JP4366031B2 - 位置検出装置及び方法並びに露光装置、デバイスの製造方法 - Google Patents

位置検出装置及び方法並びに露光装置、デバイスの製造方法 Download PDF

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Publication number
JP4366031B2
JP4366031B2 JP2001282102A JP2001282102A JP4366031B2 JP 4366031 B2 JP4366031 B2 JP 4366031B2 JP 2001282102 A JP2001282102 A JP 2001282102A JP 2001282102 A JP2001282102 A JP 2001282102A JP 4366031 B2 JP4366031 B2 JP 4366031B2
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JP
Japan
Prior art keywords
alignment
alignment mark
imaging optical
imaging
mark
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Expired - Fee Related
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JP2001282102A
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English (en)
Japanese (ja)
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JP2003092247A5 (https=
JP2003092247A (ja
Inventor
和彦 三島
浩 田中
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Canon Inc
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Canon Inc
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Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2001282102A priority Critical patent/JP4366031B2/ja
Priority to US10/242,617 priority patent/US6930016B2/en
Publication of JP2003092247A publication Critical patent/JP2003092247A/ja
Publication of JP2003092247A5 publication Critical patent/JP2003092247A5/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/301—Marks applied to devices, e.g. for alignment or identification for alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/501—Marks applied to devices, e.g. for alignment or identification for use before dicing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/501—Marks applied to devices, e.g. for alignment or identification for use before dicing
    • H10W46/503—Located in scribe lines

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2001282102A 2001-09-17 2001-09-17 位置検出装置及び方法並びに露光装置、デバイスの製造方法 Expired - Fee Related JP4366031B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2001282102A JP4366031B2 (ja) 2001-09-17 2001-09-17 位置検出装置及び方法並びに露光装置、デバイスの製造方法
US10/242,617 US6930016B2 (en) 2001-09-17 2002-09-13 Position detection apparatus and method, exposure apparatus, and device manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001282102A JP4366031B2 (ja) 2001-09-17 2001-09-17 位置検出装置及び方法並びに露光装置、デバイスの製造方法

Publications (3)

Publication Number Publication Date
JP2003092247A JP2003092247A (ja) 2003-03-28
JP2003092247A5 JP2003092247A5 (https=) 2005-04-14
JP4366031B2 true JP4366031B2 (ja) 2009-11-18

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Family Applications (1)

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JP2001282102A Expired - Fee Related JP4366031B2 (ja) 2001-09-17 2001-09-17 位置検出装置及び方法並びに露光装置、デバイスの製造方法

Country Status (2)

Country Link
US (1) US6930016B2 (https=)
JP (1) JP4366031B2 (https=)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003092246A (ja) * 2001-09-17 2003-03-28 Canon Inc アライメントマーク及びアライメント装置とその方法、及び露光装置、デバイスの製造方法
JP2004006527A (ja) * 2002-05-31 2004-01-08 Canon Inc 位置検出装置及び位置検出方法、露光装置、デバイス製造方法並びに基板
JP4235468B2 (ja) * 2003-02-28 2009-03-11 キヤノン株式会社 半導体製造装置
US20040261930A1 (en) * 2003-03-04 2004-12-30 Shibaura Mechatronics Corporation Method of bonding substrates and apparatus for bonding substrates
JP2004296921A (ja) 2003-03-27 2004-10-21 Canon Inc 位置検出装置
JP2005166785A (ja) * 2003-12-01 2005-06-23 Canon Inc 位置検出装置及び方法、並びに、露光装置
JP4298547B2 (ja) * 2004-03-01 2009-07-22 キヤノン株式会社 位置決め装置およびそれを用いた露光装置
JP3880589B2 (ja) 2004-03-31 2007-02-14 キヤノン株式会社 位置計測装置、露光装置及びデバイス製造方法
US7408618B2 (en) * 2005-06-30 2008-08-05 Asml Netherlands B.V. Lithographic apparatus substrate alignment
KR100741989B1 (ko) * 2006-06-23 2007-07-23 삼성전자주식회사 오버레이 마크 및 이를 이용한 오버레이 측정 방법
IL188029A0 (en) * 2007-12-10 2008-11-03 Nova Measuring Instr Ltd Optical method and system
JP5096965B2 (ja) * 2008-02-29 2012-12-12 キヤノン株式会社 位置合わせ方法、位置合わせ装置、露光方法及びデバイス製造方法
WO2012098550A1 (en) * 2011-01-19 2012-07-26 Nova Measuring Instruments Ltd. Optical system and method for measuring in three-dimensional structures
JP5706861B2 (ja) 2011-10-21 2015-04-22 キヤノン株式会社 検出器、検出方法、インプリント装置及び物品製造方法
JP2013149928A (ja) * 2012-01-23 2013-08-01 Canon Inc リソグラフィー装置および物品を製造する方法
JP6025456B2 (ja) * 2012-08-28 2016-11-16 キヤノン株式会社 被検体情報取得装置、表示方法、及びプログラム
US9796045B2 (en) 2013-12-19 2017-10-24 Sunpower Corporation Wafer alignment with restricted visual access
KR102419494B1 (ko) * 2014-09-29 2022-07-12 삼성디스플레이 주식회사 마스크리스 노광 장치, 마스크리스 노광 방법 및 이에 의해 제조되는 표시 기판
JP6426984B2 (ja) * 2014-11-18 2018-11-21 キヤノン株式会社 リソグラフィ装置および物品製造方法
JP6584170B2 (ja) * 2015-07-02 2019-10-02 キヤノン株式会社 検出装置、リソグラフィ装置、物品の製造方法、および検出方法
JP2022117091A (ja) * 2021-01-29 2022-08-10 キヤノン株式会社 計測装置、リソグラフィ装置及び物品の製造方法
US11978677B2 (en) * 2021-06-24 2024-05-07 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer positioning method and apparatus
KR102837207B1 (ko) * 2021-09-08 2025-07-22 주식회사 넥센서 한 번의 스캔 과정시 다수의 영상 정보를 획득하는 입체형상 측정장치
JP7834460B2 (ja) * 2021-12-06 2026-03-24 キヤノン株式会社 検出装置、基板処理装置、及び物品の製造方法
CN118331004A (zh) * 2024-05-11 2024-07-12 新毅东(上海)科技有限公司 光罩版对准方法
CN118519322A (zh) * 2024-05-24 2024-08-20 新毅东(上海)科技有限公司 一种硅片对准方法及硅片对准系统

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2756620B2 (ja) 1992-01-10 1998-05-25 キヤノン株式会社 半導体露光方法およびその装置
JP3647100B2 (ja) 1995-01-12 2005-05-11 キヤノン株式会社 検査装置およびこれを用いた露光装置やデバイス生産方法
US5841520A (en) * 1995-08-09 1998-11-24 Nikon Corporatioin Exposure apparatus and method that use mark patterns to determine image formation characteristics of the apparatus prior to exposure
JP3327781B2 (ja) 1995-10-13 2002-09-24 キヤノン株式会社 位置検出装置及びその検定方法と調整方法
US6049373A (en) * 1997-02-28 2000-04-11 Sumitomo Heavy Industries, Ltd. Position detection technique applied to proximity exposure
JPH11211415A (ja) 1998-01-29 1999-08-06 Canon Inc 位置検出装置及びそれを用いたデバイスの製造方法

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Publication number Publication date
US20030053059A1 (en) 2003-03-20
US6930016B2 (en) 2005-08-16
JP2003092247A (ja) 2003-03-28

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