JP4256603B2 - 積層配線板の製造方法 - Google Patents

積層配線板の製造方法 Download PDF

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Publication number
JP4256603B2
JP4256603B2 JP2001234901A JP2001234901A JP4256603B2 JP 4256603 B2 JP4256603 B2 JP 4256603B2 JP 2001234901 A JP2001234901 A JP 2001234901A JP 2001234901 A JP2001234901 A JP 2001234901A JP 4256603 B2 JP4256603 B2 JP 4256603B2
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JP
Japan
Prior art keywords
hole
wiring board
conductor
plating
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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JP2001234901A
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English (en)
Japanese (ja)
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JP2003046248A5 (enExample
JP2003046248A (ja
Inventor
雅一 青山
亮 松野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
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Ibiden Co Ltd
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Publication date
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Priority to JP2001234901A priority Critical patent/JP4256603B2/ja
Publication of JP2003046248A publication Critical patent/JP2003046248A/ja
Publication of JP2003046248A5 publication Critical patent/JP2003046248A5/ja
Application granted granted Critical
Publication of JP4256603B2 publication Critical patent/JP4256603B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2001234901A 2001-08-02 2001-08-02 積層配線板の製造方法 Expired - Lifetime JP4256603B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001234901A JP4256603B2 (ja) 2001-08-02 2001-08-02 積層配線板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001234901A JP4256603B2 (ja) 2001-08-02 2001-08-02 積層配線板の製造方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2008322493A Division JP2009060151A (ja) 2008-12-18 2008-12-18 積層配線板の製造方法
JP2008322517A Division JP4963495B2 (ja) 2008-12-18 2008-12-18 積層配線板およびその製造方法

Publications (3)

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JP2003046248A JP2003046248A (ja) 2003-02-14
JP2003046248A5 JP2003046248A5 (enExample) 2008-07-17
JP4256603B2 true JP4256603B2 (ja) 2009-04-22

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JP2001234901A Expired - Lifetime JP4256603B2 (ja) 2001-08-02 2001-08-02 積層配線板の製造方法

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10609823B2 (en) 2015-04-08 2020-03-31 Hitachi Chemical Company, Ltd. Method for manufacturing multilayer wiring board

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4622672B2 (ja) * 2005-05-19 2011-02-02 パナソニック電工株式会社 配線基板の製造方法
JP5021216B2 (ja) * 2006-02-22 2012-09-05 イビデン株式会社 プリント配線板およびその製造方法
KR20100070161A (ko) * 2008-12-17 2010-06-25 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP5560834B2 (ja) * 2010-03-29 2014-07-30 住友ベークライト株式会社 絶縁基板、絶縁基板の製造方法、プリント配線基板および半導体装置
JP5565953B2 (ja) * 2010-08-30 2014-08-06 京セラＳｌｃテクノロジー株式会社 配線基板およびその製造方法
JP5550526B2 (ja) * 2010-10-29 2014-07-16 Ｔｄｋ株式会社 積層型電子部品およびその製造方法
JP2013038374A (ja) * 2011-01-20 2013-02-21 Ibiden Co Ltd 配線板及びその製造方法
JP6016004B2 (ja) * 2011-09-29 2016-10-26 日立化成株式会社 配線基板及びその製造方法
JP6385635B2 (ja) 2012-05-28 2018-09-05 新光電気工業株式会社 配線基板の製造方法
KR20150094719A (ko) 2012-12-11 2015-08-19 니혼도꾸슈도교 가부시키가이샤 배선기판 및 그 제조방법
US20140166355A1 (en) * 2012-12-18 2014-06-19 Samsung Electro-Mechanics Co., Ltd. Method of manufacturing printed circuit board
JP2015226013A (ja) * 2014-05-29 2015-12-14 イビデン株式会社 プリント配線板およびその製造方法
US10508357B2 (en) * 2016-02-15 2019-12-17 Rohm And Haas Electronic Materials Llc Method of filling through-holes to reduce voids and other defects
KR20180085219A (ko) * 2017-01-18 2018-07-26 삼성전기주식회사 인덕터 및 그 제조 방법
CN111508924B (zh) 2019-01-31 2023-12-15 奥特斯奥地利科技与系统技术有限公司 部件承载件的通孔中的悬伸部补偿式环形镀层
JP2020136634A (ja) * 2019-02-26 2020-08-31 京セラ株式会社 配線基板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10609823B2 (en) 2015-04-08 2020-03-31 Hitachi Chemical Company, Ltd. Method for manufacturing multilayer wiring board

Also Published As

Publication number Publication date
JP2003046248A (ja) 2003-02-14

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