JP4395609B2 - 窒化ガリウム系材料からなる基板 - Google Patents

窒化ガリウム系材料からなる基板 Download PDF

Info

Publication number
JP4395609B2
JP4395609B2 JP2008065209A JP2008065209A JP4395609B2 JP 4395609 B2 JP4395609 B2 JP 4395609B2 JP 2008065209 A JP2008065209 A JP 2008065209A JP 2008065209 A JP2008065209 A JP 2008065209A JP 4395609 B2 JP4395609 B2 JP 4395609B2
Authority
JP
Japan
Prior art keywords
gan
less
gas
substrate
based material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2008065209A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008179536A (ja
Inventor
浩幸 柴田
嘉夫 早稲田
謙司 下山
和正 清見
裕文 長岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tohoku University NUC
Mitsubishi Chemical Corp
Original Assignee
Tohoku University NUC
Mitsubishi Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tohoku University NUC, Mitsubishi Chemical Corp filed Critical Tohoku University NUC
Priority to JP2008065209A priority Critical patent/JP4395609B2/ja
Publication of JP2008179536A publication Critical patent/JP2008179536A/ja
Application granted granted Critical
Publication of JP4395609B2 publication Critical patent/JP4395609B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Crystals, And After-Treatments Of Crystals (AREA)
  • Chemical Vapour Deposition (AREA)
JP2008065209A 2006-03-13 2008-03-14 窒化ガリウム系材料からなる基板 Active JP4395609B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008065209A JP4395609B2 (ja) 2006-03-13 2008-03-14 窒化ガリウム系材料からなる基板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006067907 2006-03-13
JP2008065209A JP4395609B2 (ja) 2006-03-13 2008-03-14 窒化ガリウム系材料からなる基板

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2007056353A Division JP4187175B2 (ja) 2006-03-13 2007-03-06 窒化ガリウム系材料の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009169526A Division JP5105258B2 (ja) 2006-03-13 2009-07-17 窒化ガリウム系材料及びその製造方法

Publications (2)

Publication Number Publication Date
JP2008179536A JP2008179536A (ja) 2008-08-07
JP4395609B2 true JP4395609B2 (ja) 2010-01-13

Family

ID=39723732

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2008065209A Active JP4395609B2 (ja) 2006-03-13 2008-03-14 窒化ガリウム系材料からなる基板
JP2009169526A Active JP5105258B2 (ja) 2006-03-13 2009-07-17 窒化ガリウム系材料及びその製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2009169526A Active JP5105258B2 (ja) 2006-03-13 2009-07-17 窒化ガリウム系材料及びその製造方法

Country Status (1)

Country Link
JP (2) JP4395609B2 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5534172B2 (ja) * 2009-01-08 2014-06-25 三菱化学株式会社 窒化物結晶の製造方法
JP5665171B2 (ja) * 2010-05-14 2015-02-04 住友電気工業株式会社 Iii族窒化物半導体電子デバイス、iii族窒化物半導体電子デバイスを作製する方法
JP2011256082A (ja) * 2010-06-10 2011-12-22 Sumitomo Electric Ind Ltd GaN結晶自立基板およびその製造方法
WO2013058350A1 (ja) * 2011-10-21 2013-04-25 三菱化学株式会社 周期表第13族金属窒化物半導体結晶の製造方法、及び該製造方法により製造される周期表第13族金属窒化物半導体結晶
JP6064695B2 (ja) * 2012-03-22 2017-01-25 三菱化学株式会社 窒化ガリウム結晶、及び窒化ガリウム結晶の製造方法
KR102152786B1 (ko) * 2012-07-13 2020-09-08 갈리움 엔터프라이지즈 피티와이 엘티디 필름 형성 장치 및 방법
JP6835019B2 (ja) * 2018-03-14 2021-02-24 株式会社豊田中央研究所 半導体装置及びその製造方法
JP7552359B2 (ja) * 2018-08-17 2024-09-18 三菱ケミカル株式会社 n型GaN結晶、GaNウエハ、ならびに、GaN結晶、GaNウエハおよび窒化物半導体デバイスの製造方法
KR20220014873A (ko) 2019-05-30 2022-02-07 미쯔비시 케미컬 주식회사 GaN 기판 웨이퍼 및 그 제조 방법
KR102826740B1 (ko) * 2019-05-30 2025-06-27 미쯔비시 케미컬 주식회사 GaN 기판 웨이퍼 및 그 제조 방법
JP7738414B2 (ja) * 2021-06-21 2025-09-12 パナソニックホールディングス株式会社 Iii族化合物半導体結晶の製造装置
JP7215630B1 (ja) 2022-08-22 2023-01-31 信越半導体株式会社 窒化物半導体基板及びその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2415707A (en) * 2004-06-30 2006-01-04 Arima Optoelectronic Vertical hydride vapour phase epitaxy deposition using a homogenising diaphragm

Also Published As

Publication number Publication date
JP2008179536A (ja) 2008-08-07
JP5105258B2 (ja) 2012-12-26
JP2009269816A (ja) 2009-11-19

Similar Documents

Publication Publication Date Title
JP4187175B2 (ja) 窒化ガリウム系材料の製造方法
JP4395609B2 (ja) 窒化ガリウム系材料からなる基板
EP2313543B1 (en) Growth of planar and semi-polar {1 1-2 2} gallium nitride with hydride vapor phase epitaxy (hvpe)
CN101308896B (zh) GaN衬底以及采用该衬底的外延衬底和半导体发光器件
US7847313B2 (en) Group III-V nitride-based semiconductor substrate and group III-V nitride-based light emitting device
US20100200955A1 (en) Group III-V nitride based semiconductor substrate and method of making same
US20100075175A1 (en) Large-area seed for ammonothermal growth of bulk gallium nitride and method of manufacture
US20090098677A1 (en) Group iii-v nitride-based semiconductor substrate, group iii-v nitride-based device and method of fabricating the same
US20160247968A1 (en) Nitride semiconductor wafer, nitride semiconductor element, and method for manufacturing nitride semiconductor wafer
US20070246733A1 (en) Nitride-based semiconductor substrate, method of making the same and epitaxial substrate for nitride-based semiconductor light emitting device
JP4600641B2 (ja) 窒化物半導体自立基板及びそれを用いた窒化物半導体発光素子
JP5638198B2 (ja) ミスカット基板上のレーザダイオード配向
CN103348043A (zh) Iii族氮化物半导体元件制造用基板的制造方法、iii族氮化物半导体自支撑基板或iii族氮化物半导体元件的制造方法、以及iii族氮化物生长用基板
CN100481330C (zh) Ⅲ族氮化物半导体及其制造方法
JP4340866B2 (ja) 窒化物半導体基板及びその製造方法
US7902047B2 (en) Dual chamber system providing simultaneous etch and deposition on opposing substrate sides for growing low defect density epitaxial layers
US20070215901A1 (en) Group III-V nitride-based semiconductor substrate and method of fabricating the same
US6339014B1 (en) Method for growing nitride compound semiconductor
JPH10290051A (ja) 半導体装置とその製造方法
Lee et al. Epitaxial growth of crack-free GaN on patterned Si (111) substrate
WO2013157014A1 (en) Group iii-nitride semiconducting material and a method of manufacturing the same
JP4960621B2 (ja) 窒化物半導体成長基板及びその製造方法
JP2014192246A (ja) 半導体基板およびそれを用いた半導体素子
JP2020070196A (ja) 窒化物半導体層の成長方法
JP2009208989A (ja) 化合物半導体基板およびその製造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080910

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20080910

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20081121

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20081212

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090206

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090518

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090717

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20090831

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20090924

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121030

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4395609

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121030

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20131030

Year of fee payment: 4

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313115

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350