JP4255326B2 - ファン回路基板およびそれを使用するファン構造 - Google Patents
ファン回路基板およびそれを使用するファン構造 Download PDFInfo
- Publication number
- JP4255326B2 JP4255326B2 JP2003270580A JP2003270580A JP4255326B2 JP 4255326 B2 JP4255326 B2 JP 4255326B2 JP 2003270580 A JP2003270580 A JP 2003270580A JP 2003270580 A JP2003270580 A JP 2003270580A JP 4255326 B2 JP4255326 B2 JP 4255326B2
- Authority
- JP
- Japan
- Prior art keywords
- fan
- circuit board
- heat
- hub
- heating element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B15/00—Pumps adapted to handle specific fluids, e.g. by selection of specific materials for pumps or pump parts
- F04B15/06—Pumps adapted to handle specific fluids, e.g. by selection of specific materials for pumps or pump parts for liquids near their boiling point, e.g. under subnormal pressure
- F04B15/08—Pumps adapted to handle specific fluids, e.g. by selection of specific materials for pumps or pump parts for liquids near their boiling point, e.g. under subnormal pressure the liquids having low boiling points
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D25/00—Pumping installations or systems
- F04D25/02—Units comprising pumps and their driving means
- F04D25/06—Units comprising pumps and their driving means the pump being electrically driven
- F04D25/0606—Units comprising pumps and their driving means the pump being electrically driven the electric motor being specially adapted for integration in the pump
- F04D25/0613—Units comprising pumps and their driving means the pump being electrically driven the electric motor being specially adapted for integration in the pump the electric motor being of the inside-out type, i.e. the rotor is arranged radially outside a central stator
- F04D25/0633—Details of the magnetic circuit
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D25/00—Pumping installations or systems
- F04D25/02—Units comprising pumps and their driving means
- F04D25/06—Units comprising pumps and their driving means the pump being electrically driven
- F04D25/068—Mechanical details of the pump control unit
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/58—Cooling; Heating; Diminishing heat transfer
- F04D29/5813—Cooling the control unit
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/58—Cooling; Heating; Diminishing heat transfer
- F04D29/582—Cooling; Heating; Diminishing heat transfer specially adapted for elastic fluid pumps
- F04D29/5853—Cooling; Heating; Diminishing heat transfer specially adapted for elastic fluid pumps heat insulation or conduction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09027—Non-rectangular flat PCB, e.g. circular
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09354—Ground conductor along edge of main surface
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Structures Of Non-Positive Displacement Pumps (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structure Of Printed Boards (AREA)
Description
図1は、本発明による実施の形態1のファン回路基板の模式図である。図2は、本発明のファン回路基板を使用したファンの模式図である。図1及び図2を参照すると、本発明によるファン構造200は、ハブ202と、ハブ202の内部に位置するモータ(図示せず)と、ハブ202と連結する羽根204と、モータと接続される回路基板100と、を備える。
図3に示すように、回路基板300の放熱膜106上には、複数の開口部108を形成してもよい。開口部108は対称に配置されるのが好ましい。この実施の形態において、放熱膜106の開口部108はファン構造200が作動する際の部分空気通路とすることができるので、開口部108を通過する空気が迅速に放熱膜106から放出された熱を運び去ることができる。従って、この実施の形態において、さらに大幅に回路基板300の素子の電流耐性を上げることができ、ファン構造200の寿命を延ばすことができる。
図5に示すように、回路基板400は突起部110を備えてもよい。ここで、発熱素子104は突起部110上に位置する。この実施の形態において、回路基板400は、突起部110のみをハブ202から突出して延出させてもよいし、突起部110と放熱膜106を同時にハブ202から突出して延出させてもよい。突起部110をハブ202から突出させると、発熱素子104が直接ファン構造200の空気通路上に位置するので、この突起部110を通過した空気が直接発熱素子104から生じる大部分の熱を運び去ることができる。このため、さらに回路基板400の素子の電流耐性を大幅に上げることができ、かつファン構造200の寿命を延ばすことができる。
図6に示すように、回路基板500上の放熱膜112は、突起部110上にのみ形成しても良い。または、回路基板500上には、発熱素子104を突起部110上に形成するが、放熱膜を形成しない。この実施の形態において、放熱効果は僅かに低下するが、突起部110を通過する空気が直接発熱素子104から生じた熱の大部分を運び去るので、やはり回路基板500の素子の電流耐性を上げることができ、さらにファン構造200の寿命を延ばすことができる。
図7に示すように、回路基板500の放熱効果を強化するために、突起部110上に発熱素子104まで延出する開口部114を形成し、発熱素子104における突起部110に面した部分が開口部114によって露出された回路基板600が得られる。なお、この実施形態において、発熱素子104は、ほとんど完全に空気通路に露出しているので、突起部110を通過する空気と発熱素子104との接触面積がより大きくなり、発熱素子104からもっと多くの熱を運び去ることができる。このようにして、さらに回路基板600の素子の電流耐性を上げることができ、さらにファン構造200の寿命を延ばすことができる。
102 回路エレメント領域
104 発熱素子
106、112 放熱膜
108、114 開口部
110 突起部
200 ファン構造
202 ハブ
204 羽根
302 補助放熱片
304 係止部
Claims (2)
- ファンのハブの裏側に配置されるファン回路基板であって、
ファン回路基板の、前記ハブの裏面に対向する面である第1の表面上に位置し、発熱素子を有する回路エレメント領域と、
前記第1の表面のエッジ部のみに位置し、前記発熱素子と連結する放熱膜と、
前記発熱素子が位置する突起部と、を備え、
該突起部は、放熱効果を高めるために前記ファンのハブの周囲の、空気が流れる経路の領域まで延びていることを特徴とするファン回路基板。 - ハブと、前記ハブの内部に位置するモータと、前記ハブと連結する複数の羽根と、前記モータと接続し、前記ハブの裏側に配置された回路基板と、を備えるファン構造であって、
前記回路基板の、前記ハブの裏面に対向する面である第1の表面上に位置し、発熱素子を有する回路エレメント領域と、
前記第1の表面のエッジ部のみに位置し、前記発熱素子と連結する放熱膜と、
前記発熱素子が位置する突起部と、を備え、
該突起部は、放熱効果を高めるために前記ファンのハブの周囲の、空気が流れる経路の領域まで延びていることを特徴とするファン構造。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW092205657U TW566828U (en) | 2003-04-11 | 2003-04-11 | Fan circuit board and fan structure with fan circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004319949A JP2004319949A (ja) | 2004-11-11 |
JP4255326B2 true JP4255326B2 (ja) | 2009-04-15 |
Family
ID=32504742
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003270580A Expired - Fee Related JP4255326B2 (ja) | 2003-04-11 | 2003-07-03 | ファン回路基板およびそれを使用するファン構造 |
Country Status (3)
Country | Link |
---|---|
US (3) | US20040202560A1 (ja) |
JP (1) | JP4255326B2 (ja) |
TW (1) | TW566828U (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4815906B2 (ja) | 2005-07-11 | 2011-11-16 | 日本電産株式会社 | 遠心ファン |
US7345884B2 (en) * | 2006-03-14 | 2008-03-18 | Sunonwealth Electic Machine Industry Co., Ltd. | Heat-dissipating fan |
EP2339234A1 (de) * | 2009-12-23 | 2011-06-29 | Micronel AG | Kühlvorrichtung |
CN102467200A (zh) * | 2010-11-12 | 2012-05-23 | 英业达股份有限公司 | 服务器机柜 |
JP2013089313A (ja) * | 2011-10-13 | 2013-05-13 | Tyco Electronics Japan Kk | コネクタ |
CN103912511A (zh) * | 2013-01-04 | 2014-07-09 | 鸿富锦精密工业(深圳)有限公司 | 风扇控制模块 |
CN104632717B (zh) * | 2013-11-12 | 2017-04-12 | 巨铠实业股份有限公司 | 吊扇控制器置放盒的散热结构 |
US10428817B2 (en) | 2016-03-18 | 2019-10-01 | Signify Holding B.V. | Cooling arrangement for cooling an apparatus |
WO2020061920A1 (zh) * | 2018-09-27 | 2020-04-02 | 西门子(中国)有限公司 | 电路板散热系统、电路板以及机器人关节 |
Family Cites Families (25)
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CH654455A5 (de) * | 1980-05-10 | 1986-02-14 | Papst Motoren Gmbh & Co Kg | Buerstenlose gleichstrommotoranordnung, insbesondere fuer magnetplattenantriebe. |
US5274268A (en) * | 1987-04-01 | 1993-12-28 | Semiconductor Energy Laboratory Co., Ltd. | Electric circuit having superconducting layered structure |
JP2610469B2 (ja) * | 1988-02-26 | 1997-05-14 | 株式会社 半導体エネルギー研究所 | 炭素または炭素を主成分とする被膜を形成する方法 |
TW263629B (ja) * | 1992-05-27 | 1995-11-21 | Nihon Densan Kk | |
US5388027A (en) * | 1993-07-29 | 1995-02-07 | Motorola, Inc. | Electronic circuit assembly with improved heatsinking |
US5467251A (en) * | 1993-10-08 | 1995-11-14 | Northern Telecom Limited | Printed circuit boards and heat sink structures |
US5936646A (en) * | 1996-06-28 | 1999-08-10 | Eastman Kodak Company | Image processing equipment with thermally efficient heat dissipating element |
US6401807B1 (en) * | 1997-04-03 | 2002-06-11 | Silent Systems, Inc. | Folded fin heat sink and fan attachment |
US6509704B1 (en) * | 1998-01-23 | 2003-01-21 | Comair Rotron, Inc. | Low profile motor |
US6109890A (en) * | 1998-07-02 | 2000-08-29 | Sunonwealth Electric Machine Industry Co., Ltd. | Miniature blower assembly for outputting air in a certain direction |
US6129528A (en) * | 1998-07-20 | 2000-10-10 | Nmb Usa Inc. | Axial flow fan having a compact circuit board and impeller blade arrangement |
US20020000239A1 (en) * | 1999-09-27 | 2002-01-03 | Krishna G. Sachdev | Removal of cured silicone adhesive for reworking electronic components |
US6488475B2 (en) * | 2000-03-30 | 2002-12-03 | Matsushita Electric Industrial Co., Ltd. | Electric blower and electric cleaner with an air cooled power device situated between the impeller and motor |
JP3749659B2 (ja) * | 2000-10-12 | 2006-03-01 | 建準電機工業股▲分▼有限公司 | ブラシレス直流モーターの平衡片固定構造 |
DE10063619B4 (de) * | 2000-12-20 | 2010-02-18 | Trw Automotive Electronics & Components Gmbh & Co. Kg | Antriebseinheit für Gebläse in Fahrzeugen |
US6462443B2 (en) * | 2001-01-18 | 2002-10-08 | Sunonwealth Electric Machine Industry Co., Ltd. | Brushless D.C. motors structure |
US20020193027A1 (en) * | 2001-02-28 | 2002-12-19 | Dana David E. | Coating solubility of impregnated glass fiber strands |
US6527522B2 (en) * | 2001-07-03 | 2003-03-04 | Yen Sun Technology Corp. | Heat dissipation fan structure |
US6864616B2 (en) * | 2001-10-09 | 2005-03-08 | General Electric Company | Method and apparatus for forming an electric motor having stacked laminations |
DE10161367A1 (de) * | 2001-12-14 | 2003-07-03 | Conti Temic Microelectronic | Elektrische Antriebseinheit |
ATE300802T1 (de) * | 2002-03-02 | 2005-08-15 | Ebm Papst St Georgen Gmbh & Co | Lüfter mit integriertem ip-schutz |
TW535863U (en) * | 2002-05-07 | 2003-06-01 | Delta Electronics Inc | Cooling fan |
JP2004172224A (ja) * | 2002-11-18 | 2004-06-17 | Advics:Kk | 電子制御装置における電子部品の放熱構造 |
JP2004172459A (ja) * | 2002-11-21 | 2004-06-17 | Advics:Kk | 電子制御装置における電子部品の放熱構造 |
US20040257774A1 (en) * | 2003-06-20 | 2004-12-23 | Hao-Cheng Lin | Heat-dissipating fan device with light-emitting capability |
-
2003
- 2003-04-11 TW TW092205657U patent/TW566828U/zh not_active IP Right Cessation
- 2003-07-03 JP JP2003270580A patent/JP4255326B2/ja not_active Expired - Fee Related
-
2004
- 2004-03-10 US US10/797,854 patent/US20040202560A1/en not_active Abandoned
-
2008
- 2008-01-11 US US12/013,228 patent/US20080112136A1/en not_active Abandoned
-
2010
- 2010-02-24 US US12/712,151 patent/US20100150757A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20040202560A1 (en) | 2004-10-14 |
US20100150757A1 (en) | 2010-06-17 |
TW566828U (en) | 2003-12-11 |
US20080112136A1 (en) | 2008-05-15 |
JP2004319949A (ja) | 2004-11-11 |
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