JP4270105B2 - 固体撮像素子 - Google Patents

固体撮像素子 Download PDF

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Publication number
JP4270105B2
JP4270105B2 JP2004317088A JP2004317088A JP4270105B2 JP 4270105 B2 JP4270105 B2 JP 4270105B2 JP 2004317088 A JP2004317088 A JP 2004317088A JP 2004317088 A JP2004317088 A JP 2004317088A JP 4270105 B2 JP4270105 B2 JP 4270105B2
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Japan
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region
imaging device
state imaging
solid
semiconductor substrate
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JP2004317088A
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Japanese (ja)
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JP2006129298A5 (enrdf_load_stackoverflow
JP2006129298A (ja
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博文 角
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Sony Corp
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Sony Corp
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Priority to JP2004317088A priority Critical patent/JP4270105B2/ja
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  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
JP2004317088A 2004-10-29 2004-10-29 固体撮像素子 Expired - Fee Related JP4270105B2 (ja)

Priority Applications (1)

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JP2004317088A JP4270105B2 (ja) 2004-10-29 2004-10-29 固体撮像素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004317088A JP4270105B2 (ja) 2004-10-29 2004-10-29 固体撮像素子

Publications (3)

Publication Number Publication Date
JP2006129298A JP2006129298A (ja) 2006-05-18
JP2006129298A5 JP2006129298A5 (enrdf_load_stackoverflow) 2007-08-23
JP4270105B2 true JP4270105B2 (ja) 2009-05-27

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JP2004317088A Expired - Fee Related JP4270105B2 (ja) 2004-10-29 2004-10-29 固体撮像素子

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JP (1) JP4270105B2 (enrdf_load_stackoverflow)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008172580A (ja) * 2007-01-12 2008-07-24 Toshiba Corp 固体撮像素子及び固体撮像装置
JP2009068863A (ja) * 2007-09-10 2009-04-02 Toshiba Corp 赤外線検出素子及びそれを用いた赤外線イメージセンサ
JP4609497B2 (ja) * 2008-01-21 2011-01-12 ソニー株式会社 固体撮像装置とその製造方法、及びカメラ
US8101978B2 (en) * 2008-02-08 2012-01-24 Omnivision Technologies, Inc. Circuit and photo sensor overlap for backside illumination image sensor
JP4886721B2 (ja) * 2008-03-18 2012-02-29 日本放送協会 立体撮像装置および立体表示装置
US9142586B2 (en) * 2009-02-24 2015-09-22 Taiwan Semiconductor Manufacturing Company, Ltd. Pad design for backside illuminated image sensor
JP5836581B2 (ja) * 2010-10-04 2015-12-24 キヤノン株式会社 固体撮像素子の製造方法
JP6053333B2 (ja) 2012-05-31 2016-12-27 キヤノン株式会社 撮像装置、撮像システム、撮像装置の駆動方法
DE102013206404B3 (de) * 2013-04-11 2014-03-06 Siemens Aktiengesellschaft Sensorchip, computertomographischer Detektor diesen aufweisend, sowie ein Herstellungsverfahren und ein Betriebsverfahren dafür
JP2018011304A (ja) * 2017-07-31 2018-01-18 株式会社ニコン 撮像素子
JP6611779B2 (ja) * 2017-11-08 2019-11-27 キヤノン株式会社 固体撮像装置および撮像システム
JP6929337B2 (ja) * 2017-11-08 2021-09-01 キヤノン株式会社 固体撮像装置および撮像システム
JP7358300B2 (ja) * 2019-08-15 2023-10-10 株式会社ニコン 撮像素子
WO2021193121A1 (ja) * 2020-03-26 2021-09-30 ソニーグループ株式会社 固体撮像装置および画像処理方法

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JP2006129298A (ja) 2006-05-18

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