JP4294710B2 - 酸化セリウム及びその製造方法 - Google Patents

酸化セリウム及びその製造方法 Download PDF

Info

Publication number
JP4294710B2
JP4294710B2 JP2007237484A JP2007237484A JP4294710B2 JP 4294710 B2 JP4294710 B2 JP 4294710B2 JP 2007237484 A JP2007237484 A JP 2007237484A JP 2007237484 A JP2007237484 A JP 2007237484A JP 4294710 B2 JP4294710 B2 JP 4294710B2
Authority
JP
Japan
Prior art keywords
cerium oxide
cerium
polishing
slurry
hydroxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2007237484A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009067627A5 (enExample
JP2009067627A (ja
Inventor
宗二 小倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Kinzoku Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Priority to JP2007237484A priority Critical patent/JP4294710B2/ja
Priority to US12/514,824 priority patent/US20100058671A1/en
Priority to DE112008000366T priority patent/DE112008000366T5/de
Priority to KR1020097011413A priority patent/KR20090079976A/ko
Priority to PCT/JP2008/065937 priority patent/WO2009034905A1/ja
Publication of JP2009067627A publication Critical patent/JP2009067627A/ja
Publication of JP2009067627A5 publication Critical patent/JP2009067627A5/ja
Application granted granted Critical
Publication of JP4294710B2 publication Critical patent/JP4294710B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F17/00—Compounds of rare earth metals
    • C01F17/20—Compounds containing only rare earth metals as the metal element
    • C01F17/206—Compounds containing only rare earth metals as the metal element oxide or hydroxide being the only anion
    • C01F17/224—Oxides or hydroxides of lanthanides
    • C01F17/235—Cerium oxides or hydroxides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J23/00—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00
    • B01J23/38—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals
    • B01J23/54—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals combined with metals, oxides or hydroxides provided for in groups B01J23/02 - B01J23/36
    • B01J23/56—Platinum group metals
    • B01J23/63—Platinum group metals with rare earths or actinides
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F17/00—Compounds of rare earth metals
    • C01F17/10—Preparation or treatment, e.g. separation or purification
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/60—Compounds characterised by their crystallite size
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/01—Particle morphology depicted by an image
    • C01P2004/04—Particle morphology depicted by an image obtained by TEM, STEM, STM or AFM
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/54—Particles characterised by their aspect ratio, i.e. the ratio of sizes in the longest to the shortest dimension
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/22—Rheological behaviour as dispersion, e.g. viscosity, sedimentation stability
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Nanotechnology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Composite Materials (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2007237484A 2007-09-13 2007-09-13 酸化セリウム及びその製造方法 Active JP4294710B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2007237484A JP4294710B2 (ja) 2007-09-13 2007-09-13 酸化セリウム及びその製造方法
US12/514,824 US20100058671A1 (en) 2007-09-13 2008-09-04 Cerium oxide and method for producing the same
DE112008000366T DE112008000366T5 (de) 2007-09-13 2008-09-04 Ceroxid und Verfahren zu dessen Herstellung
KR1020097011413A KR20090079976A (ko) 2007-09-13 2008-09-04 산화세륨 및 그 제조 방법
PCT/JP2008/065937 WO2009034905A1 (ja) 2007-09-13 2008-09-04 酸化セリウム及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007237484A JP4294710B2 (ja) 2007-09-13 2007-09-13 酸化セリウム及びその製造方法

Publications (3)

Publication Number Publication Date
JP2009067627A JP2009067627A (ja) 2009-04-02
JP2009067627A5 JP2009067627A5 (enExample) 2009-05-14
JP4294710B2 true JP4294710B2 (ja) 2009-07-15

Family

ID=40451914

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007237484A Active JP4294710B2 (ja) 2007-09-13 2007-09-13 酸化セリウム及びその製造方法

Country Status (5)

Country Link
US (1) US20100058671A1 (enExample)
JP (1) JP4294710B2 (enExample)
KR (1) KR20090079976A (enExample)
DE (1) DE112008000366T5 (enExample)
WO (1) WO2009034905A1 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010275179A (ja) * 2009-04-28 2010-12-09 Tsurumi Soda Co Ltd セリウムの回収方法
JP5574527B2 (ja) * 2009-12-25 2014-08-20 日揮触媒化成株式会社 酸化セリウム微粒子の製造方法
WO2011111421A1 (ja) * 2010-03-12 2011-09-15 日立化成工業株式会社 スラリ、研磨液セット、研磨液及びこれらを用いた基板の研磨方法
US9988573B2 (en) * 2010-11-22 2018-06-05 Hitachi Chemical Company, Ltd. Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate
CN103409108B (zh) 2010-11-22 2015-04-22 日立化成株式会社 悬浮液、研磨液套剂、研磨液、基板的研磨方法及基板
US9039796B2 (en) * 2010-11-22 2015-05-26 Hitachi Chemical Company, Ltd. Method for producing abrasive grains, method for producing slurry, and method for producing polishing liquid
SG11201405091TA (en) 2012-02-21 2014-09-26 Hitachi Chemical Co Ltd Polishing agent, polishing agent set, and substrate polishing method
JP6044629B2 (ja) 2012-02-21 2016-12-14 日立化成株式会社 研磨剤、研磨剤セット及び基体の研磨方法
CN104321854B (zh) 2012-05-22 2017-06-20 日立化成株式会社 悬浮液、研磨液套剂、研磨液、基体的研磨方法及基体
JP5943074B2 (ja) 2012-05-22 2016-06-29 日立化成株式会社 スラリー、研磨液セット、研磨液及び基体の研磨方法
KR102034331B1 (ko) 2012-05-22 2019-10-18 히타치가세이가부시끼가이샤 슬러리, 연마액 세트, 연마액, 기체의 연마 방법 및 기체
WO2014156114A1 (ja) * 2013-03-25 2014-10-02 Hoya株式会社 情報記録媒体用ガラス基板の製造方法
JP6424818B2 (ja) * 2013-06-27 2018-11-21 コニカミノルタ株式会社 研磨材の製造方法
JP2019131447A (ja) * 2018-02-02 2019-08-08 ヒロセホールディングス株式会社 酸化セリウム微粒子の製造方法
US11384254B2 (en) * 2020-04-15 2022-07-12 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing composition containing composite silica particles, method of making the silica composite particles and method of polishing a substrate
KR102484632B1 (ko) * 2020-08-31 2023-01-04 솔브레인 주식회사 산화 세륨 입자, 이를 포함하는 화학적 기계적 연마 슬러리 조성물 및 반도체 소자의 제조 방법
WO2022257153A1 (en) * 2021-06-11 2022-12-15 Dic Corporation Ceria particles and method for producing the same
EP4640634A1 (en) * 2022-12-23 2025-10-29 Toray Industries, Inc. Cerium oxide nanoparticles and production method thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5174984A (en) * 1987-06-29 1992-12-29 Rhone-Poulenc Chimie Ceric oxide with new morphological characteristics and method for obtaining same
JP2746861B2 (ja) * 1995-11-20 1998-05-06 三井金属鉱業株式会社 酸化セリウム超微粒子の製造方法
KR100336598B1 (ko) * 1996-02-07 2002-05-16 이사오 우치가사키 산화 세륨 연마제 제조용 산화 세륨 입자
JP2000203834A (ja) * 1998-12-28 2000-07-25 Kose Corp 超微粒子酸化セリウム及び超微粒子金属酸化物・酸化セリウム複合体、その製造方法並びにそれを配合した樹脂組成物及び化粧料
JP2001253709A (ja) * 2000-03-09 2001-09-18 Sumitomo Chem Co Ltd 結晶性酸化第二セリウム粒子の製造方法
JP4067759B2 (ja) * 2000-11-17 2008-03-26 株式会社コーセー 酸化亜鉛固溶酸化セリウムの製造方法
JP2006249129A (ja) * 2005-03-08 2006-09-21 Hitachi Chem Co Ltd 研磨剤の製造方法及び研磨剤
JP5090920B2 (ja) * 2005-10-14 2012-12-05 エルジー・ケム・リミテッド Ｃｍｐスラリー用酸化セリウム粉末の製造方法及びこれを用いたｃｍｐ用スラリー組成物の製造方法

Also Published As

Publication number Publication date
WO2009034905A1 (ja) 2009-03-19
US20100058671A1 (en) 2010-03-11
KR20090079976A (ko) 2009-07-22
JP2009067627A (ja) 2009-04-02
DE112008000366T5 (de) 2009-12-10

Similar Documents

Publication Publication Date Title
JP4294710B2 (ja) 酸化セリウム及びその製造方法
CN101304947B (zh) 碳酸铈粉末、二氧化铈粉末、制备该粉末的方法以及包含该粉末的cmp浆料
JP2010083741A (ja) 酸化セリウム及びその製造方法
JP4827963B2 (ja) 炭化珪素の研磨液及びその研磨方法
JP4236857B2 (ja) セリウム系研摩材およびその製造方法
JPH10298537A (ja) 研磨材、その製造方法、及び半導体装置の製造方法
KR100560223B1 (ko) 고정도 연마용 금속 산화물 분말 및 이의 제조방법
JPWO2006123562A1 (ja) 研磨用組成物の製造方法
JP2017001927A (ja) 研磨用複合粒子、研磨用複合粒子の製造方法及び研磨用スラリー
JP5396047B2 (ja) ガラス用研摩材スラリー
JP5519772B2 (ja) セリウム系粒子組成物およびその調製
JP6665852B2 (ja) 負帯電性基板の研磨方法、及び、高表面平滑性の負帯電性基板の製造方法
WO2007123203A1 (ja) 酸化物粒子の製造方法、スラリー、研磨剤および基板の研磨方法
JP4128906B2 (ja) セリウム系研摩材及びセリウム系研摩材の製造方法
JP6839767B2 (ja) セリウム系研磨材用原料の製造方法、及びセリウム系研磨材の製造方法
CN101356248A (zh) 铈系研磨材料
JP5512962B2 (ja) フッ素及び硫黄を含有するセリウム系研摩材
JP2008001907A (ja) セリウム系研摩材スラリー及びセリウム系研摩材スラリーの製造方法
JP5237542B2 (ja) 酸化セリウム系研摩材
JP2007061989A (ja) 研磨用複合酸化物粒子およびスラリー状研磨材
JP7649432B1 (ja) ジルコニアゾル
JP7700390B1 (ja) ジルコニアゾル、及び、ジルコニアゾルの製造方法
JPWO2005114177A1 (ja) 研磨材粒子の品質評価方法、ガラス研磨方法及びガラス研磨用研磨材組成物
JP2007084755A (ja) 研磨用複合酸化物粒子とその製造方法、スラリー状研磨材
WO2025079548A1 (ja) ジルコニアゾル

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090206

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090227

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20090227

TRDD Decision of grant or rejection written
A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20090317

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20090324

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20090408

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120417

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4294710

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120417

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130417

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130417

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140417

Year of fee payment: 5

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250