JP4413522B2 - 配線転写シートとその製造方法、および配線基板とその製造方法 - Google Patents

配線転写シートとその製造方法、および配線基板とその製造方法 Download PDF

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Publication number
JP4413522B2
JP4413522B2 JP2003115684A JP2003115684A JP4413522B2 JP 4413522 B2 JP4413522 B2 JP 4413522B2 JP 2003115684 A JP2003115684 A JP 2003115684A JP 2003115684 A JP2003115684 A JP 2003115684A JP 4413522 B2 JP4413522 B2 JP 4413522B2
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JP
Japan
Prior art keywords
wiring
electrically insulating
substrate
transfer sheet
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003115684A
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English (en)
Japanese (ja)
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JP2004006829A5 (enExample
JP2004006829A (ja
Inventor
秀樹 東谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2003115684A priority Critical patent/JP4413522B2/ja
Publication of JP2004006829A publication Critical patent/JP2004006829A/ja
Publication of JP2004006829A5 publication Critical patent/JP2004006829A5/ja
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Publication of JP4413522B2 publication Critical patent/JP4413522B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2003115684A 2002-04-25 2003-04-21 配線転写シートとその製造方法、および配線基板とその製造方法 Expired - Fee Related JP4413522B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003115684A JP4413522B2 (ja) 2002-04-25 2003-04-21 配線転写シートとその製造方法、および配線基板とその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002124407 2002-04-25
JP2003115684A JP4413522B2 (ja) 2002-04-25 2003-04-21 配線転写シートとその製造方法、および配線基板とその製造方法

Publications (3)

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JP2004006829A JP2004006829A (ja) 2004-01-08
JP2004006829A5 JP2004006829A5 (enExample) 2006-05-11
JP4413522B2 true JP4413522B2 (ja) 2010-02-10

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JP2003115684A Expired - Fee Related JP4413522B2 (ja) 2002-04-25 2003-04-21 配線転写シートとその製造方法、および配線基板とその製造方法

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JP (1) JP4413522B2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4497952B2 (ja) * 2004-02-23 2010-07-07 クローバー電子工業株式会社 積層配線基板
JP4547164B2 (ja) * 2004-02-27 2010-09-22 日本特殊陶業株式会社 配線基板の製造方法
JP4689263B2 (ja) * 2004-12-21 2011-05-25 日本メクトロン株式会社 積層配線基板およびその製造法
JP2007103440A (ja) * 2005-09-30 2007-04-19 Mitsui Mining & Smelting Co Ltd 配線基板の製造方法および配線基板
KR100787894B1 (ko) 2007-01-24 2007-12-27 삼성전자주식회사 반도체 칩 구조물과 반도체 칩 구조물 제조 방법 그리고반도체 칩 패키지 및 반도체 칩 패키지 제조 방법
KR100905566B1 (ko) * 2007-04-30 2009-07-02 삼성전기주식회사 회로 전사용 캐리어 부재, 이를 이용한 코어리스인쇄회로기판, 및 이들의 제조방법
JP2011035070A (ja) * 2009-07-30 2011-02-17 Toppan Printing Co Ltd 太陽電池モジュール用バックシートおよびその製造方法
JP5226035B2 (ja) * 2010-06-03 2013-07-03 日本メクトロン株式会社 積層配線基板の製造法
KR101465083B1 (ko) * 2013-10-14 2014-11-26 한국생산기술연구원 회로기판의 제조방법
KR101517553B1 (ko) * 2013-10-14 2015-05-04 한국생산기술연구원 회로기판의 제조방법
DE102016123795A1 (de) * 2016-12-08 2018-06-14 Gottfried Wilhelm Leibniz Universität Hannover Verfahren zur Anbringung einer elektrischen Mikrostruktur sowie Elastomerstruktur, Faserverbundbauteil und Reifen
JP6380626B1 (ja) * 2017-07-19 2018-08-29 オムロン株式会社 樹脂構造体の製造方法および樹脂構造体
US20240300205A1 (en) * 2021-02-05 2024-09-12 Toray Industries, Inc. Method of manufacturing laminate, method of manufacturing polymer thin film, and laminate

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