JP4271056B2 - 基板へのテープ貼り付け方法及び装置 - Google Patents

基板へのテープ貼り付け方法及び装置 Download PDF

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Publication number
JP4271056B2
JP4271056B2 JP2004043536A JP2004043536A JP4271056B2 JP 4271056 B2 JP4271056 B2 JP 4271056B2 JP 2004043536 A JP2004043536 A JP 2004043536A JP 2004043536 A JP2004043536 A JP 2004043536A JP 4271056 B2 JP4271056 B2 JP 4271056B2
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JP2005236049A5 (enExample
JP2005236049A (ja
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哲治 岩沖
正宗 片江
義彦 上島
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Takatori Corp
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Takatori Corp
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JP2004043536A 2004-02-19 2004-02-19 基板へのテープ貼り付け方法及び装置 Expired - Fee Related JP4271056B2 (ja)

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JP2004043536A JP4271056B2 (ja) 2004-02-19 2004-02-19 基板へのテープ貼り付け方法及び装置

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JP2004043536A JP4271056B2 (ja) 2004-02-19 2004-02-19 基板へのテープ貼り付け方法及び装置

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JP2005236049A JP2005236049A (ja) 2005-09-02
JP2005236049A5 JP2005236049A5 (enExample) 2007-01-25
JP4271056B2 true JP4271056B2 (ja) 2009-06-03

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Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4503448B2 (ja) * 2005-01-26 2010-07-14 富士機械製造株式会社 電子部品圧着装置に用いる緩衝材テープ供給装置および電子部品圧着装置
US8079105B2 (en) * 2005-11-10 2011-12-20 Datacard Corporation Card cleaning mechanism
JP4880293B2 (ja) 2005-11-24 2012-02-22 リンテック株式会社 シート貼付装置及び貼付方法
JP4360684B2 (ja) 2006-02-22 2009-11-11 日東電工株式会社 半導体ウエハの粘着テープ貼付け方法およびこれを用いた装置
JP4523923B2 (ja) * 2006-03-22 2010-08-11 芝浦メカトロニクス株式会社 テープ部材の搬送装置
JP4727513B2 (ja) * 2006-06-26 2011-07-20 芝浦メカトロニクス株式会社 粘着性テープの貼着装置及び貼着方法
JP4643512B2 (ja) * 2006-07-20 2011-03-02 リンテック株式会社 シート貼付装置及び貼付方法
JP4868591B2 (ja) * 2007-02-23 2012-02-01 株式会社タカトリ 基板へのテープの貼付方法及び装置
JP5568872B2 (ja) * 2009-03-06 2014-08-13 日産自動車株式会社 電池用樹脂シートの加工装置および加工方法
JP5382506B2 (ja) * 2009-03-19 2014-01-08 Ｎｌｔテクノロジー株式会社 Ａｃｆ貼り付け装置及び貼り付け方法
JP5339981B2 (ja) * 2009-03-24 2013-11-13 芝浦メカトロニクス株式会社 粘着テープの貼着装置及び貼着方法
JP5324317B2 (ja) * 2009-05-22 2013-10-23 日東電工株式会社 保護テープ貼付け方法および保護テープ貼付け装置
KR101609869B1 (ko) 2014-10-29 2016-04-08 세광테크 주식회사 Acf 텐션 조절장치
CN107315265B (zh) * 2017-04-24 2020-05-05 深圳市集银科技有限公司 具有压力精度结构的acf贴合机及该acf贴合机的使用方法
CN111422823B (zh) * 2020-04-30 2024-08-13 苏州华兴源创科技股份有限公司 一种基板剥离装置及方法
US12431371B2 (en) * 2020-05-25 2025-09-30 Doosan Tesna Inc. Semiconductor chip delamination device and control method therefor

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