JP4282625B2 - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法 Download PDF

Info

Publication number
JP4282625B2
JP4282625B2 JP2005067535A JP2005067535A JP4282625B2 JP 4282625 B2 JP4282625 B2 JP 4282625B2 JP 2005067535 A JP2005067535 A JP 2005067535A JP 2005067535 A JP2005067535 A JP 2005067535A JP 4282625 B2 JP4282625 B2 JP 4282625B2
Authority
JP
Japan
Prior art keywords
electrode
gate electrode
film
opening
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005067535A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006253395A5 (enExample
JP2006253395A (ja
Inventor
明男 宮尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2005067535A priority Critical patent/JP4282625B2/ja
Priority to US11/338,715 priority patent/US7696531B2/en
Publication of JP2006253395A publication Critical patent/JP2006253395A/ja
Publication of JP2006253395A5 publication Critical patent/JP2006253395A5/ja
Application granted granted Critical
Publication of JP4282625B2 publication Critical patent/JP4282625B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/80FETs having rectifying junction gate electrodes
    • H10D30/87FETs having Schottky gate electrodes, e.g. metal-semiconductor FETs [MESFET]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/111Field plates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/27Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/311Gate electrodes for field-effect devices
    • H10D64/411Gate electrodes for field-effect devices for FETs

Landscapes

  • Junction Field-Effect Transistors (AREA)
  • Electrodes Of Semiconductors (AREA)
JP2005067535A 2005-03-10 2005-03-10 半導体装置及びその製造方法 Expired - Fee Related JP4282625B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005067535A JP4282625B2 (ja) 2005-03-10 2005-03-10 半導体装置及びその製造方法
US11/338,715 US7696531B2 (en) 2005-03-10 2006-01-25 Semiconductor device and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005067535A JP4282625B2 (ja) 2005-03-10 2005-03-10 半導体装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2006253395A JP2006253395A (ja) 2006-09-21
JP2006253395A5 JP2006253395A5 (enExample) 2007-02-15
JP4282625B2 true JP4282625B2 (ja) 2009-06-24

Family

ID=36969916

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005067535A Expired - Fee Related JP4282625B2 (ja) 2005-03-10 2005-03-10 半導体装置及びその製造方法

Country Status (2)

Country Link
US (1) US7696531B2 (enExample)
JP (1) JP4282625B2 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011249728A (ja) * 2010-05-31 2011-12-08 Toshiba Corp 半導体装置および半導体装置の製造方法
US9366396B2 (en) 2013-01-30 2016-06-14 Cree, Inc. Optical waveguide and lamp including same
US9869432B2 (en) 2013-01-30 2018-01-16 Cree, Inc. Luminaires using waveguide bodies and optical elements
US9625638B2 (en) 2013-03-15 2017-04-18 Cree, Inc. Optical waveguide body
US9291320B2 (en) 2013-01-30 2016-03-22 Cree, Inc. Consolidated troffer
US9442243B2 (en) 2013-01-30 2016-09-13 Cree, Inc. Waveguide bodies including redirection features and methods of producing same
US10436969B2 (en) 2013-01-30 2019-10-08 Ideal Industries Lighting Llc Optical waveguide and luminaire incorporating same
US9798072B2 (en) 2013-03-15 2017-10-24 Cree, Inc. Optical element and method of forming an optical element
US10502899B2 (en) * 2013-03-15 2019-12-10 Ideal Industries Lighting Llc Outdoor and/or enclosed structure LED luminaire
US10209429B2 (en) 2013-03-15 2019-02-19 Cree, Inc. Luminaire with selectable luminous intensity pattern
US9366799B2 (en) 2013-03-15 2016-06-14 Cree, Inc. Optical waveguide bodies and luminaires utilizing same
US10379278B2 (en) * 2013-03-15 2019-08-13 Ideal Industries Lighting Llc Outdoor and/or enclosed structure LED luminaire outdoor and/or enclosed structure LED luminaire having outward illumination
US9651740B2 (en) 2014-01-09 2017-05-16 Cree, Inc. Extraction film for optical waveguide and method of producing same
US10416377B2 (en) 2016-05-06 2019-09-17 Cree, Inc. Luminaire with controllable light emission
US11719882B2 (en) 2016-05-06 2023-08-08 Ideal Industries Lighting Llc Waveguide-based light sources with dynamic beam shaping

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0335536A (ja) * 1989-06-30 1991-02-15 Fujitsu Ltd 電界効果型半導体装置
JPH04163924A (ja) * 1990-10-29 1992-06-09 Sony Corp 電界効果トランジスタ
US5362979A (en) * 1991-02-01 1994-11-08 Philips Electronics North America Corporation SOI transistor with improved source-high performance
US5273933A (en) * 1991-07-23 1993-12-28 Kabushiki Kaisha Toshiba Vapor phase growth method of forming film in process of manufacturing semiconductor device
JPH05152338A (ja) * 1991-11-28 1993-06-18 Sanyo Electric Co Ltd 化合物半導体装置
JPH09289304A (ja) * 1996-04-19 1997-11-04 Rohm Co Ltd 半導体装置
JP3035215B2 (ja) * 1996-05-23 2000-04-24 ローム株式会社 半導体装置
JP3353764B2 (ja) 1999-11-12 2002-12-03 日本電気株式会社 半導体装置の製造方法
JP2001230263A (ja) * 2001-01-29 2001-08-24 Nec Corp 電界効果型トランジスタ
JP3600544B2 (ja) * 2001-03-30 2004-12-15 ユーディナデバイス株式会社 半導体装置の製造方法
JP3744381B2 (ja) * 2001-05-17 2006-02-08 日本電気株式会社 電界効果型トランジスタ
JP4385206B2 (ja) * 2003-01-07 2009-12-16 日本電気株式会社 電界効果トランジスタ

Also Published As

Publication number Publication date
US20060202246A1 (en) 2006-09-14
US7696531B2 (en) 2010-04-13
JP2006253395A (ja) 2006-09-21

Similar Documents

Publication Publication Date Title
JP4282625B2 (ja) 半導体装置及びその製造方法
US9711613B2 (en) Stacked graphene field-effect transistor
JP6393758B2 (ja) 低減された出力キャパシタンスを有するGaNデバイスおよびこれを作製するためのプロセス
US11024750B2 (en) Quantum capacitance graphene varactors and fabrication methods
TWI550723B (zh) 單晶積體電路(mmic)結構及此種結構的形成方法
JP2015195288A (ja) 半導体装置及び半導体装置の製造方法
JP2003203930A (ja) ショットキーゲート電界効果型トランジスタ
WO2008027593A3 (en) Improved structure and method for fabrication of field effect transistor gates with or without field plates
CN111048524A (zh) 阵列基板及制备方法、显示面板
TW201737488A (zh) 場效應管及其製造方法
CN106610562B (zh) 掩膜版版图以及形成半导体结构的方法
CN105990332B (zh) 薄膜晶体管基板及其显示面板
CN100511705C (zh) 具有t形栅极电极的半导体器件及其制造方法
US11094792B2 (en) Manufacturing method of split gate structure and split gate structure
JP3975574B2 (ja) モノリシックマイクロ波集積回路の製造方法
JP5550316B2 (ja) 半導体装置の製造方法および半導体装置
TW200901374A (en) Semiconductor device and manufacturing method thereof
JP2007201413A (ja) 半導体装置
US9142654B2 (en) Manufacturing method of oxide semiconductor thin film transistor
JP2012094726A (ja) 電界効果トランジスタ及びその製造方法
JP2010258202A (ja) 半導体装置及びその製造方法
JP2002026034A (ja) 半導体装置の製造方法
TW201123363A (en) Method for selective deposition of dielectric layers on semiconductor structures
JP2798041B2 (ja) 半導体装置の製造方法
JP2025029801A (ja) グラフェン素子、グラフェン素子の製造方法及び電子装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20061222

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070628

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20080905

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080909

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20081110

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20090224

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20090317

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120327

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130327

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130327

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140327

Year of fee payment: 5

LAPS Cancellation because of no payment of annual fees