JP2009067627A5 - - Google Patents
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- Publication number
- JP2009067627A5 JP2009067627A5 JP2007237484A JP2007237484A JP2009067627A5 JP 2009067627 A5 JP2009067627 A5 JP 2009067627A5 JP 2007237484 A JP2007237484 A JP 2007237484A JP 2007237484 A JP2007237484 A JP 2007237484A JP 2009067627 A5 JP2009067627 A5 JP 2009067627A5
- Authority
- JP
- Japan
- Prior art keywords
- cerium oxide
- sedimentation volume
- weight
- stirring
- hours
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000420 cerium oxide Inorganic materials 0.000 claims 6
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims 6
- 238000004062 sedimentation Methods 0.000 claims 2
- 239000002002 slurry Substances 0.000 claims 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 239000011780 sodium chloride Substances 0.000 claims 1
- 238000003756 stirring Methods 0.000 claims 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007237484A JP4294710B2 (ja) | 2007-09-13 | 2007-09-13 | 酸化セリウム及びその製造方法 |
| US12/514,824 US20100058671A1 (en) | 2007-09-13 | 2008-09-04 | Cerium oxide and method for producing the same |
| PCT/JP2008/065937 WO2009034905A1 (ja) | 2007-09-13 | 2008-09-04 | 酸化セリウム及びその製造方法 |
| DE112008000366T DE112008000366T5 (de) | 2007-09-13 | 2008-09-04 | Ceroxid und Verfahren zu dessen Herstellung |
| KR1020097011413A KR20090079976A (ko) | 2007-09-13 | 2008-09-04 | 산화세륨 및 그 제조 방법 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007237484A JP4294710B2 (ja) | 2007-09-13 | 2007-09-13 | 酸化セリウム及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009067627A JP2009067627A (ja) | 2009-04-02 |
| JP2009067627A5 true JP2009067627A5 (enExample) | 2009-05-14 |
| JP4294710B2 JP4294710B2 (ja) | 2009-07-15 |
Family
ID=40451914
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007237484A Active JP4294710B2 (ja) | 2007-09-13 | 2007-09-13 | 酸化セリウム及びその製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20100058671A1 (enExample) |
| JP (1) | JP4294710B2 (enExample) |
| KR (1) | KR20090079976A (enExample) |
| DE (1) | DE112008000366T5 (enExample) |
| WO (1) | WO2009034905A1 (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010275179A (ja) * | 2009-04-28 | 2010-12-09 | Tsurumi Soda Co Ltd | セリウムの回収方法 |
| JP5574527B2 (ja) * | 2009-12-25 | 2014-08-20 | 日揮触媒化成株式会社 | 酸化セリウム微粒子の製造方法 |
| WO2011111421A1 (ja) | 2010-03-12 | 2011-09-15 | 日立化成工業株式会社 | スラリ、研磨液セット、研磨液及びこれらを用いた基板の研磨方法 |
| KR20130129396A (ko) * | 2010-11-22 | 2013-11-28 | 히타치가세이가부시끼가이샤 | 슬러리, 연마액 세트, 연마액, 기판의 연마 방법 및 기판 |
| KR20130129400A (ko) | 2010-11-22 | 2013-11-28 | 히타치가세이가부시끼가이샤 | 슬러리, 연마액 세트, 연마액, 기판의 연마 방법 및 기판 |
| CN103374330B (zh) * | 2010-11-22 | 2015-10-14 | 日立化成株式会社 | 磨粒的制造方法、悬浮液的制造方法以及研磨液的制造方法 |
| JP6044630B2 (ja) | 2012-02-21 | 2016-12-14 | 日立化成株式会社 | 研磨剤、研磨剤セット及び基体の研磨方法 |
| WO2013125445A1 (ja) | 2012-02-21 | 2013-08-29 | 日立化成株式会社 | 研磨剤、研磨剤セット及び基体の研磨方法 |
| US9932497B2 (en) | 2012-05-22 | 2018-04-03 | Hitachi Chemical Company, Ltd. | Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate |
| US10549399B2 (en) | 2012-05-22 | 2020-02-04 | Hitachi Chemcial Company, Ltd. | Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate |
| KR102034329B1 (ko) | 2012-05-22 | 2019-10-18 | 히타치가세이가부시끼가이샤 | 슬러리, 연마액 세트, 연마액, 기체의 연마 방법 및 기체 |
| WO2014156114A1 (ja) * | 2013-03-25 | 2014-10-02 | Hoya株式会社 | 情報記録媒体用ガラス基板の製造方法 |
| WO2014208379A1 (ja) * | 2013-06-27 | 2014-12-31 | コニカミノルタ株式会社 | 研磨材、研磨材の製造方法及び研磨加工方法 |
| JP2019131447A (ja) * | 2018-02-02 | 2019-08-08 | ヒロセホールディングス株式会社 | 酸化セリウム微粒子の製造方法 |
| US11384254B2 (en) * | 2020-04-15 | 2022-07-12 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing composition containing composite silica particles, method of making the silica composite particles and method of polishing a substrate |
| KR102484572B1 (ko) * | 2020-08-31 | 2023-01-05 | 솔브레인 주식회사 | 산화 세륨 입자, 이를 포함하는 화학적 기계적 연마 슬러리 조성물 및 반도체 소자의 제조 방법 |
| CN117545720A (zh) * | 2021-06-11 | 2024-02-09 | Dic株式会社 | 氧化铈颗粒以及其制造方法 |
| WO2024135757A1 (ja) * | 2022-12-23 | 2024-06-27 | 東レ株式会社 | 酸化セリウムのナノ粒子およびその製造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5174984A (en) * | 1987-06-29 | 1992-12-29 | Rhone-Poulenc Chimie | Ceric oxide with new morphological characteristics and method for obtaining same |
| JP2746861B2 (ja) * | 1995-11-20 | 1998-05-06 | 三井金属鉱業株式会社 | 酸化セリウム超微粒子の製造方法 |
| AU1670597A (en) * | 1996-02-07 | 1997-08-28 | Hitachi Chemical Company, Ltd. | Cerium oxide abrasive, semiconductor chip, semiconductor device, process for the production of them, and method for the polishing of substrates |
| JP2000203834A (ja) * | 1998-12-28 | 2000-07-25 | Kose Corp | 超微粒子酸化セリウム及び超微粒子金属酸化物・酸化セリウム複合体、その製造方法並びにそれを配合した樹脂組成物及び化粧料 |
| JP2001253709A (ja) * | 2000-03-09 | 2001-09-18 | Sumitomo Chem Co Ltd | 結晶性酸化第二セリウム粒子の製造方法 |
| JP4067759B2 (ja) * | 2000-11-17 | 2008-03-26 | 株式会社コーセー | 酸化亜鉛固溶酸化セリウムの製造方法 |
| JP2006249129A (ja) * | 2005-03-08 | 2006-09-21 | Hitachi Chem Co Ltd | 研磨剤の製造方法及び研磨剤 |
| CN101039876B (zh) * | 2005-10-14 | 2011-07-27 | Lg化学株式会社 | 用于化学机械抛光的二氧化铈粉末的制备方法及使用该粉末制备化学机械抛光浆料的方法 |
-
2007
- 2007-09-13 JP JP2007237484A patent/JP4294710B2/ja active Active
-
2008
- 2008-09-04 KR KR1020097011413A patent/KR20090079976A/ko not_active Ceased
- 2008-09-04 WO PCT/JP2008/065937 patent/WO2009034905A1/ja not_active Ceased
- 2008-09-04 DE DE112008000366T patent/DE112008000366T5/de not_active Ceased
- 2008-09-04 US US12/514,824 patent/US20100058671A1/en not_active Abandoned