KR100700372B1 - 리소그래피 장치 및 디바이스 제조방법 - Google Patents

리소그래피 장치 및 디바이스 제조방법 Download PDF

Info

Publication number
KR100700372B1
KR100700372B1 KR1020040089338A KR20040089338A KR100700372B1 KR 100700372 B1 KR100700372 B1 KR 100700372B1 KR 1020040089338 A KR1020040089338 A KR 1020040089338A KR 20040089338 A KR20040089338 A KR 20040089338A KR 100700372 B1 KR100700372 B1 KR 100700372B1
Authority
KR
South Korea
Prior art keywords
support
article
zone
backfill gas
backfill
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020040089338A
Other languages
English (en)
Korean (ko)
Other versions
KR20050043673A (ko
Inventor
오텐스요스트예뢴
돈더스소예르트니콜라스람베르투스
Original Assignee
에이에스엠엘 네델란즈 비.브이.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에이에스엠엘 네델란즈 비.브이. filed Critical 에이에스엠엘 네델란즈 비.브이.
Publication of KR20050043673A publication Critical patent/KR20050043673A/ko
Application granted granted Critical
Publication of KR100700372B1 publication Critical patent/KR100700372B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020040089338A 2003-11-05 2004-11-04 리소그래피 장치 및 디바이스 제조방법 Expired - Fee Related KR100700372B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP03078504.2 2003-11-05
EP03078504 2003-11-05

Publications (2)

Publication Number Publication Date
KR20050043673A KR20050043673A (ko) 2005-05-11
KR100700372B1 true KR100700372B1 (ko) 2007-03-27

Family

ID=34626394

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020040089338A Expired - Fee Related KR100700372B1 (ko) 2003-11-05 2004-11-04 리소그래피 장치 및 디바이스 제조방법

Country Status (8)

Country Link
US (1) US7307696B2 (enExample)
EP (1) EP1530088B1 (enExample)
JP (1) JP4451280B2 (enExample)
KR (1) KR100700372B1 (enExample)
CN (1) CN100504607C (enExample)
DE (1) DE602004008009T2 (enExample)
SG (1) SG111314A1 (enExample)
TW (1) TW200527153A (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100382275C (zh) * 2004-10-29 2008-04-16 东京毅力科创株式会社 基板载置台、基板处理装置及基板的温度控制方法
US7834974B2 (en) 2005-06-28 2010-11-16 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7978308B2 (en) * 2006-05-15 2011-07-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7593096B2 (en) 2006-05-15 2009-09-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN101495922B (zh) * 2006-07-28 2012-12-12 迈普尔平版印刷Ip有限公司 光刻系统、热消散方法和框架
TWI541615B (zh) * 2007-07-13 2016-07-11 瑪波微影Ｉｐ公司 在微影裝置中交換晶圓的方法
JP5866323B2 (ja) * 2007-07-13 2016-02-17 マッパー・リソグラフィー・アイピー・ビー．ブイ． リソグラフィシステム、クランプ方法及びウェーハテーブル
US8705010B2 (en) 2007-07-13 2014-04-22 Mapper Lithography Ip B.V. Lithography system, method of clamping and wafer table
CN102067039B (zh) * 2008-08-08 2014-04-09 Asml荷兰有限公司 光刻设备和器件制造方法
JP6099883B2 (ja) * 2011-05-24 2017-03-22 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置及び部品
NL2008980A (en) 2011-07-11 2013-01-14 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
JP5778093B2 (ja) * 2011-08-10 2015-09-16 エーエスエムエル ネザーランズ ビー．ブイ． 基板テーブルアセンブリ、液浸リソグラフィ装置及びデバイス製造方法
NL2009189A (en) 2011-08-17 2013-02-19 Asml Netherlands Bv Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method.
US10937684B2 (en) 2012-11-28 2021-03-02 Kyocera Corporation Placement member and method of manufacturing the same
US10339260B2 (en) * 2013-09-06 2019-07-02 Asml Netherlands B.V. Methodology to generate guiding templates for directed self-assembly
JP6244454B2 (ja) 2013-09-27 2017-12-06 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置のための支持テーブル、リソグラフィ装置、及び、デバイス製造方法
US10418266B2 (en) 2013-11-22 2019-09-17 Kyocera Corporation Electrostatic chuck
JP6317825B2 (ja) * 2014-04-30 2018-04-25 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置のためのサポートテーブル、リソグラフィ装置及びデバイス製造方法
CN110068991B (zh) * 2014-10-23 2021-03-12 Asml荷兰有限公司 用于光刻设备的支撑台和光刻设备
NL2017357A (en) * 2015-09-28 2017-09-01 Asml Netherlands Bv A Substrate Holder, a Lithographic Apparatus and Method of Manufacturing Devices
WO2017102162A1 (en) 2015-12-15 2017-06-22 Asml Netherlands B.V. A substrate holder, a lithographic apparatus and method of manufacturing devices
KR102411272B1 (ko) 2018-03-26 2022-06-22 엔지케이 인슐레이터 엘티디 정전척 히터
US20220082945A1 (en) * 2018-12-28 2022-03-17 Asml Netherlands B.V. Substrate holder for use in a lithographic apparatus and a method of manufacturing a substrate holder
EP3851916A1 (en) 2020-01-17 2021-07-21 ASML Netherlands B.V. Suction clamp, object handler, stage apparatus and lithographic apparatus

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09172055A (ja) * 1995-12-19 1997-06-30 Fujitsu Ltd 静電チャック及びウエハの吸着方法
JP3814359B2 (ja) * 1996-03-12 2006-08-30 キヤノン株式会社 Ｘ線投影露光装置及びデバイス製造方法
US5835334A (en) * 1996-09-30 1998-11-10 Lam Research Variable high temperature chuck for high density plasma chemical vapor deposition
US6033478A (en) * 1996-11-05 2000-03-07 Applied Materials, Inc. Wafer support with improved temperature control
US5997963A (en) * 1998-05-05 1999-12-07 Ultratech Stepper, Inc. Microchamber
JP2000091220A (ja) * 1998-09-08 2000-03-31 Nikon Corp 投影露光装置及び投影露光方法
JP3983387B2 (ja) * 1998-09-29 2007-09-26 日本碍子株式会社 静電チャック
US6570752B2 (en) * 1999-12-28 2003-05-27 Nikon Corporation Wafer chucks and the like including substrate-adhesion detection and adhesion correction
TW473792B (en) * 2000-01-20 2002-01-21 Ngk Insulators Ltd Electrostatic chuck
KR100804006B1 (ko) * 2000-01-28 2008-02-18 히다치 도쿄 에렉트로닉스 가부시키가이샤 웨이퍼 척
JP2001332609A (ja) * 2000-03-13 2001-11-30 Nikon Corp 基板保持装置及び露光装置
JP4312394B2 (ja) * 2001-01-29 2009-08-12 日本碍子株式会社 静電チャックおよび基板処理装置
US6628503B2 (en) * 2001-03-13 2003-09-30 Nikon Corporation Gas cooled electrostatic pin chuck for vacuum applications
JP4288694B2 (ja) * 2001-12-20 2009-07-01 株式会社ニコン 基板保持装置、露光装置及びデバイス製造方法
US6905984B2 (en) * 2003-10-10 2005-06-14 Axcelis Technologies, Inc. MEMS based contact conductivity electrostatic chuck

Also Published As

Publication number Publication date
CN100504607C (zh) 2009-06-24
DE602004008009D1 (de) 2007-09-20
JP4451280B2 (ja) 2010-04-14
EP1530088B1 (en) 2007-08-08
EP1530088A1 (en) 2005-05-11
JP2005142570A (ja) 2005-06-02
CN1614511A (zh) 2005-05-11
TW200527153A (en) 2005-08-16
SG111314A1 (en) 2005-05-30
KR20050043673A (ko) 2005-05-11
US20050122503A1 (en) 2005-06-09
TWI331703B (enExample) 2010-10-11
DE602004008009T2 (de) 2008-04-30
US7307696B2 (en) 2007-12-11

Similar Documents

Publication Publication Date Title
KR100700372B1 (ko) 리소그래피 장치 및 디바이스 제조방법
US10527955B2 (en) Lithographic apparatus and device manufacturing method
KR100656580B1 (ko) 리소그래피 장치 및 디바이스 제조방법
JP4473811B2 (ja) リソグラフィ装置およびデバイス製造方法
JP4669033B2 (ja) リソグラフィ装置
CN100451832C (zh) 光刻装置和器件制造方法
KR100706072B1 (ko) 리소그래피 장치 및 디바이스 제조방법
US7119885B2 (en) Lithographic apparatus and device manufacturing method
KR100767089B1 (ko) 리소그래피 장치 및 디바이스 제조방법
KR100620981B1 (ko) 리소그래피장치, 디바이스제조방법 및 기판홀더
US7133120B2 (en) Lithographic apparatus, article support member, and method
US7019820B2 (en) Lithographic apparatus and device manufacturing method

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20130308

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20140314

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20150313

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

FPAY Annual fee payment

Payment date: 20160317

Year of fee payment: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

FPAY Annual fee payment

Payment date: 20170310

Year of fee payment: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

FPAY Annual fee payment

Payment date: 20180309

Year of fee payment: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20190322

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20190322