JP4368050B2 - セラミック構造体の製造方法 - Google Patents
セラミック構造体の製造方法 Download PDFInfo
- Publication number
- JP4368050B2 JP4368050B2 JP2000294392A JP2000294392A JP4368050B2 JP 4368050 B2 JP4368050 B2 JP 4368050B2 JP 2000294392 A JP2000294392 A JP 2000294392A JP 2000294392 A JP2000294392 A JP 2000294392A JP 4368050 B2 JP4368050 B2 JP 4368050B2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- adhesive layer
- porous ceramic
- porous
- ceramic structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 239000000919 ceramic Substances 0.000 title claims description 176
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 239000012790 adhesive layer Substances 0.000 claims description 59
- 238000010030 laminating Methods 0.000 claims description 7
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 23
- 239000011230 binding agent Substances 0.000 description 17
- 238000005192 partition Methods 0.000 description 16
- 239000007789 gas Substances 0.000 description 15
- 238000000034 method Methods 0.000 description 13
- 239000000853 adhesive Substances 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 12
- 229910021426 porous silicon Inorganic materials 0.000 description 12
- 238000010304 firing Methods 0.000 description 11
- 239000000203 mixture Substances 0.000 description 10
- 238000005238 degreasing Methods 0.000 description 9
- 239000000945 filler Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 239000003566 sealing material Substances 0.000 description 9
- 239000010410 layer Substances 0.000 description 8
- 239000000843 powder Substances 0.000 description 8
- 229910010271 silicon carbide Inorganic materials 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 239000002612 dispersion medium Substances 0.000 description 7
- 239000000835 fiber Substances 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 239000012784 inorganic fiber Substances 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 238000005259 measurement Methods 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical group OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 4
- 239000001768 carboxy methyl cellulose Substances 0.000 description 4
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 4
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 4
- 238000011049 filling Methods 0.000 description 4
- 239000010954 inorganic particle Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 229920000609 methyl cellulose Polymers 0.000 description 3
- 239000001923 methylcellulose Substances 0.000 description 3
- 235000010981 methylcellulose Nutrition 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000011111 cardboard Substances 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- -1 for example Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 description 1
- 239000004354 Hydroxyethyl cellulose Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 150000004676 glycans Chemical class 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001282 polysaccharide Polymers 0.000 description 1
- 239000005017 polysaccharide Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
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- Filtering Materials (AREA)
- Ceramic Products (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000294392A JP4368050B2 (ja) | 2000-09-27 | 2000-09-27 | セラミック構造体の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000294392A JP4368050B2 (ja) | 2000-09-27 | 2000-09-27 | セラミック構造体の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002102627A JP2002102627A (ja) | 2002-04-09 |
| JP2002102627A5 JP2002102627A5 (enExample) | 2005-10-06 |
| JP4368050B2 true JP4368050B2 (ja) | 2009-11-18 |
Family
ID=18777007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000294392A Expired - Lifetime JP4368050B2 (ja) | 2000-09-27 | 2000-09-27 | セラミック構造体の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4368050B2 (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003031371A1 (fr) * | 2001-10-02 | 2003-04-17 | Ngk Insulators, Ltd. | Corps structural en nid d'abeille et procede de fabrication |
| JP4455818B2 (ja) | 2003-01-14 | 2010-04-21 | 日本碍子株式会社 | セラミックハニカム構造体およびその製造方法 |
| JP4267947B2 (ja) * | 2003-03-19 | 2009-05-27 | 日本碍子株式会社 | ハニカム構造体 |
| EP1790623B1 (en) * | 2003-11-12 | 2009-05-13 | Ibiden Co., Ltd. | Method of manufacturing ceramic structure |
| KR101069038B1 (ko) | 2004-12-08 | 2011-09-29 | 에스케이이노베이션 주식회사 | 열처리로 및 허니컴 형태의 세라믹 구조체의 열처리 방법 |
| JPWO2006093231A1 (ja) * | 2005-03-03 | 2008-08-07 | 旭硝子株式会社 | スペーサ付き焼成体、及びその製造方法と接合方法 |
| KR100893514B1 (ko) * | 2005-05-23 | 2009-04-16 | 니뽄 가이시 가부시키가이샤 | 허니컴 구조체 |
| CN100537482C (zh) | 2005-06-24 | 2009-09-09 | 揖斐电株式会社 | 蜂窝结构体 |
| JP5091672B2 (ja) | 2005-06-24 | 2012-12-05 | イビデン株式会社 | ハニカム構造体及びその製造方法 |
| WO2006137155A1 (ja) | 2005-06-24 | 2006-12-28 | Ibiden Co., Ltd. | ハニカム構造体 |
| WO2006137157A1 (ja) * | 2005-06-24 | 2006-12-28 | Ibiden Co., Ltd. | ハニカム構造体 |
| JPWO2006137158A1 (ja) | 2005-06-24 | 2009-01-08 | イビデン株式会社 | ハニカム構造体 |
| JPWO2007023653A1 (ja) * | 2005-08-26 | 2009-02-26 | イビデン株式会社 | ハニカム構造体及びその製造方法 |
| WO2008126334A1 (ja) | 2007-03-30 | 2008-10-23 | Ibiden Co., Ltd. | ハニカム構造体の製造方法 |
| JP5430867B2 (ja) * | 2007-06-21 | 2014-03-05 | イビデン株式会社 | ハニカム構造体、及び、ハニカム構造体の製造方法 |
| WO2008155856A1 (ja) * | 2007-06-21 | 2008-12-24 | Ibiden Co., Ltd. | ハニカム構造体、及び、ハニカム構造体の製造方法 |
| JP5242178B2 (ja) | 2008-01-17 | 2013-07-24 | 日本碍子株式会社 | スペーサー付ハニカムセグメント、及びハニカム構造体 |
| JP5156701B2 (ja) * | 2009-07-13 | 2013-03-06 | 日本碍子株式会社 | セラミックハニカム構造体の製造方法 |
| WO2011121712A1 (ja) | 2010-03-29 | 2011-10-06 | イビデン株式会社 | ハニカム構造体及びハニカム構造体の製造方法 |
| EP2832711A4 (en) * | 2012-03-29 | 2015-06-03 | Ibiden Co Ltd | WABENSTRUCKTUR, WABENFILTER FOR EMISSION CONTROL AND EXHAUST GAS CLEANING DEVICE |
| CN104364224B (zh) * | 2012-06-28 | 2018-07-20 | 陶氏环球技术有限责任公司 | 用于粘接陶瓷过滤器的阵列的方法 |
| JP2016079067A (ja) * | 2014-10-17 | 2016-05-16 | イビデン株式会社 | セラミック構造体並びにその製造方法及び装置 |
| CN109843831A (zh) * | 2016-10-12 | 2019-06-04 | 日本碍子株式会社 | 中间部件 |
| JP7385450B2 (ja) * | 2019-12-05 | 2023-11-22 | 日本碍子株式会社 | ハニカム構造体 |
-
2000
- 2000-09-27 JP JP2000294392A patent/JP4368050B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2002102627A (ja) | 2002-04-09 |
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