JP4268967B2 - グリーンシート用塗料、グリーンシート、グリーンシートの製造方法および電子部品の製造方法 - Google Patents
グリーンシート用塗料、グリーンシート、グリーンシートの製造方法および電子部品の製造方法 Download PDFInfo
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- JP4268967B2 JP4268967B2 JP2005504156A JP2005504156A JP4268967B2 JP 4268967 B2 JP4268967 B2 JP 4268967B2 JP 2005504156 A JP2005504156 A JP 2005504156A JP 2005504156 A JP2005504156 A JP 2005504156A JP 4268967 B2 JP4268967 B2 JP 4268967B2
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Description
セラミック粉体と、ブチラール系樹脂を主成分とするバインダ樹脂とを有するグリーンシート用塗料であって、
粘着付与材としてキシレン系樹脂をさらに有する。
前記ポリブチラール樹脂の重合度が1000以上1700以下であり、樹脂のブチラール化度が64%より大きく78%より小さく、残留アセチル基量が6%未満である。
前記グリーンシート用塗料を準備する工程と、
前記グリーンシート用塗料を用いてセラミックグリーンシートを成形する工程と、
を有する。
前記グリーンシート用塗料を準備する工程と、
前記グリーンシート用塗料を用いてセラミックグリーンシートを成形する工程と、
前記グリーンシートを乾燥させる工程と、
乾燥後のグリーンシートを、内部電極層を介して積層し、グリーンチップを得る工程と、
前記グリーンチップを焼成する工程と、
を有する。
図2は図1に示す積層セラミックコンデンサの製造過程を示す要部断面図である。
発明を実施するための最良の態様
まず、本発明に係るグリーンシート用塗料(誘電体ペースト)およびグリーンシートを用いて製造される電子部品の一実施形態として、積層セラミックコンデンサの全体構成について説明する。
誘電体塗料は、誘電体原料(セラミック粉体)と有機ビヒクルとを混練して得られる有機溶剤系塗料で構成される。
保持温度:200〜400℃、特に250〜350℃、
保持時間:0.5〜20時間、特に1〜10時間、
雰囲気 :加湿したN2とH2との混合ガス。
昇温速度:50〜500℃/時間、特に200〜300℃/時間、
保持温度:1100〜1300℃、特に1150〜1250℃、
保持時間:0.5〜8時間、特に1〜3時間、
冷却速度:50〜500℃/時間、特に200〜300℃/時間、
雰囲気ガス:加湿したN2とH2との混合ガス等。
冷却速度:50〜500℃/時間、特に100〜300℃/時間、
雰囲気用ガス:加湿したN2ガス等。
このようにして製造された本発明の積層セラミックコンデンサは、ハンダ付等によりプリント基板上などに実装され、各種電子機器等に使用される。
たとえば、本発明の方法は、積層セラミックコンデンサの製造方法に限らず、その他の積層型電子部品の製造方法としても適用することが可能である。
グリーンシート用塗料の作製
セラミック粉体の出発原料としてBaTiO3粉体(BT−02/堺化学工業(株))を用いた。このBaTiO3粉体100質量部に対して、(Ba0.6Ca0.4)SiO3:1.48質量部、Y2O3:1.01質量部、MgCO3:0.72質量%、Cr2O3:0.13質量%、およびV2O5:0.045質量%になるようにセラミック粉体副成分添加物を用意した。
上記のようにして得られた塗料をドクターブレードによって、支持フィルムとしてのPETフィルム上に塗布し、乾燥させることで厚さ12μmのグリーンシートを作製した。
その後、グリーンシートの表面粗さ、シート引張強度、接着性(スタック性/剥離強度)、総合判定の評価を行った。結果を表1に示す。
キシレン系樹脂として、メタキシレンとホルマリンとの付加縮合樹脂をポリオールで変性したポリオール変性型キシレン系樹脂(平均分子量700〜1000)を用いた以外は、実施例1aと同様にして、グリーンシートを作製し、同様な評価を行った。結果を表1に示す。
キシレン系樹脂を無添加とした以外は、実施例1aと同様にして、グリーンシートを作製し、同様な評価を行った。結果を表1に示す。
表1に示すように、キシレン系樹脂無添加の場合に比較して、実施例に係るグリーンシートは、表面粗さおよび接着性が向上することが確認できた。また、その他の粘着付与剤では、無添加の場合よりも、接着性および/または引張強度が低下し、表面粗さも劣化することが確認された。
下記の表2に示すように、キシレン系樹脂の添加量を、セラミック粉体に対して0.1〜1.5質量%(PHP)の範囲で変化させた以外は、実施例1aと同様にして、グリーンシートを作製し、同様な評価を行った。結果を表2に示す。
キシレン系樹脂は、セラミックス粉体100質量部に対して、1.0質量%以下、さらに好ましくは0.1以上1.0質量%以下、特に好ましくは0.1より大きく1.0質量%以下の範囲で添加することが好ましいことが確認できた。また、キシレン系樹脂の添加量が少なすぎると、接着性が低下する傾向にあり、その添加量が多すぎると、接着性は向上するが、シートの表面粗さが粗くなり、多数の積層が困難になると共に、シートの引張強度が低下し、シートのハンドリング性が低下する傾向にあることが確認された。
バインダ樹脂として、PVBに代えて、下記の表3に示すように、積水化学社製の製品番号BX−1のポリビニルアセタール樹脂(PVAc)と、分子量45万、Tg=70℃のアクリル樹脂(MMA−BA)とを用いた以外は、実施例1と同様にしてグリーンシートを作製し、同様な評価を行った。結果を表3に示す。
表3に示すように、バインダ樹脂としては、ポリビニルブチラール樹脂(PVB)が好ましいことが確認できた。すなわち、バインダ樹脂としてのPVBと、粘着付与剤としてのキシレン系樹脂との組合せが、グリーンシートにおける表面粗さ、引張強度および接着性を向上させる観点から好ましいことが確認できた。
Claims (8)
- セラミック粉体と、ブチラール系樹脂を主成分とするバインダ樹脂とを有するグリーンシート用塗料であって、
粘着付与材としてキシレン系樹脂をさらに有するグリーンシート用塗料。 - 前記キシレン系樹脂が、前記セラミックス粉体100質量部に対して、1.0質量%以下の範囲で含有してある請求項1に記載のグリーンシート用塗料。
- 前記ブチラール系樹脂がポリブチラール樹脂であって、
前記ポリブチラール樹脂の重合度が1000以上1700以下であり、樹脂のブチラール化度が64%より大きく78%より小さく、残留アセチル基量が6%未満であることを特徴とする請求項1または2に記載のグリーンシート用塗料。 - 前記バインダ樹脂が前記セラミックス粉体100質量部に対して5質量部以上6.5質量部以下で含まれる請求項1〜3のいずれかに記載のグリーンシート用塗料。
- 可塑剤としてのフタル酸ジオクチルが、前記バインダ樹脂100質量部に対して、40質量部以上70質量部以下で含有する請求項1〜4のいずれかに記載のグリーンシート用塗料。
- 請求項1〜5のいずれかに記載のグリーンシート用塗料を準備する工程と、
前記グリーンシート用塗料を用いてセラミックグリーンシートを成形する工程と、
を有するセラミックグリーンシートの製造方法。 - 請求項1〜5のいずれかに記載のグリーンシート用塗料を準備する工程と、
前記グリーンシート用塗料を用いてセラミックグリーンシートを成形する工程と、
前記グリーンシートを乾燥させる工程と、
乾燥後のグリーンシートを、内部電極層を介して積層し、グリーンチップを得る工程と、
前記グリーンチップを焼成する工程と、
を有するセラミック電子部品の製造方法。 - 請求項1〜5のいずれかに記載のグリーンシート用塗料を用いて製造されるグリーンシート。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003095546 | 2003-03-31 | ||
JP2003095546 | 2003-03-31 | ||
PCT/JP2004/003517 WO2004087614A1 (ja) | 2003-03-31 | 2004-03-17 | グリーンシート用塗料、グリーンシート、グリーンシートの製造方法および電子部品の製造方法 |
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JP (1) | JP4268967B2 (ja) |
KR (1) | KR100708755B1 (ja) |
CN (1) | CN100432020C (ja) |
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EP1593660A4 (en) * | 2003-01-29 | 2009-01-21 | Tdk Corp | COATING COMPOSITION FOR GREEN FILM, MANUFACTURING METHOD, GREEN FILM, METHOD OF MANUFACTURING THEREOF, ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR |
KR100777290B1 (ko) * | 2006-10-24 | 2007-11-20 | 엘지전자 주식회사 | 전계 발광 소자의 제조방법 및 그 그린 시트 |
JP4978518B2 (ja) * | 2007-03-30 | 2012-07-18 | Tdk株式会社 | 積層セラミック電子部品の製造方法 |
JP2008277765A (ja) * | 2007-03-30 | 2008-11-13 | Tdk Corp | 積層セラミック電子部品の製造方法 |
JP5217609B2 (ja) * | 2008-05-12 | 2013-06-19 | 株式会社村田製作所 | 積層セラミック電子部品およびその製造方法 |
JP5671387B2 (ja) * | 2010-04-08 | 2015-02-18 | 積水化学工業株式会社 | スラリー組成物の製造方法 |
CN114628135B (zh) * | 2022-03-14 | 2024-04-12 | 天津大学 | 一种电子元器件的制造方法 |
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JP2625753B2 (ja) | 1987-09-07 | 1997-07-02 | 松下電器産業株式会社 | セラミック生シート |
JPH0728128B2 (ja) * | 1988-03-11 | 1995-03-29 | 松下電器産業株式会社 | セラミック多層配線基板とその製造方法 |
JPH06200229A (ja) | 1992-03-03 | 1994-07-19 | Sekisui Chem Co Ltd | ポリウレタン接着剤及びこの接着剤を使用する化粧シート被覆材料の製造方法 |
JPH05279108A (ja) | 1992-03-31 | 1993-10-26 | Mitsubishi Materials Corp | 積層用セラミックグリーンシートの製造方法 |
JPH0799132A (ja) | 1992-11-25 | 1995-04-11 | Matsushita Electric Ind Co Ltd | セラミックグリーンシートおよび積層セラミック成型体の製造方法 |
JP2858073B2 (ja) * | 1992-12-28 | 1999-02-17 | ティーディーケイ株式会社 | 多層セラミック部品 |
JPH06206756A (ja) | 1993-01-11 | 1994-07-26 | Matsushita Electric Ind Co Ltd | セラミックグリーンシート用スラリー及び積層セラミックコンデンサ |
JP3344888B2 (ja) * | 1995-12-28 | 2002-11-18 | 日本碍子株式会社 | 圧電/電歪膜型素子及びその製造方法 |
JP3320615B2 (ja) | 1996-08-26 | 2002-09-03 | 積水化学工業株式会社 | セラミックグリーンシート用スラリー組成物 |
JP3943206B2 (ja) | 1996-10-09 | 2007-07-11 | 日本特殊陶業株式会社 | セラミック構造体の製造方法 |
JP2000133547A (ja) | 1998-10-26 | 2000-05-12 | Tdk Corp | 積層電子部品用セラミックペーストの製造方法 |
JP3739237B2 (ja) * | 1999-10-06 | 2006-01-25 | 積水化学工業株式会社 | セラミックスラリー及びこれを用いたグリーンシート |
KR100562490B1 (ko) * | 2000-04-28 | 2006-03-21 | 티디케이가부시기가이샤 | 자성 페라이트 분말, 자성 페라이트 소결체, 적층형페라이트 부품 및 적층형 페라이트 부품의 제조방법 |
JP2002043161A (ja) | 2000-07-21 | 2002-02-08 | Murata Mfg Co Ltd | 積層型セラミック電子部品およびその製造方法 |
JP2002104878A (ja) | 2000-09-29 | 2002-04-10 | Sekisui Chem Co Ltd | セラミックグリーンシート用スラリー組成物及びグリーンシート |
JP4424306B2 (ja) * | 2003-03-31 | 2010-03-03 | Tdk株式会社 | グリーンシート用塗料、グリーンシート、グリーンシートの製造方法および電子部品の製造方法 |
DE102004043273A1 (de) * | 2003-09-09 | 2005-05-04 | Ngk Spark Plug Co | Verfahren zur Herstellung eines Keramiksubstrats und Keramiksubstrat |
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2004
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WO2004087614A1 (ja) | 2004-10-14 |
US7388739B2 (en) | 2008-06-17 |
KR100708755B1 (ko) | 2007-04-17 |
US20060199033A1 (en) | 2006-09-07 |
KR20050120693A (ko) | 2005-12-22 |
TW200505815A (en) | 2005-02-16 |
CN100432020C (zh) | 2008-11-12 |
CN1798713A (zh) | 2006-07-05 |
JPWO2004087614A1 (ja) | 2006-06-29 |
TWI265918B (en) | 2006-11-11 |
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