JP4441033B2 - 半導体基板の表面における金属汚染を低減する方法及び化学溶液 - Google Patents

半導体基板の表面における金属汚染を低減する方法及び化学溶液 Download PDF

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Publication number
JP4441033B2
JP4441033B2 JP2000002644A JP2000002644A JP4441033B2 JP 4441033 B2 JP4441033 B2 JP 4441033B2 JP 2000002644 A JP2000002644 A JP 2000002644A JP 2000002644 A JP2000002644 A JP 2000002644A JP 4441033 B2 JP4441033 B2 JP 4441033B2
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Japan
Prior art keywords
solution
metal
substance
semiconductor substrate
ions
Prior art date
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Expired - Lifetime
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JP2000002644A
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English (en)
Japanese (ja)
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JP2000286222A (ja
JP2000286222A5 (https=
Inventor
ポウル・メルテンス
リー・ローウェンスタイン
ギィ・ヴェレーク
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Interuniversitair Microelektronica Centrum vzw IMEC
Original Assignee
Interuniversitair Microelektronica Centrum vzw IMEC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP99870057A external-priority patent/EP1039518A1/en
Application filed by Interuniversitair Microelektronica Centrum vzw IMEC filed Critical Interuniversitair Microelektronica Centrum vzw IMEC
Publication of JP2000286222A publication Critical patent/JP2000286222A/ja
Publication of JP2000286222A5 publication Critical patent/JP2000286222A5/ja
Application granted granted Critical
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Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/02—Inorganic compounds ; Elemental compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/39—Organic or inorganic per-compounds
    • C11D3/3947—Liquid compositions
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/261—Alcohols; Phenols
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

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  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
JP2000002644A 1999-01-08 2000-01-11 半導体基板の表面における金属汚染を低減する方法及び化学溶液 Expired - Lifetime JP4441033B2 (ja)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
EP99870002 1999-01-08
EP99870003 1999-01-11
EP99870057A EP1039518A1 (en) 1999-03-24 1999-03-24 Chemical solution and method for reducing the metal contamination on the surface of a semiconductor substrate
US13130999P 1999-04-27 1999-04-27
US99870002-5 1999-04-27
US99870057-9 1999-04-27
US60/131309 1999-04-27
US99870003-3 1999-04-27

Publications (3)

Publication Number Publication Date
JP2000286222A JP2000286222A (ja) 2000-10-13
JP2000286222A5 JP2000286222A5 (https=) 2007-02-15
JP4441033B2 true JP4441033B2 (ja) 2010-03-31

Family

ID=27443860

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000002644A Expired - Lifetime JP4441033B2 (ja) 1999-01-08 2000-01-11 半導体基板の表面における金属汚染を低減する方法及び化学溶液

Country Status (2)

Country Link
US (1) US6592676B1 (https=)
JP (1) JP4441033B2 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8092707B2 (en) * 1997-04-30 2012-01-10 3M Innovative Properties Company Compositions and methods for modifying a surface suited for semiconductor fabrication
US8070884B2 (en) * 2005-04-01 2011-12-06 Fsi International, Inc. Methods for rinsing microelectronic substrates utilizing cool rinse fluid within a gas enviroment including a drying enhancement substance
US7732225B2 (en) * 2006-06-29 2010-06-08 Texas Instruments Incorporated Method for measuring contamination in liquids at PPQ levels
CN102632055A (zh) * 2012-03-31 2012-08-15 江苏鑫和泰光电科技有限公司 一种蓝宝石衬底的清洗方法
CN102962226A (zh) * 2012-12-06 2013-03-13 江苏吉星新材料有限公司 蓝宝石衬底晶片抛光后的清洗方法
CN105903694A (zh) * 2016-04-27 2016-08-31 上海超硅半导体有限公司 大尺寸蓝宝石衬底退火前的清洗及背面不良返工方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6160799A (ja) * 1984-08-31 1986-03-28 株式会社東芝 洗浄液
US5158100A (en) * 1989-05-06 1992-10-27 Dainippon Screen Mfg. Co., Ltd. Wafer cleaning method and apparatus therefor
EP0496605B1 (en) 1991-01-24 2001-08-01 Wako Pure Chemical Industries Ltd Surface treating solutions for semiconductors
JP3075290B2 (ja) 1991-02-28 2000-08-14 三菱瓦斯化学株式会社 半導体基板の洗浄液
TW263531B (https=) 1992-03-11 1995-11-21 Mitsubishi Gas Chemical Co
JP2857042B2 (ja) 1993-10-19 1999-02-10 新日本製鐵株式会社 シリコン半導体およびシリコン酸化物の洗浄液
US5656097A (en) * 1993-10-20 1997-08-12 Verteq, Inc. Semiconductor wafer cleaning system
US5466389A (en) 1994-04-20 1995-11-14 J. T. Baker Inc. PH adjusted nonionic surfactant-containing alkaline cleaner composition for cleaning microelectronics substrates
EP1080797A3 (en) * 1994-06-28 2005-10-05 Ebara Corporation Method and apparatus for cleaning workpiece
FR2722511B1 (fr) 1994-07-15 1999-04-02 Ontrak Systems Inc Procede pour enlever les metaux dans un dispositif de recurage
JPH0969509A (ja) * 1995-09-01 1997-03-11 Matsushita Electron Corp 半導体ウェーハの洗浄・エッチング・乾燥装置及びその使用方法
US5845660A (en) * 1995-12-07 1998-12-08 Tokyo Electron Limited Substrate washing and drying apparatus, substrate washing method, and substrate washing apparatus
KR100207469B1 (ko) * 1996-03-07 1999-07-15 윤종용 반도체기판의 세정액 및 이를 사용하는 세정방법
DE19611241A1 (de) 1996-03-21 1997-09-25 Wacker Siltronic Halbleitermat Verfahren zum Trocknen von Gegenständen

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JP2000286222A (ja) 2000-10-13
US6592676B1 (en) 2003-07-15

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