WO2009034905A1 - 酸化セリウム及びその製造方法 - Google Patents

酸化セリウム及びその製造方法 Download PDF

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Publication number
WO2009034905A1
WO2009034905A1 PCT/JP2008/065937 JP2008065937W WO2009034905A1 WO 2009034905 A1 WO2009034905 A1 WO 2009034905A1 JP 2008065937 W JP2008065937 W JP 2008065937W WO 2009034905 A1 WO2009034905 A1 WO 2009034905A1
Authority
WO
WIPO (PCT)
Prior art keywords
cerium oxide
producing
slurry
enables
same
Prior art date
Application number
PCT/JP2008/065937
Other languages
English (en)
French (fr)
Inventor
Shuji Ogura
Original Assignee
Mitsui Mining & Smelting Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co., Ltd. filed Critical Mitsui Mining & Smelting Co., Ltd.
Priority to US12/514,824 priority Critical patent/US20100058671A1/en
Priority to DE112008000366T priority patent/DE112008000366T5/de
Publication of WO2009034905A1 publication Critical patent/WO2009034905A1/ja

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F17/00—Compounds of rare earth metals
    • C01F17/20—Compounds containing only rare earth metals as the metal element
    • C01F17/206—Compounds containing only rare earth metals as the metal element oxide or hydroxide being the only anion
    • C01F17/224—Oxides or hydroxides of lanthanides
    • C01F17/235—Cerium oxides or hydroxides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J23/00—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00
    • B01J23/38—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals
    • B01J23/54—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals combined with metals, oxides or hydroxides provided for in groups B01J23/02 - B01J23/36
    • B01J23/56—Platinum group metals
    • B01J23/63—Platinum group metals with rare earths or actinides
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F17/00—Compounds of rare earth metals
    • C01F17/10—Preparation or treatment, e.g. separation or purification
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/60—Compounds characterised by their crystallite size
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/01—Particle morphology depicted by an image
    • C01P2004/04—Particle morphology depicted by an image obtained by TEM, STEM, STM or AFM
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/54—Particles characterised by their aspect ratio, i.e. the ratio of sizes in the longest to the shortest dimension
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/22—Rheological behaviour as dispersion, e.g. viscosity, sedimentation stability
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Geology (AREA)
  • Nanotechnology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Composite Materials (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

　本発明は、酸化セリウムおよびその製造方法に関し、特に研摩材として用いた場合に、コロイダルシリカに匹敵する高い平滑性を実現し、かつ研摩速度も大きいものとなる酸化セリウムの提供を目的とする。また、研摩後の研摩面の洗浄性も良好となる酸化セリウムを提供する。本発明は、平均粒径が０．５μｍ以下であり、結晶子径が８～８０ｎｍである酸化セリウムであって、前記酸化セリウムは、３質量％の食塩水中に、濃度２質量％の酸化セリウムを含む酸化セリウムスラリーとしたときに所定の沈降体積となるように沈降するものであり、沈降体積は、酸化セリウムスラリーを撹拌後静置して２４時間後に、２．５～１５．０ｍＬ／ｇとなることを特徴とする酸化セリウムに関する。
PCT/JP2008/065937 2007-09-13 2008-09-04 酸化セリウム及びその製造方法 WO2009034905A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/514,824 US20100058671A1 (en) 2007-09-13 2008-09-04 Cerium oxide and method for producing the same
DE112008000366T DE112008000366T5 (de) 2007-09-13 2008-09-04 Ceroxid und Verfahren zu dessen Herstellung

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007237484A JP4294710B2 (ja) 2007-09-13 2007-09-13 酸化セリウム及びその製造方法
JP2007-237484 2007-09-13

Publications (1)

Publication Number Publication Date
WO2009034905A1 true WO2009034905A1 (ja) 2009-03-19

Family

ID=40451914

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/065937 WO2009034905A1 (ja) 2007-09-13 2008-09-04 酸化セリウム及びその製造方法

Country Status (5)

Country Link
US (1) US20100058671A1 (ja)
JP (1) JP4294710B2 (ja)
KR (1) KR20090079976A (ja)
DE (1) DE112008000366T5 (ja)
WO (1) WO2009034905A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019131447A (ja) * 2018-02-02 2019-08-08 ヒロセホールディングス株式会社 酸化セリウム微粒子の製造方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010275179A (ja) * 2009-04-28 2010-12-09 Tsurumi Soda Co Ltd セリウムの回収方法
JP5574527B2 (ja) * 2009-12-25 2014-08-20 日揮触媒化成株式会社 酸化セリウム微粒子の製造方法
WO2011111421A1 (ja) * 2010-03-12 2011-09-15 日立化成工業株式会社 スラリ、研磨液セット、研磨液及びこれらを用いた基板の研磨方法
KR20130129398A (ko) * 2010-11-22 2013-11-28 히타치가세이가부시끼가이샤 지립의 제조 방법, 슬러리의 제조 방법 및 연마액의 제조 방법
US9881801B2 (en) 2010-11-22 2018-01-30 Hitachi Chemical Company, Ltd. Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate
CN103497733B (zh) * 2010-11-22 2016-11-23 日立化成株式会社 悬浮液、研磨液套剂、研磨液、基板的研磨方法及基板
JP6044630B2 (ja) 2012-02-21 2016-12-14 日立化成株式会社 研磨剤、研磨剤セット及び基体の研磨方法
US9346977B2 (en) 2012-02-21 2016-05-24 Hitachi Chemical Company, Ltd. Abrasive, abrasive set, and method for abrading substrate
JP5943072B2 (ja) 2012-05-22 2016-06-29 日立化成株式会社 スラリー、研磨液セット、研磨液及び基体の研磨方法
CN104321852B (zh) 2012-05-22 2016-12-28 日立化成株式会社 悬浮液、研磨液套剂、研磨液、基体的研磨方法及基体
US9932497B2 (en) 2012-05-22 2018-04-03 Hitachi Chemical Company, Ltd. Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate
WO2014156114A1 (ja) * 2013-03-25 2014-10-02 Hoya株式会社 情報記録媒体用ガラス基板の製造方法
JP6424818B2 (ja) * 2013-06-27 2018-11-21 コニカミノルタ株式会社 研磨材の製造方法

Citations (7)

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Publication number Priority date Publication date Assignee Title
JPH09142840A (ja) * 1995-11-20 1997-06-03 Mitsui Mining & Smelting Co Ltd 酸化セリウム超微粒子及びその製造方法
WO1997029510A1 (fr) * 1996-02-07 1997-08-14 Hitachi Chemical Company, Ltd. Abrasif d'oxyde de cerium, microplaquette semi-conductrice, dispositif semi-conducteur, procede pour les produire et procede pour polir les substrats
JP2000203834A (ja) * 1998-12-28 2000-07-25 Kose Corp 超微粒子酸化セリウム及び超微粒子金属酸化物・酸化セリウム複合体、その製造方法並びにそれを配合した樹脂組成物及び化粧料
JP2001253709A (ja) * 2000-03-09 2001-09-18 Sumitomo Chem Co Ltd 結晶性酸化第二セリウム粒子の製造方法
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JPH09142840A (ja) * 1995-11-20 1997-06-03 Mitsui Mining & Smelting Co Ltd 酸化セリウム超微粒子及びその製造方法
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JP2001253709A (ja) * 2000-03-09 2001-09-18 Sumitomo Chem Co Ltd 結晶性酸化第二セリウム粒子の製造方法
JP2002160920A (ja) * 2000-11-17 2002-06-04 Kose Corp 金属酸化物固溶酸化セリウム及びその製造方法並びにそれを配合した樹脂組成物及び化粧料
JP2006249129A (ja) * 2005-03-08 2006-09-21 Hitachi Chem Co Ltd 研磨剤の製造方法及び研磨剤
WO2007043817A1 (en) * 2005-10-14 2007-04-19 Lg Chem, Ltd. Method for preparing of cerium oxide powder for chemical mechanical polishing and method for preparing of chemical mechanical polishing slurry using the same

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019131447A (ja) * 2018-02-02 2019-08-08 ヒロセホールディングス株式会社 酸化セリウム微粒子の製造方法

Also Published As

Publication number Publication date
JP2009067627A (ja) 2009-04-02
KR20090079976A (ko) 2009-07-22
JP4294710B2 (ja) 2009-07-15
DE112008000366T5 (de) 2009-12-10
US20100058671A1 (en) 2010-03-11

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