JP4430669B2 - 非対称導電スペーサを設けるトランジスタの製造方法 - Google Patents
非対称導電スペーサを設けるトランジスタの製造方法 Download PDFInfo
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- 125000006850 spacer group Chemical group 0.000 title claims description 59
- 238000004519 manufacturing process Methods 0.000 title claims 5
- 238000000605 extraction Methods 0.000 claims description 60
- 238000000034 method Methods 0.000 claims description 42
- 239000004065 semiconductor Substances 0.000 claims description 30
- 239000000758 substrate Substances 0.000 claims description 26
- 239000012535 impurity Substances 0.000 claims description 20
- 238000002513 implantation Methods 0.000 claims description 16
- 229910021332 silicide Inorganic materials 0.000 claims description 8
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims description 8
- 239000010408 film Substances 0.000 description 63
- 238000005468 ion implantation Methods 0.000 description 33
- 230000008569 process Effects 0.000 description 28
- 229910052581 Si3N4 Inorganic materials 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 9
- 229920005591 polysilicon Polymers 0.000 description 9
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 238000005229 chemical vapour deposition Methods 0.000 description 7
- 239000002019 doping agent Substances 0.000 description 7
- 239000007943 implant Substances 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 150000002500 ions Chemical class 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- -1 metal oxide compounds Chemical class 0.000 description 5
- 229910052814 silicon oxide Inorganic materials 0.000 description 5
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 229910052796 boron Inorganic materials 0.000 description 4
- 239000003989 dielectric material Substances 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- 239000011574 phosphorus Substances 0.000 description 4
- 229910052785 arsenic Inorganic materials 0.000 description 3
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 2
- 239000006117 anti-reflective coating Substances 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 229910052735 hafnium Inorganic materials 0.000 description 2
- 238000011065 in-situ storage Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- GPBUGPUPKAGMDK-UHFFFAOYSA-N azanylidynemolybdenum Chemical compound [Mo]#N GPBUGPUPKAGMDK-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- MROCJMGDEKINLD-UHFFFAOYSA-N dichlorosilane Chemical compound Cl[SiH2]Cl MROCJMGDEKINLD-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 229910000449 hafnium oxide Inorganic materials 0.000 description 1
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HWEYZGSCHQNNEH-UHFFFAOYSA-N silicon tantalum Chemical compound [Si].[Ta] HWEYZGSCHQNNEH-UHFFFAOYSA-N 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
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Description
技術分野において使用される種々の集積回路形成技術に関連する形で実施することができるが、一般的に実施されるプロセス工程の内、本発明を理解するために必要な部分だけが本明細書に含まれている。
112を有するゲート電極を形成する。ゲート電極116のパターニングは、この分野では良く知られたフォトリソグラフィ処理及び異方性エッチング法またはドライエッチング法を使用して行なう。フォトリソグラフィ処理では、反射防止コーティング(anti−reflective coating:ARC)及びフォトレジストパターニングを使用する。
パントを取り出し導電膜124に導入する。第1イオン注入の間に使用する注入角は、注入元素が主として、取り出し導電部124の内、注入角によって「露出する」部分136に導入されるように作用する。適切な注入角を使用し、そしてウェハ100上のトランジスタが(例えば水平なウェハに対して)適切に傾くようにすることにより、第1イオン注入132が、第1不純物分布を取り出し導電膜124の第1部分136に形成するように作用し、この場合、取り出し膜124の第1部分136は、膜124の内、ゲート電極116の第1サイドウォール112の上に位置する部分を表わす。
0をゲート電極116に短絡させるためのシリサイド連続膜を用いる。本実施形態では、スペーサ構造162は、シリサイドによってソース/ドレイン領域が取り出し部と短絡してしまうことを防止するように作用する。
ゲート構造の3つの部分の各々に印加される共通電圧は、下のチャネル111に対して異なる変調効果を及ぼすことができる。
Claims (4)
- n型の導電性を有するゲート電極を半導体基板の上のゲート誘電体の上方に形成するステップと、
第1取り出し導電スペーサ及び第2取り出し導電スペーサを、ゲート電極の第1サイドウォール及び第2サイドウォールにそれぞれ隣接し、かつ、前記第1取り出し導電スペーサと前記第1サイドウォール、及び、前記第2取り出し導電スペーサと前記第2サイドウォールとの間に、それぞれ誘電体を挟むように形成するステップと、
前記第1取り出し導電スペーサにn型不純物をドープしてn型導電型にすると共に、前記第2取り出し導電スペーサにp型不純物をドープしてp型導電型にするステップと、
ソース領域及びドレイン領域を前記第1及び第2取り出し導電スペーサに自己整合するように形成するために、前記半導体基板にn型不純物をドープするステップと、
を備え、
前記ドレイン領域は前記第2取り出し導電スペーサに近接して配置され、前記ソース領域は前記第1取り出し導電スペーサに近接して配置される、
トランジスタの製造方法。 - 前記ゲート電極と前記第1及び第2取り出し導電スペーサを電気的に接続するシリサイドからなる導電ブリッジを前記ゲート電極上及び前記第1及び第2取り出し導電スペーサ上に形成するステップをさらに備える、請求項1記載のトランジスタの製造方法。
- 前記第1及び第2取り出し導電スペーサを形成する前に、エクステンション注入領域を前記ゲート電極に自己整合させて形成するステップをさらに備える、請求項1記載のトランジスタの製造方法。
- 前記第1取り出し導電スペーサにドープする操作において、前記半導体基板を6°〜60°の範囲の注入角に保持しながら前記n型不純物をイオン注入し、前記第2取り出し導電スペーサにドープする操作において、前記半導体基板を−6°〜−60°の範囲の注入角に保持しながら前記p型不純物をイオン注入する、請求項1記載のトランジスタの製造方法。
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US10/427,141 US6967143B2 (en) | 2003-04-30 | 2003-04-30 | Semiconductor fabrication process with asymmetrical conductive spacers |
PCT/US2004/013377 WO2004100223A2 (en) | 2003-04-30 | 2004-04-30 | Semiconductor fabrication process with asymmetrical conductive spacers |
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JP2006525683A JP2006525683A (ja) | 2006-11-09 |
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JP4430669B2 true JP4430669B2 (ja) | 2010-03-10 |
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US (3) | US6967143B2 (ja) |
JP (1) | JP4430669B2 (ja) |
KR (1) | KR101082772B1 (ja) |
CN (1) | CN100419974C (ja) |
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WO (1) | WO2004100223A2 (ja) |
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- 2004-04-30 KR KR1020057020594A patent/KR101082772B1/ko not_active IP Right Cessation
- 2004-04-30 CN CNB200480011412XA patent/CN100419974C/zh not_active Expired - Fee Related
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KR20170046093A (ko) * | 2015-10-20 | 2017-04-28 | 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 | 게이트 구조물, 반도체 소자 및 반도체 소자 형성 방법 |
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KR101991154B1 (ko) * | 2015-10-20 | 2019-06-19 | 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 | 게이트 구조물, 반도체 소자 및 반도체 소자 형성 방법 |
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Also Published As
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US7109550B2 (en) | 2006-09-19 |
TWI337384B (en) | 2011-02-11 |
CN1781187A (zh) | 2006-05-31 |
WO2004100223A2 (en) | 2004-11-18 |
KR20060004969A (ko) | 2006-01-16 |
US7132704B2 (en) | 2006-11-07 |
US20050124130A1 (en) | 2005-06-09 |
US6967143B2 (en) | 2005-11-22 |
JP2006525683A (ja) | 2006-11-09 |
CN100419974C (zh) | 2008-09-17 |
KR101082772B1 (ko) | 2011-11-11 |
US20040217392A1 (en) | 2004-11-04 |
US20050156237A1 (en) | 2005-07-21 |
TW200504892A (en) | 2005-02-01 |
WO2004100223A3 (en) | 2005-06-16 |
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