JP4370086B2 - ウェーハ管理システムおよびウェーハ管理方法 - Google Patents

ウェーハ管理システムおよびウェーハ管理方法 Download PDF

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Publication number
JP4370086B2
JP4370086B2 JP2002315860A JP2002315860A JP4370086B2 JP 4370086 B2 JP4370086 B2 JP 4370086B2 JP 2002315860 A JP2002315860 A JP 2002315860A JP 2002315860 A JP2002315860 A JP 2002315860A JP 4370086 B2 JP4370086 B2 JP 4370086B2
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JP
Japan
Prior art keywords
pod
wafer
bay
buffer
storage system
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002315860A
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English (en)
Japanese (ja)
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JP2003188227A5 (OSRAM
JP2003188227A (ja
Inventor
マッゴーワン リチャード
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NXP USA Inc
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NXP USA Inc
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Filing date
Publication date
Application filed by NXP USA Inc filed Critical NXP USA Inc
Publication of JP2003188227A publication Critical patent/JP2003188227A/ja
Publication of JP2003188227A5 publication Critical patent/JP2003188227A5/ja
Application granted granted Critical
Publication of JP4370086B2 publication Critical patent/JP4370086B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
JP2002315860A 2001-10-30 2002-10-30 ウェーハ管理システムおよびウェーハ管理方法 Expired - Fee Related JP4370086B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/016610 2001-10-30
US10/016,610 US6821082B2 (en) 2001-10-30 2001-10-30 Wafer management system and methods for managing wafers

Publications (3)

Publication Number Publication Date
JP2003188227A JP2003188227A (ja) 2003-07-04
JP2003188227A5 JP2003188227A5 (OSRAM) 2005-12-15
JP4370086B2 true JP4370086B2 (ja) 2009-11-25

Family

ID=21778026

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002315860A Expired - Fee Related JP4370086B2 (ja) 2001-10-30 2002-10-30 ウェーハ管理システムおよびウェーハ管理方法

Country Status (2)

Country Link
US (1) US6821082B2 (OSRAM)
JP (1) JP4370086B2 (OSRAM)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6761085B1 (en) * 2002-02-06 2004-07-13 Novellus Systems Incorporated Method and apparatus for damping vibrations in a semiconductor wafer handling arm
JP4096359B2 (ja) * 2003-03-10 2008-06-04 セイコーエプソン株式会社 製造対象物の製造装置
US6990721B2 (en) * 2003-03-21 2006-01-31 Brooks Automation, Inc. Growth model automated material handling system
US6931303B2 (en) * 2003-10-02 2005-08-16 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated transport system
JP4490124B2 (ja) * 2004-01-23 2010-06-23 セイコーエプソン株式会社 搬送状況提示システムおよび方法、プログラム並びに情報記憶媒体
DE102004057754B4 (de) * 2004-11-30 2007-08-09 Steag Hama Tech Ag Verfahren und Vorrichtung zum Behandeln von ein Innenloch aufweisenden Substratscheiben
JP4666213B2 (ja) * 2005-07-05 2011-04-06 株式会社ダイフク 物品収納設備
US8267634B2 (en) * 2005-11-07 2012-09-18 Brooks Automation, Inc. Reduced capacity carrier, transport, load port, buffer system
US20070201967A1 (en) * 2005-11-07 2007-08-30 Bufano Michael L Reduced capacity carrier, transport, load port, buffer system
US7798758B2 (en) * 2005-11-07 2010-09-21 Brooks Automation, Inc. Reduced capacity carrier, transport, load port, buffer system
US20080107507A1 (en) * 2005-11-07 2008-05-08 Bufano Michael L Reduced capacity carrier, transport, load port, buffer system
KR20090003227A (ko) * 2006-03-31 2009-01-09 가부시키가이샤 아이에이치아이 웨이퍼용 보관고 및 그 보관 제어 방법
JP2007317944A (ja) * 2006-05-26 2007-12-06 Toshiba Corp 局所クリーン化ロボット搬送工場及びロボット搬送式製造方法
KR101841753B1 (ko) 2006-08-18 2018-03-23 브룩스 오토메이션 인코퍼레이티드 용량이 축소된 캐리어, 이송, 로드 포트, 버퍼 시스템
JP4670808B2 (ja) * 2006-12-22 2011-04-13 ムラテックオートメーション株式会社 コンテナの搬送システム及び測定用コンテナ
DE102007035836B4 (de) * 2007-07-31 2017-01-26 Globalfoundries Dresden Module One Limited Liability Company & Co. Kg Zweidimensionale Transferstation, die als Schnittstelle zwischen einer Prozessanlage und einem Transportsystem dient, und Verfahren zum Betreiben der Station
CN104979232B (zh) * 2014-04-02 2017-09-22 中芯国际集成电路制造(上海)有限公司 晶圆传送盒的存储方法及实现晶圆传送盒存储的系统

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4178113A (en) * 1977-12-05 1979-12-11 Macronetics, Inc. Buffer storage apparatus for semiconductor wafer processing
US4293249A (en) * 1980-03-03 1981-10-06 Texas Instruments Incorporated Material handling system and method for manufacturing line
US5536128A (en) * 1988-10-21 1996-07-16 Hitachi, Ltd. Method and apparatus for carrying a variety of products
US5668056A (en) * 1990-12-17 1997-09-16 United Microelectronics Corporation Single semiconductor wafer transfer method and manufacturing system
DE69205573T2 (de) * 1992-08-04 1996-06-13 Ibm Fertigungsstrasse Architektur mit vollautomatisierten und rechnergesteuerten Fördereinrichtungen geeignet für abdichtbaren tragbaren unter Druck stehenden Behältern.
US6157866A (en) * 1997-06-19 2000-12-05 Advanced Micro Devices, Inc. Automated material handling system for a manufacturing facility divided into separate fabrication areas
EP0894751B1 (de) * 1997-07-28 2001-11-21 Infineon Technologies AG Transportsystem und Verfahren zur Steuerung des Transportsystems
JPH11121582A (ja) * 1997-10-15 1999-04-30 Mitsubishi Electric Corp 半導体ウェハ製造設備制御方法および半導体ウェハ製造設備
US6223886B1 (en) * 1998-06-24 2001-05-01 Asyst Technologies, Inc. Integrated roller transport pod and asynchronous conveyor
US6016611A (en) * 1998-07-13 2000-01-25 Applied Komatsu Technology, Inc. Gas flow control in a substrate processing system
DE19922936B4 (de) * 1999-05-19 2004-04-29 Infineon Technologies Ag Anlage zur Bearbeitung von Wafern
US6354781B1 (en) * 1999-11-01 2002-03-12 Chartered Semiconductor Manufacturing Company Semiconductor manufacturing system

Also Published As

Publication number Publication date
US6821082B2 (en) 2004-11-23
US20030082032A1 (en) 2003-05-01
JP2003188227A (ja) 2003-07-04

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