TW566828U - Fan circuit board and fan structure with fan circuit board - Google Patents

Fan circuit board and fan structure with fan circuit board

Info

Publication number
TW566828U
TW566828U TW092205657U TW92205657U TW566828U TW 566828 U TW566828 U TW 566828U TW 092205657 U TW092205657 U TW 092205657U TW 92205657 U TW92205657 U TW 92205657U TW 566828 U TW566828 U TW 566828U
Authority
TW
Taiwan
Prior art keywords
fan
circuit board
fan circuit
fan structure
board
Prior art date
Application number
TW092205657U
Other languages
English (en)
Inventor
Yueh-Lung Huang
Yu-Lung Dung
Yu-Liang Lin
Chen-Lin Huang
Original Assignee
Delta Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Electronics Inc filed Critical Delta Electronics Inc
Priority to TW092205657U priority Critical patent/TW566828U/zh
Priority to JP2003270580A priority patent/JP4255326B2/ja
Publication of TW566828U publication Critical patent/TW566828U/zh
Priority to US10/797,854 priority patent/US20040202560A1/en
Priority to US12/013,228 priority patent/US20080112136A1/en
Priority to US12/712,151 priority patent/US20100150757A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B15/00—Pumps adapted to handle specific fluids, e.g. by selection of specific materials for pumps or pump parts
    • F04B15/06—Pumps adapted to handle specific fluids, e.g. by selection of specific materials for pumps or pump parts for liquids near their boiling point, e.g. under subnormal pressure
    • F04B15/08—Pumps adapted to handle specific fluids, e.g. by selection of specific materials for pumps or pump parts for liquids near their boiling point, e.g. under subnormal pressure the liquids having low boiling points
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D25/00—Pumping installations or systems
    • F04D25/02—Units comprising pumps and their driving means
    • F04D25/06—Units comprising pumps and their driving means the pump being electrically driven
    • F04D25/0606—Units comprising pumps and their driving means the pump being electrically driven the electric motor being specially adapted for integration in the pump
    • F04D25/0613—Units comprising pumps and their driving means the pump being electrically driven the electric motor being specially adapted for integration in the pump the electric motor being of the inside-out type, i.e. the rotor is arranged radially outside a central stator
    • F04D25/0633—Details of the magnetic circuit
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D25/00—Pumping installations or systems
    • F04D25/02—Units comprising pumps and their driving means
    • F04D25/06—Units comprising pumps and their driving means the pump being electrically driven
    • F04D25/068—Mechanical details of the pump control unit
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/58—Cooling; Heating; Diminishing heat transfer
    • F04D29/5813—Cooling the control unit
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/58—Cooling; Heating; Diminishing heat transfer
    • F04D29/582—Cooling; Heating; Diminishing heat transfer specially adapted for elastic fluid pumps
    • F04D29/5853—Cooling; Heating; Diminishing heat transfer specially adapted for elastic fluid pumps heat insulation or conduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09027—Non-rectangular flat PCB, e.g. circular
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09354—Ground conductor along edge of main surface
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW092205657U 2003-04-11 2003-04-11 Fan circuit board and fan structure with fan circuit board TW566828U (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
TW092205657U TW566828U (en) 2003-04-11 2003-04-11 Fan circuit board and fan structure with fan circuit board
JP2003270580A JP4255326B2 (ja) 2003-04-11 2003-07-03 ファン回路基板およびそれを使用するファン構造
US10/797,854 US20040202560A1 (en) 2003-04-11 2004-03-10 Circuit board adapted to fan and fan structure
US12/013,228 US20080112136A1 (en) 2003-04-11 2008-01-11 Circuit board adapted to fan and fan structure
US12/712,151 US20100150757A1 (en) 2003-04-11 2010-02-24 Circuit board adapted to fan and fan structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW092205657U TW566828U (en) 2003-04-11 2003-04-11 Fan circuit board and fan structure with fan circuit board

Publications (1)

Publication Number Publication Date
TW566828U true TW566828U (en) 2003-12-11

Family

ID=32504742

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092205657U TW566828U (en) 2003-04-11 2003-04-11 Fan circuit board and fan structure with fan circuit board

Country Status (3)

Country Link
US (3) US20040202560A1 (zh)
JP (1) JP4255326B2 (zh)
TW (1) TW566828U (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4815906B2 (ja) 2005-07-11 2011-11-16 日本電産株式会社 遠心ファン
US7345884B2 (en) * 2006-03-14 2008-03-18 Sunonwealth Electic Machine Industry Co., Ltd. Heat-dissipating fan
EP2339234A1 (de) * 2009-12-23 2011-06-29 Micronel AG Kühlvorrichtung
CN102467200A (zh) * 2010-11-12 2012-05-23 英业达股份有限公司 服务器机柜
JP2013089313A (ja) * 2011-10-13 2013-05-13 Tyco Electronics Japan Kk コネクタ
CN103912511A (zh) * 2013-01-04 2014-07-09 鸿富锦精密工业（深圳）有限公司 风扇控制模块
CN104632717B (zh) * 2013-11-12 2017-04-12 巨铠实业股份有限公司 吊扇控制器置放盒的散热结构
WO2017157832A1 (en) 2016-03-18 2017-09-21 Philips Lighting Holding B.V. Cooling arrangement for cooling an apparatus
WO2020061920A1 (zh) * 2018-09-27 2020-04-02 西门子（中国）有限公司 电路板散热系统、电路板以及机器人关节

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH654455A5 (de) * 1980-05-10 1986-02-14 Papst Motoren Gmbh & Co Kg Buerstenlose gleichstrommotoranordnung, insbesondere fuer magnetplattenantriebe.
US5274268A (en) * 1987-04-01 1993-12-28 Semiconductor Energy Laboratory Co., Ltd. Electric circuit having superconducting layered structure
JP2610469B2 (ja) * 1988-02-26 1997-05-14 株式会社 半導体エネルギー研究所 炭素または炭素を主成分とする被膜を形成する方法
TW263629B (zh) * 1992-05-27 1995-11-21 Nihon Densan Kk
US5388027A (en) * 1993-07-29 1995-02-07 Motorola, Inc. Electronic circuit assembly with improved heatsinking
US5467251A (en) * 1993-10-08 1995-11-14 Northern Telecom Limited Printed circuit boards and heat sink structures
US5936646A (en) * 1996-06-28 1999-08-10 Eastman Kodak Company Image processing equipment with thermally efficient heat dissipating element
US6401807B1 (en) * 1997-04-03 2002-06-11 Silent Systems, Inc. Folded fin heat sink and fan attachment
US6509704B1 (en) * 1998-01-23 2003-01-21 Comair Rotron, Inc. Low profile motor
US6109890A (en) * 1998-07-02 2000-08-29 Sunonwealth Electric Machine Industry Co., Ltd. Miniature blower assembly for outputting air in a certain direction
US6129528A (en) * 1998-07-20 2000-10-10 Nmb Usa Inc. Axial flow fan having a compact circuit board and impeller blade arrangement
US20020000239A1 (en) * 1999-09-27 2002-01-03 Krishna G. Sachdev Removal of cured silicone adhesive for reworking electronic components
US6488475B2 (en) * 2000-03-30 2002-12-03 Matsushita Electric Industrial Co., Ltd. Electric blower and electric cleaner with an air cooled power device situated between the impeller and motor
JP3749659B2 (ja) * 2000-10-12 2006-03-01 建準電機工業股▲分▼有限公司 ブラシレス直流モーターの平衡片固定構造
DE10063619B4 (de) * 2000-12-20 2010-02-18 Trw Automotive Electronics & Components Gmbh & Co. Kg Antriebseinheit für Gebläse in Fahrzeugen
US6462443B2 (en) * 2001-01-18 2002-10-08 Sunonwealth Electric Machine Industry Co., Ltd. Brushless D.C. motors structure
US20020193027A1 (en) * 2001-02-28 2002-12-19 Dana David E. Coating solubility of impregnated glass fiber strands
US6527522B2 (en) * 2001-07-03 2003-03-04 Yen Sun Technology Corp. Heat dissipation fan structure
US6864616B2 (en) * 2001-10-09 2005-03-08 General Electric Company Method and apparatus for forming an electric motor having stacked laminations
DE10161367A1 (de) * 2001-12-14 2003-07-03 Conti Temic Microelectronic Elektrische Antriebseinheit
AU2003208828A1 (en) * 2002-03-02 2003-09-16 Ebm-Papst St. Georgen Gmbh & Co. Kg Fan having an integrated ip protection
TW535863U (en) * 2002-05-07 2003-06-01 Delta Electronics Inc Cooling fan
JP2004172224A (ja) * 2002-11-18 2004-06-17 Advics:Kk 電子制御装置における電子部品の放熱構造
JP2004172459A (ja) * 2002-11-21 2004-06-17 Advics:Kk 電子制御装置における電子部品の放熱構造
US20040257774A1 (en) * 2003-06-20 2004-12-23 Hao-Cheng Lin Heat-dissipating fan device with light-emitting capability

Also Published As

Publication number Publication date
US20080112136A1 (en) 2008-05-15
JP2004319949A (ja) 2004-11-11
JP4255326B2 (ja) 2009-04-15
US20100150757A1 (en) 2010-06-17
US20040202560A1 (en) 2004-10-14

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model