JP4331179B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP4331179B2 JP4331179B2 JP2006075816A JP2006075816A JP4331179B2 JP 4331179 B2 JP4331179 B2 JP 4331179B2 JP 2006075816 A JP2006075816 A JP 2006075816A JP 2006075816 A JP2006075816 A JP 2006075816A JP 4331179 B2 JP4331179 B2 JP 4331179B2
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Description
2 第2の半導体チップ
3 第1の半導体チップの電極パッド
4 第2の半導体チップの電極パッド
5 スタッドバンプ(Auバンプ)
6 導電ペースト
7 Auワイヤ
8 1st側(ボール側)
9 2nd側(クレセント側)
10 キャピラリ
11 第2の半導体チップのたわみ量
12 クラック
13 アンダーフィル樹脂
14 接着剤
15 接着剤の断面形状
16 スペーサ
17 受動部品
18 はんだ付け部
19 シート基板
20 キャリア基板
21 基板配線
22 第1の半導体チップ用の電極
23 第2の半導体チップ用の電極
24 外部端子
25 封止樹脂
26 モールドライン
27 ダイシングソー
28 製品分割ライン
29 ノズル
30 第1の半導体チップ裏面の面取り部
Claims (4)
- 第1の配線電極と第2の配線電極を有する配線基板上に、前記第1の配線電極と接続される電極を表面に有する第1の半導体チップと、前記第1の半導体チップよりも大きく表面の少なくとも周辺に前記第2の配線電極と金属細線により電気的に接続される電極を有する第2の半導体チップとを実装した半導体装置であって、
前記第1の半導体チップは、回路素子や内層回路配線の上に電極パッドを有しており、
前記第1の半導体チップの裏面と前記第2の半導体チップの裏面が接着剤により接着されるとともに、前記接着剤の側部は、前記第1の半導体チップの端部から、前記第2の半導体チップの第1の半導体チップ側面よりはみ出した部分に向かって傾斜し、かつ外側上方に向かって凹曲面形状であり、
前記第1の半導体チップの裏面のコーナー周縁部は面取りされ、接着剤が前記面取りされた部分に形成され、
前記第1の半導体チップの裏面と前記第2の半導体チップの裏面の接着剤と前記第2の半導体チップの第1の半導体チップ側面よりはみ出した部分の接着剤は同じ材料からなることを特徴とする半導体装置。 - 第1の配線電極と第2の配線電極を有する配線基板上に、前記第1の配線電極と接続される電極を表面に有する第1の半導体チップと、前記第1の半導体チップよりも大きく表面の少なくとも周辺に前記第2の配線電極と金属細線により電気的に接続される電極を有する第2の半導体チップとを実装した半導体装置であって、
前記第1の半導体チップは、回路素子や内層回路配線の上に電極パッドを有しており、
前記第1の半導体チップの裏面と前記第2の半導体チップの裏面が接着剤により接着されるとともに、前記接着剤の側部は、前記第1の半導体チップの端部から、前記第2の半導体チップの第1の半導体チップ側面よりはみ出した部分に向かって傾斜し、かつ前記接着剤は、第1の半導体チップの裏面の全領域および側面の一部に形成され、
前記第1の半導体チップの裏面のコーナー周縁部は面取りされ、接着剤が前記面取りされた部分に形成され、
前記第1の半導体チップの裏面と前記第2の半導体チップの裏面の接着剤と前記第2の半導体チップの第1の半導体チップ側面よりはみ出した部分の接着剤は同じ材料からなることを特徴とする半導体装置。 - 第1の配線電極と第2の配線電極を有する配線基板上に、前記第1の配線電極と接続される電極を表面に有する第1の半導体チップと、前記第1の半導体チップよりも大きく表面の少なくとも周辺に前記第2の配線電極と金属細線により電気的に接続される電極を有する第2の半導体チップとを実装した半導体装置であって、
前記第1の半導体チップは、回路素子や内層回路配線の上に電極パッドを有しており、
前記第1の半導体チップの裏面と前記第2の半導体チップの裏面が接着剤により接着されるとともに、前記接着剤の側部は、前記第1の半導体チップの端部から、前記第2の半導体チップの第1の半導体チップ側面よりはみ出した部分に向かって傾斜し、前記配線基板と第1の半導体チップとの間にアンダーフィル樹脂が形成され、前記アンダーフィル樹脂の側面の少なくとも一部が前記接着剤により覆われており、
前記第1の半導体チップの裏面と前記第2の半導体チップの裏面の接着剤と前記第2の半導体チップの第1の半導体チップ側面よりはみ出した部分の接着剤は同じ材料からなることを特徴とする半導体装置。 - 前記第1の半導体チップの裏面のコーナー周縁部は面取りされ、接着剤が前記面取りされた部分に形成されていることを特徴とする請求項3に記載の半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2006075816A JP4331179B2 (ja) | 2006-03-20 | 2006-03-20 | 半導体装置 |
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JP2006075816A JP4331179B2 (ja) | 2006-03-20 | 2006-03-20 | 半導体装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2003020313A Division JP3819851B2 (ja) | 2003-01-29 | 2003-01-29 | 半導体装置およびその製造方法 |
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