27 Nikon Corporation Wafer chucks and the like including substrate-adhesion detection and adhesion correction
TW473792B (en) * 2000-01-20 2002-01-21 Ngk Insulators Ltd Electrostatic chuck
WO2001056074A1 (en) * 2000-01-28 2001-08-02 Hitachi Tokyo Electronics Co., Ltd. Wafer chuck, exposure system, and method of manufacturing semiconductor device
JP2001332609A (ja) * 2000-03-13 2001-11-30 Nikon Corp 基板保持装置及び露光装置
JP4312394B2 (ja) * 2001-01-29 2009-08-12 日本碍子株式会社 静電チャックおよび基板処理装置
US6628503B2 (en) * 2001-03-13 2003-09-30 Nikon Corporation Gas cooled electrostatic pin chuck for vacuum applications
JP4288694B2 (ja) * 2001-12-20 2009-07-01 株式会社ニコン 基板保持装置、露光装置及びデバイス製造方法
US6905984B2 (en) * 2003-10-10 2005-06-14 Axcelis Technologies, Inc. MEMS based contact conductivity electrostatic chuck

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI587073B (zh) * 2013-09-06 2017-06-11 Ａｓｍｌ荷蘭公司 用於產生定向自組裝之引導模板之方法

Also Published As

Publication number Publication date
TWI331703B (enExample) 2010-10-11
DE602004008009D1 (de) 2007-09-20
DE602004008009T2 (de) 2008-04-30
JP4451280B2 (ja) 2010-04-14
US7307696B2 (en) 2007-12-11
US20050122503A1 (en) 2005-06-09
JP2005142570A (ja) 2005-06-02
KR20050043673A (ko) 2005-05-11
EP1530088A1 (en) 2005-05-11
CN100504607C (zh) 2009-06-24
CN1614511A (zh) 2005-05-11
EP1530088B1 (en) 2007-08-08
SG111314A1 (en) 2005-05-30
KR100700372B1 (ko) 2007-03-27

Similar Documents

Publication Publication Date Title
TW200527153A (en) Lithographic apparatus and device manufacturing method
JP6330853B2 (ja) 露光装置及び露光方法、並びにデバイス製造方法
US7532310B2 (en) Apparatus, method for supporting and/or thermally conditioning a substrate, a support table, and a chuck
TWI284254B (en) Lithographic apparatus and device manufacturing method
EP1187186A1 (en) Exposure method and device
KR100706072B1 (ko) 리소그래피 장치 및 디바이스 제조방법
US20150070666A1 (en) Thermal conditioning unit, lithographic apparatus and device manufacturing method
TW201009506A (en) Lithographic apparatus and method
TW201011484A (en) Lithographic apparatus and device manufacturing method
JP5456848B2 (ja) リソグラフィ装置及びデバイス製造方法
TWI265384B (en) Lithographic apparatus and device manufacturing method
WO2007083686A1 (ja) 露光装置
KR100906438B1 (ko) 아티클 지지체, 리소그래피 장치 및 침지 리소그래피 장치
WO2006080427A1 (ja) 露光方法、露光装置、及びデバイス製造方法
JP2005026285A (ja) 熱処理方法及び熱処理装置
JPWO2000030163A1 (ja) 露光方法及び装置

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees