JP4436987B2 - 成膜方法及び装置 - Google Patents

成膜方法及び装置 Download PDF

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Publication number
JP4436987B2
JP4436987B2 JP2001045983A JP2001045983A JP4436987B2 JP 4436987 B2 JP4436987 B2 JP 4436987B2 JP 2001045983 A JP2001045983 A JP 2001045983A JP 2001045983 A JP2001045983 A JP 2001045983A JP 4436987 B2 JP4436987 B2 JP 4436987B2
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Japan
Prior art keywords
substrate
film
sputter
sputter cleaning
film forming
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Expired - Fee Related
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JP2001045983A
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Japanese (ja)
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JP2002249873A5 (enExample
JP2002249873A (ja
Inventor
博 早田
義治 竹内
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Priority to JP2001045983A priority Critical patent/JP4436987B2/ja
Publication of JP2002249873A publication Critical patent/JP2002249873A/ja
Publication of JP2002249873A5 publication Critical patent/JP2002249873A5/ja
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JP2001045983A 2001-02-22 2001-02-22 成膜方法及び装置 Expired - Fee Related JP4436987B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001045983A JP4436987B2 (ja) 2001-02-22 2001-02-22 成膜方法及び装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001045983A JP4436987B2 (ja) 2001-02-22 2001-02-22 成膜方法及び装置

Publications (3)

Publication Number Publication Date
JP2002249873A JP2002249873A (ja) 2002-09-06
JP2002249873A5 JP2002249873A5 (enExample) 2008-01-17
JP4436987B2 true JP4436987B2 (ja) 2010-03-24

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JP2001045983A Expired - Fee Related JP4436987B2 (ja) 2001-02-22 2001-02-22 成膜方法及び装置

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JP (1) JP4436987B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013011072A1 (de) * 2013-07-03 2015-01-08 Oerlikon Trading Ag, Trübbach Targetpräparation

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JP2002249873A (ja) 2002-09-06

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