US20040202560A1 - Circuit board adapted to fan and fan structure - Google Patents

Circuit board adapted to fan and fan structure Download PDF

Info

Publication number
US20040202560A1
US20040202560A1 US10/797,854 US79785404A US2004202560A1 US 20040202560 A1 US20040202560 A1 US 20040202560A1 US 79785404 A US79785404 A US 79785404A US 2004202560 A1 US2004202560 A1 US 2004202560A1
Authority
US
United States
Prior art keywords
heat
circuit board
protrusion
generating component
fan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/797,854
Inventor
Yu-Liang Lin
Yu-Lung Dung
Yueh-Lung Huang
Chen-Lin Huang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Delta Electronics Inc
Original Assignee
Delta Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Electronics Inc filed Critical Delta Electronics Inc
Assigned to DELTA ELECTRONICS, INC. reassignment DELTA ELECTRONICS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: DUNG, YU-LUNG, HUANG, CHEN-LIN, HUANG, YUEH-LUNG, LIN, YU-LIANG
Publication of US20040202560A1 publication Critical patent/US20040202560A1/en
Priority to US12/013,228 priority Critical patent/US20080112136A1/en
Priority to US12/712,151 priority patent/US20100150757A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B15/00—Pumps adapted to handle specific fluids, e.g. by selection of specific materials for pumps or pump parts
    • F04B15/06—Pumps adapted to handle specific fluids, e.g. by selection of specific materials for pumps or pump parts for liquids near their boiling point, e.g. under subnormal pressure
    • F04B15/08—Pumps adapted to handle specific fluids, e.g. by selection of specific materials for pumps or pump parts for liquids near their boiling point, e.g. under subnormal pressure the liquids having low boiling points
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D25/00—Pumping installations or systems
    • F04D25/02—Units comprising pumps and their driving means
    • F04D25/06—Units comprising pumps and their driving means the pump being electrically driven
    • F04D25/0606—Units comprising pumps and their driving means the pump being electrically driven the electric motor being specially adapted for integration in the pump
    • F04D25/0613—Units comprising pumps and their driving means the pump being electrically driven the electric motor being specially adapted for integration in the pump the electric motor being of the inside-out type, i.e. the rotor is arranged radially outside a central stator
    • F04D25/0633—Details of the magnetic circuit
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D25/00—Pumping installations or systems
    • F04D25/02—Units comprising pumps and their driving means
    • F04D25/06—Units comprising pumps and their driving means the pump being electrically driven
    • F04D25/068—Mechanical details of the pump control unit
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/58—Cooling; Heating; Diminishing heat transfer
    • F04D29/5813—Cooling the control unit
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/58—Cooling; Heating; Diminishing heat transfer
    • F04D29/582—Cooling; Heating; Diminishing heat transfer specially adapted for elastic fluid pumps
    • F04D29/5853—Cooling; Heating; Diminishing heat transfer specially adapted for elastic fluid pumps heat insulation or conduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09027—Non-rectangular flat PCB, e.g. circular
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09354—Ground conductor along edge of main surface
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]

Definitions

  • the invention relates to a circuit board adapted to a fan and a fan structure, and, more particularly, to a circuit board that possesses an enhanced efficiency in heat dissipation and a fan structure provided with the same.
  • a conventional fan is operated by a circuit board to drive a motor for activating a hub and fan blades thereof to generate airflow at a certain speed. Accordingly, the heat generated by a heat-generating device provided with the fan can be dissipated by the airflow.
  • the integrated circuit of the cooling fan used in a notebook computer operates in a single-phase bipolar mode.
  • the current flows directly into the integrated circuit, it always results in considerable heat.
  • the heat cannot be dispersed efficiently, it will accumulate and thus causes problems such as overheating and shutdown of the notebook computer.
  • an object of the invention is to provide a circuit board adapted to a fan for improving the efficiency in heat dissipation and increasing the operable current range of the electronic components mounted thereon.
  • Another object of the invention is to provide a fan structure using the aforementioned circuit board for extending the lifetime of a fan.
  • the invention provides a circuit board adapted to a fan comprising a circuit region and a heat-dissipative film.
  • the circuit region is located on one surface of the circuit board and includes a plurality of pads for mounting at least one heat-generating component thereon.
  • the heat-dissipative film is coated on an edge portion of the same surface as the circuit region is located on and is in contact with the heat-generating component.
  • the circuit region is surrounded by the heat-dissipative film, and the heat-dissipative film is formed with a plurality of openings.
  • the heat-dissipative film is a coating film made of heat-conducting material; specifically, the heat-conducting material is selected from the group consisting of copper, aluminum, iron, and an alloy thereof.
  • the circuit board of the invention may further include a heat sink located on a second surface opposite to the aforementioned surface of the circuit board.
  • another circuit region may be provided on the second surface of the circuit board.
  • the heat sink is connected to the heat-dissipative film via the openings.
  • the heat sink is formed by coating a heat-conducting material on an edge portion of the second surface; specifically, the heat-conducting material is selected from the group consisting of copper, aluminum, iron, and an alloy thereof.
  • the circuit board may be provided with a protrusion on which the heat-generating component and/or the heat-dissipative film may be formed.
  • the protrusion may have a cutout which extends over the length of the heat-generating component.
  • the invention also provides a fan structure that includes a hub, a motor located inside the hub, a plurality of fan blades connected to the hub, and a circuit board connected to the motor.
  • the fan structure is characterized by the circuit board, which comprises a circuit region and a heat-dissipative film.
  • the circuit region is located on one surface of the circuit board and has at least one heat-generating component mounted thereon.
  • the heat-dissipative film is coated on an edge portion of the same surface as the circuit region located on and is in contact with the heat-generating component.
  • the circuit board of the invention is provided with the heat-dissipative film and optionally the heat sink, thus the heat generated by the heat-generating component can be readily dissipated by the heat-dissipative film or the heat sink, so that it is possible to dramatically enhance the efficiency in heat dissipation.
  • the heat-dissipative film and/or the heat sink may extend outside the circumference of the hub, thus the heat dissipated from the heat-dissipative film and/or the heat sink can be further dispersed by an airflow generated by the fan. Therefore, it is possible not only for the circuit board to have an enhanced efficiency in heat dissipation and therefore an increased operable current range of the electronic components mounted thereon, but also for the fan provided with the same to have a prolonged lifetime.
  • FIG. 1 is a schematic diagram showing the circuit board according to the first embodiment of the invention.
  • FIG. 2 is a schematic diagram showing the fan provided with the circuit board of the invention.
  • FIG. 3 is a schematic diagram showing the circuit board according to the second embodiment of the invention.
  • FIG. 4A is a schematic diagram showing the heat sink linked with the circuit board of the invention.
  • FIG. 4B is a cross-sectional view taken along the line A-A′ of FIG. 4A.
  • FIG. 5 is a schematic diagram showing the circuit board according to the third embodiment of the invention.
  • FIG. 6 is a schematic diagram showing the circuit board according to the fourth embodiment of the invention.
  • FIG. 7 is a schematic diagram showing the circuit board according to the fifth embodiment of the invention.
  • FIG. 1 is a schematic diagram showing the circuit board according to the first embodiment of the invention
  • FIG. 2 is a schematic diagram showing a fan provided with the circuit board.
  • a fan structure 200 of the invention includes a hub 202 , a motor (not shown) located inside the hub 202 , a plurality of fan blades 204 connected to the hub 202 , and a circuit board 100 connected to the motor.
  • the hub 202 is coupled to the motor so as to rotate synchronously with the motor and drive the fan blades 204 to rotate accordingly.
  • the fan blades 204 rotate, an airflow flowing through the fan structure 200 is generated.
  • the circuit board 100 comprises a circuit region 102 and a heat-dissipative film 106 , wherein the heat-dissipative film 106 is located on the edge of the circuit board 100 .
  • the circuit region 102 includes circuits, semiconductor devices, integrated circuits and related components for driving the motor connected to the circuit board. Some of the components, such as the integrated circuit and semiconductor devices, can be grouped into a heat-generating component 104 .
  • the heat-dissipative film 106 is in contact with the heat-generating component 104 for dissipating the heat generated by the heat-generating component 104 . Moreover, the heat of the heat-dissipative film 106 can be readily dispersed by means of airflow generated in the fan structure 200 .
  • the heat-dissipative film 106 for example, is a coating film made of heat-conducting material, wherein the heat-conducting material is selected from the group consisting of copper, aluminum, iron, and an alloy thereof.
  • the heat-dissipative film 106 is provided to surround the circuit region 102 .
  • the heat-dissipative film 106 can also be located on any region of the circuit board 100 other than on the circuit region 102 .
  • the heat-dissipative film 106 may extend outside the circumference of the hub 202 as shown in FIG. 2, or may be limited to inside the circumference of the hub 202 .
  • the heat-dissipative film 106 extends outside the circumference of the hub 202 so that the heat-dissipative film 106 is located in the air passage of the fan structure 200 , the airflow passing by the heat-dissipative film 106 can readily disperse the heat dissipated from the heat-dissipative film 106 . Therefore, it is possible not only for the circuit board 100 to have an enhanced efficiency in heat dissipation and therefore an increased operable current range of the electronic components mounted thereon, but also for the fan structure 200 provided with the circuit board 100 to have a prolonged lifetime.
  • the heat-dissipative film 106 of a circuit board 300 is formed with a plurality of openings 108 .
  • the openings 108 are symmetrically arranged.
  • the openings 108 of the heat-dissipative film 106 are formed in order to serve as a portion of the air passage in the operating fan structure 200 , thus the heat dissipated from the heat-dissipative film 106 can be readily dispersed by the airflow passing through the openings 108 . Therefore, it is possible not only for the circuit board 300 to have an enhanced efficiency in heat dissipation and therefore an increased operable current range of the electronic components mounted thereon, but also for the fan structure 200 provided with the circuit board 300 to have a prolonged lifetime.
  • a heat sink (not shown) is further formed on the surface opposite to the surface of the circuit board 100 provided with the heat-dissipative film 106 .
  • the heat sink is connected to the heat-dissipative film 106 via a plurality of protruding portions of the heat sink, wherein the airflow passing through a plurality of through holes or the openings 108 thereof as shown in FIG. 3, so that the total area for heat dissipation of the heat-dissipative film 106 can be increased.
  • the heat sink for example, can be a sheet or a coating film made of heat-conducting material, which is selected from the group consisting of copper, aluminum, iron, and an alloy thereof.
  • various shapes of the heat sink may be chosen to meet the actual requirements, such as a shape corresponding to the outline of the circuit board 100 or any other shapes.
  • the heat sink can be located at any region of the circuit board 100 other than the circuit region.
  • the heat sink 302 is engaged with the circuit board 300 by sheet-metal working and connected with the heat-dissipative film 106 .
  • a fastening portion 304 is formed on the heat sink 302 , and then the heat sink 302 is directly engaged with the circuit board 300 via clamping or fastening and then connected to the heat-dissipative film 106 through the fastening portion 304 .
  • the circuit board 400 is provided with a protrusion 110 , wherein a heat-generating component 104 is located on the protrusion 110 .
  • a heat-generating component 104 is located on the protrusion 110 .
  • either only the protrusion 110 of the circuit board 400 extends outside the circumference of the hub 202 or both of the protrusion 110 and the heat-dissipative film 106 extend outside the circumference of the hub 202 .
  • the protrusion 110 is located directly in the air passage of the fan structure 200 , it is possible to dissipate the heat generated by the heat-generating component 104 by the airflow passing past the protrusion 110 . Therefore, it is possible not only for the circuit board 400 to have an enhanced efficiency in heat dissipation and therefore an increased operable current range of the electronic components mounted thereon, but also for the fan structure 200 provided with the circuit board 400 to have a prolonged lifetime.
  • the heat-dissipative film 112 on the circuit board 500 is formed on the protrusion 110 as shown in FIG. 6, or the heat-generating component 104 is mounted on the protrusion 110 of the circuit board 500 alone.
  • the heat generated by the heat-generating component 104 can still be dispersed by the air flowing past the protrusion 110 . Therefore, it is possible not only for the circuit board 500 to have an enhanced efficiency in heat dissipation and therefore an increased operable current range of the electronic components mounted thereon, but also for the fan structure 200 provided with the circuit board 500 to have a prolonged lifetime.
  • a cutout 114 is formed through the protrusion 110 of a circuit board 600 as shown in FIG. 7 to extend over the length of the heat-generating component 104 .
  • a portion of the heat-generating component 104 is exposed to the air passage via the cutout 114 . Therefore, according to this embodiment, the heat-generating component 104 is almost entirely exposed to the air passage, thus the heat-generating component 104 has a greater contact area with the airflow.
  • the heat generated by the heat-generating component 104 is readily dispersed by the air flowing past the protrusion 110 . Therefore, it is possible not only for the circuit board 600 to have an enhanced efficiency in heat dissipation and therefore an increased operable current range of the electronic components mounted thereon, but also for the fan structure 200 provided with the circuit board 600 to have a prolonged lifetime.
  • the circuit board of the invention is provided with a heat-dissipative film and/or a heat sink and thus the heat generated by the heat-generating component can be readily dispersed. Therefore, the efficiency in heat dissipation of the circuit board can be greatly enhanced.
  • the heat-dissipative film may extend outside the circumference of the hub, thus the heat generated by the heat-generating component and dissipated to the heat-dissipative film and/or the heat sink can be readily dispersed by the airflow. Therefore, not only is the efficiency in heat dissipation and therefore the operable current range of the electronic components mounted thereon enhanced, but also the fan structure provided with the circuit board will have a prolonged lifetime.
  • the heat generated by the operating fan can be readily dispersed because the heat-generating component is exposed to the airflow. Therefore, not only is the efficiency in heat dissipation and therefore the operable current range of the electronic components mounted thereon enhanced, but also the fan structure provided with the circuit board will have a prolonged lifetime.

Abstract

A circuit board adapted to a fan comprises a circuit region and a heat-dissipative film. The circuit region is provided on a first surface of the circuit board and comprises at least one heat-generating component thereon. The heat-dissipative film is coated on an edge portion of the first surface and is in contact with the heat-generating component. A plurality of openings through the heat-dissipative film, a protrusion of the circuit board, a cutout in the protrusion to expose the heat-generating component to airflow, etc., have been disclosed and claimed for enhancing the efficiency in heat dissipation. A heat sink may also be provided on a second surface opposite to the first surface of the circuit board. The heat sink is connected to the heat-dissipative film to help dissipate the heat generated by the operation of the fan.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention [0001]
  • The invention relates to a circuit board adapted to a fan and a fan structure, and, more particularly, to a circuit board that possesses an enhanced efficiency in heat dissipation and a fan structure provided with the same. [0002]
  • 2. Description of the Related Art [0003]
  • Generally, a conventional fan is operated by a circuit board to drive a motor for activating a hub and fan blades thereof to generate airflow at a certain speed. Accordingly, the heat generated by a heat-generating device provided with the fan can be dissipated by the airflow. [0004]
  • However, after the fan is operated for a certain period of time, the efficiency in heat dissipation of the fan will deteriorate because during operation the electronic components of the fan also generate heat which cannot be readily dispersed away from the fan structure. [0005]
  • Usually, the integrated circuit of the cooling fan used in a notebook computer operates in a single-phase bipolar mode. In this case, regardless of the amount of operable current of the integrated circuit, since the current flows directly into the integrated circuit, it always results in considerable heat. When the heat cannot be dispersed efficiently, it will accumulate and thus causes problems such as overheating and shutdown of the notebook computer. [0006]
    • BRIEF SUMMARY OF THE INVENTION
  • In view of the aforementioned problems, an object of the invention is to provide a circuit board adapted to a fan for improving the efficiency in heat dissipation and increasing the operable current range of the electronic components mounted thereon. [0007]
  • Another object of the invention is to provide a fan structure using the aforementioned circuit board for extending the lifetime of a fan. [0008]
  • To achieve the objects, the invention provides a circuit board adapted to a fan comprising a circuit region and a heat-dissipative film. The circuit region is located on one surface of the circuit board and includes a plurality of pads for mounting at least one heat-generating component thereon. The heat-dissipative film is coated on an edge portion of the same surface as the circuit region is located on and is in contact with the heat-generating component. [0009]
  • Preferably, the circuit region is surrounded by the heat-dissipative film, and the heat-dissipative film is formed with a plurality of openings. Besides, the heat-dissipative film is a coating film made of heat-conducting material; specifically, the heat-conducting material is selected from the group consisting of copper, aluminum, iron, and an alloy thereof. [0010]
  • Moreover, the circuit board of the invention may further include a heat sink located on a second surface opposite to the aforementioned surface of the circuit board. Besides, another circuit region may be provided on the second surface of the circuit board. The heat sink is connected to the heat-dissipative film via the openings. The heat sink is formed by coating a heat-conducting material on an edge portion of the second surface; specifically, the heat-conducting material is selected from the group consisting of copper, aluminum, iron, and an alloy thereof. [0011]
  • Furthermore, the circuit board may be provided with a protrusion on which the heat-generating component and/or the heat-dissipative film may be formed. Besides, the protrusion may have a cutout which extends over the length of the heat-generating component. [0012]
  • In addition, the invention also provides a fan structure that includes a hub, a motor located inside the hub, a plurality of fan blades connected to the hub, and a circuit board connected to the motor. Specifically, the fan structure is characterized by the circuit board, which comprises a circuit region and a heat-dissipative film. In more detail, the circuit region is located on one surface of the circuit board and has at least one heat-generating component mounted thereon. The heat-dissipative film is coated on an edge portion of the same surface as the circuit region located on and is in contact with the heat-generating component. [0013]
  • The circuit board of the invention is provided with the heat-dissipative film and optionally the heat sink, thus the heat generated by the heat-generating component can be readily dissipated by the heat-dissipative film or the heat sink, so that it is possible to dramatically enhance the efficiency in heat dissipation. [0014]
  • Also, according to the fan structure of the invention, the heat-dissipative film and/or the heat sink may extend outside the circumference of the hub, thus the heat dissipated from the heat-dissipative film and/or the heat sink can be further dispersed by an airflow generated by the fan. Therefore, it is possible not only for the circuit board to have an enhanced efficiency in heat dissipation and therefore an increased operable current range of the electronic components mounted thereon, but also for the fan provided with the same to have a prolonged lifetime. [0015]
  • Still further, in the case that the protrusion of the circuit board is protruded outwardly with respect to the hub, since the heat-generating component provided on the protrusion is exposed to the airflow of the fan, the heat of the heat-generating component can be dispersed rapidly. Therefore, it is possible not only for the circuit board to enhance its efficiency in heat dissipation and therefore to increase the operable current range of the electronic components mounted thereon, but also for the fan provided with the circuit board to have a prolonged lifetime. [0016]
  • Other aspects and advantages of the invention will become apparent from the following detailed description in conjunction with the accompanying drawings, which illustrate by way of example the principles of the invention.[0017]
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a schematic diagram showing the circuit board according to the first embodiment of the invention. [0018]
  • FIG. 2 is a schematic diagram showing the fan provided with the circuit board of the invention. [0019]
  • FIG. 3 is a schematic diagram showing the circuit board according to the second embodiment of the invention. [0020]
  • FIG. 4A is a schematic diagram showing the heat sink linked with the circuit board of the invention. [0021]
  • FIG. 4B is a cross-sectional view taken along the line A-A′ of FIG. 4A. [0022]
  • FIG. 5 is a schematic diagram showing the circuit board according to the third embodiment of the invention. [0023]
  • FIG. 6 is a schematic diagram showing the circuit board according to the fourth embodiment of the invention. [0024]
  • FIG. 7 is a schematic diagram showing the circuit board according to the fifth embodiment of the invention.[0025]
    • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • FIG. 1 is a schematic diagram showing the circuit board according to the first embodiment of the invention, and FIG. 2 is a schematic diagram showing a fan provided with the circuit board. As shown in FIGS. 1 and 2, a [0026] fan structure 200 of the invention includes a hub 202, a motor (not shown) located inside the hub 202, a plurality of fan blades 204 connected to the hub 202, and a circuit board 100 connected to the motor.
  • The [0027] hub 202 is coupled to the motor so as to rotate synchronously with the motor and drive the fan blades 204 to rotate accordingly. When the fan blades 204 rotate, an airflow flowing through the fan structure 200 is generated.
  • It should be understood that the various shapes and materials of the [0028] hub 202, motor, and the fan blades 204 can be chosen to meet the actual requirements. It will be obvious, however, to one skilled in the art, that the present invention may be practiced without some or all of these specific details. In other instances, the specific details have been omitted to avoid misinterpretation of the present invention.
  • The [0029] circuit board 100 comprises a circuit region 102 and a heat-dissipative film 106, wherein the heat-dissipative film 106 is located on the edge of the circuit board 100. The circuit region 102 includes circuits, semiconductor devices, integrated circuits and related components for driving the motor connected to the circuit board. Some of the components, such as the integrated circuit and semiconductor devices, can be grouped into a heat-generating component 104.
  • To be specific, the heat-[0030] dissipative film 106 is in contact with the heat-generating component 104 for dissipating the heat generated by the heat-generating component 104. Moreover, the heat of the heat-dissipative film 106 can be readily dispersed by means of airflow generated in the fan structure 200. The heat-dissipative film 106, for example, is a coating film made of heat-conducting material, wherein the heat-conducting material is selected from the group consisting of copper, aluminum, iron, and an alloy thereof.
  • Moreover, the heat-[0031] dissipative film 106 is provided to surround the circuit region 102. The heat-dissipative film 106 can also be located on any region of the circuit board 100 other than on the circuit region 102. Besides, the heat-dissipative film 106 may extend outside the circumference of the hub 202 as shown in FIG. 2, or may be limited to inside the circumference of the hub 202. When the heat-dissipative film 106 extends outside the circumference of the hub 202 so that the heat-dissipative film 106 is located in the air passage of the fan structure 200, the airflow passing by the heat-dissipative film 106 can readily disperse the heat dissipated from the heat-dissipative film 106. Therefore, it is possible not only for the circuit board 100 to have an enhanced efficiency in heat dissipation and therefore an increased operable current range of the electronic components mounted thereon, but also for the fan structure 200 provided with the circuit board 100 to have a prolonged lifetime.
  • As shown in FIG. 3, the heat-[0032] dissipative film 106 of a circuit board 300 is formed with a plurality of openings 108. Preferably, the openings 108 are symmetrically arranged. According to the second embodiment of the invention, the openings 108 of the heat-dissipative film 106 are formed in order to serve as a portion of the air passage in the operating fan structure 200, thus the heat dissipated from the heat-dissipative film 106 can be readily dispersed by the airflow passing through the openings 108. Therefore, it is possible not only for the circuit board 300 to have an enhanced efficiency in heat dissipation and therefore an increased operable current range of the electronic components mounted thereon, but also for the fan structure 200 provided with the circuit board 300 to have a prolonged lifetime.
  • Moreover, according to the structure of the [0033] circuit board 100, a heat sink (not shown) is further formed on the surface opposite to the surface of the circuit board 100 provided with the heat-dissipative film 106. The heat sink is connected to the heat-dissipative film 106 via a plurality of protruding portions of the heat sink, wherein the airflow passing through a plurality of through holes or the openings 108 thereof as shown in FIG. 3, so that the total area for heat dissipation of the heat-dissipative film 106 can be increased. The heat sink, for example, can be a sheet or a coating film made of heat-conducting material, which is selected from the group consisting of copper, aluminum, iron, and an alloy thereof.
  • Also, various shapes of the heat sink may be chosen to meet the actual requirements, such as a shape corresponding to the outline of the [0034] circuit board 100 or any other shapes. In addition, if another circuit region (not shown) is formed on the other surface of the circuit board, the heat sink can be located at any region of the circuit board 100 other than the circuit region.
  • Alternatively, as shown in FIGS. 4A and 4B, the [0035] heat sink 302 is engaged with the circuit board 300 by sheet-metal working and connected with the heat-dissipative film 106. For instance, a fastening portion 304 is formed on the heat sink 302, and then the heat sink 302 is directly engaged with the circuit board 300 via clamping or fastening and then connected to the heat-dissipative film 106 through the fastening portion 304.
  • Moreover, as shown in FIG. 5, the [0036] circuit board 400 is provided with a protrusion 110, wherein a heat-generating component 104 is located on the protrusion 110. In this embodiment, either only the protrusion 110 of the circuit board 400 extends outside the circumference of the hub 202 or both of the protrusion 110 and the heat-dissipative film 106 extend outside the circumference of the hub 202. Even in the case where only the protrusion 110 extends outside the circumference of the hub 202, because the protrusion 110 is located directly in the air passage of the fan structure 200, it is possible to dissipate the heat generated by the heat-generating component 104 by the airflow passing past the protrusion 110. Therefore, it is possible not only for the circuit board 400 to have an enhanced efficiency in heat dissipation and therefore an increased operable current range of the electronic components mounted thereon, but also for the fan structure 200 provided with the circuit board 400 to have a prolonged lifetime.
  • Alternatively, the heat-[0037] dissipative film 112 on the circuit board 500 is formed on the protrusion 110 as shown in FIG. 6, or the heat-generating component 104 is mounted on the protrusion 110 of the circuit board 500 alone. In this case, the heat generated by the heat-generating component 104 can still be dispersed by the air flowing past the protrusion 110. Therefore, it is possible not only for the circuit board 500 to have an enhanced efficiency in heat dissipation and therefore an increased operable current range of the electronic components mounted thereon, but also for the fan structure 200 provided with the circuit board 500 to have a prolonged lifetime.
  • Furthermore, in order to enhance the efficiency in heat dissipation of the [0038] circuit board 500, a cutout 114 is formed through the protrusion 110 of a circuit board 600 as shown in FIG. 7 to extend over the length of the heat-generating component 104. In this case, a portion of the heat-generating component 104 is exposed to the air passage via the cutout 114. Therefore, according to this embodiment, the heat-generating component 104 is almost entirely exposed to the air passage, thus the heat-generating component 104 has a greater contact area with the airflow. Hence, the heat generated by the heat-generating component 104 is readily dispersed by the air flowing past the protrusion 110. Therefore, it is possible not only for the circuit board 600 to have an enhanced efficiency in heat dissipation and therefore an increased operable current range of the electronic components mounted thereon, but also for the fan structure 200 provided with the circuit board 600 to have a prolonged lifetime.
  • In conclusion, the circuit board of the invention is provided with a heat-dissipative film and/or a heat sink and thus the heat generated by the heat-generating component can be readily dispersed. Therefore, the efficiency in heat dissipation of the circuit board can be greatly enhanced. [0039]
  • Also, according to the fan structure of the invention, the heat-dissipative film may extend outside the circumference of the hub, thus the heat generated by the heat-generating component and dissipated to the heat-dissipative film and/or the heat sink can be readily dispersed by the airflow. Therefore, not only is the efficiency in heat dissipation and therefore the operable current range of the electronic components mounted thereon enhanced, but also the fan structure provided with the circuit board will have a prolonged lifetime. [0040]
  • Moreover, in the case where the protrusion of the circuit board extends outside the circumference of the hub, the heat generated by the operating fan can be readily dispersed because the heat-generating component is exposed to the airflow. Therefore, not only is the efficiency in heat dissipation and therefore the operable current range of the electronic components mounted thereon enhanced, but also the fan structure provided with the circuit board will have a prolonged lifetime. [0041]
  • Although the foregoing invention has been described in some detail for purposes of clarity and ease of understanding, it is apparent that certain changes and modifications may be practiced within the scope of the appended claims. Accordingly, the present embodiments are to be considered as illustrative and not restrictive, and the invention is not to be limited to the details given herein, but may be modified within the scope and equivalents of the appended claims. [0042]

Claims (20)

What is claimed is:
1. A fan structure comprising a hub, a motor located inside the hub, a plurality of fan blades connected to the hub, and a circuit board connected to the motor, wherein the circuit board comprises:
a circuit region provided on a first surface of the circuit board, the circuit region comprising at least one heat-generating component thereon; and
a heat-dissipative film coated on an edge portion of the first surface and in contact with the heat-generating component.
2. The fan structure as claimed in claim 1, wherein the circuit region is surrounded by the heat-dissipative film.
3. The fan structure as claimed in claim 1, wherein the heat-dissipative film extends outside the circumference of the hub.
4. The fan structure as claimed in claim 1, wherein the heat-dissipative film is formed with a plurality of openings.
5. The fan structure as claimed in claim 1, further comprising a heat sink located on a second surface of the circuit board opposite to the first surface of the circuit board.
6. The fan structure as claimed in claim 5, wherein the heat sink is connected to the heat-dissipative film by means of a plurality of through holes and a fastening portion.
7. The fan structure as claimed in claim 1, wherein the first surface of the circuit board comprises a protrusion for carrying the heat-generating component and optionally the heat-dissipative film, and the protrusion extends outside the circumference of the hub.
8. The fan structure as claimed in claim 7, wherein the protrusion has a cutout that extends from a tip of the protrusion to the heat-generating component.
9. The fan structure as claimed in claim 7, wherein the protrusion has a cutout that extends over a portion of the heat-generating component so that the portion of the heat-generating component is exposed via the cutout in the protrusion.
10. A fan structure comprising a hub, a motor located inside the hub, a plurality of fan blades connected to the hub, and a circuit board connected to the motor, wherein the circuit board comprises a protrusion, which extends outside the circumference of the hub and carries thereon a heat-generating component.
11. The fan structure as claimed in claim 10, wherein the protrusion further comprises a cutout that extends from a tip of the protrusion to the heat-generating component.
12. A circuit board for operating a fan, comprising:
a circuit region provided on a first surface of the circuit board and including at least one heat-generating component thereon; and
a heat-dissipative film coated on an edge portion of the first surface and in contact with the heat-generating component.
13. The circuit board as claimed in claim 12, wherein the circuit region is surrounded by the heat-dissipative film.
14. The circuit board as claimed in claim 12, wherein the heat-dissipative film is formed with a plurality of openings.
15. The circuit board as claimed in claim 12, further comprising a heat sink provided on a second surface of the circuit board opposite to the first surface of the circuit board.
16. The circuit board as claimed in claim 15, wherein the heat sink is connected to the heat-dissipative film by means of a plurality of through holes and a fastening portion.
17. The circuit board as claimed in claim 15, wherein the heat sink is selected from the group consisting of a heat-conducting film and a heat-conducting sheet.
18. The circuit board as claimed in claim 12, wherein the first surface of the circuit board comprises a protrusion and the at least one heat-generating component is mounted over the protrusion of the first surface.
19. The circuit board as claimed in claim 17, wherein the protrusion has a cutout that extends from a tip of the protrusion to the heat-generating component and optionally to the heat-dissipative film.
20. The circuit board as claimed in claim 12, wherein the heat-dissipative film is formed by a coating film made of heat-conducting material.
US10/797,854 2003-04-11 2004-03-10 Circuit board adapted to fan and fan structure Abandoned US20040202560A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/013,228 US20080112136A1 (en) 2003-04-11 2008-01-11 Circuit board adapted to fan and fan structure
US12/712,151 US20100150757A1 (en) 2003-04-11 2010-02-24 Circuit board adapted to fan and fan structure

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW092205657U TW566828U (en) 2003-04-11 2003-04-11 Fan circuit board and fan structure with fan circuit board
TW92205657 2003-04-11

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US12/013,228 Division US20080112136A1 (en) 2003-04-11 2008-01-11 Circuit board adapted to fan and fan structure
US12/712,151 Continuation US20100150757A1 (en) 2003-04-11 2010-02-24 Circuit board adapted to fan and fan structure

Publications (1)

Publication Number Publication Date
US20040202560A1 true US20040202560A1 (en) 2004-10-14

Family

ID=32504742

Family Applications (3)

Application Number Title Priority Date Filing Date
US10/797,854 Abandoned US20040202560A1 (en) 2003-04-11 2004-03-10 Circuit board adapted to fan and fan structure
US12/013,228 Abandoned US20080112136A1 (en) 2003-04-11 2008-01-11 Circuit board adapted to fan and fan structure
US12/712,151 Abandoned US20100150757A1 (en) 2003-04-11 2010-02-24 Circuit board adapted to fan and fan structure

Family Applications After (2)

Application Number Title Priority Date Filing Date
US12/013,228 Abandoned US20080112136A1 (en) 2003-04-11 2008-01-11 Circuit board adapted to fan and fan structure
US12/712,151 Abandoned US20100150757A1 (en) 2003-04-11 2010-02-24 Circuit board adapted to fan and fan structure

Country Status (3)

Country Link
US (3) US20040202560A1 (en)
JP (1) JP4255326B2 (en)
TW (1) TW566828U (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070020085A1 (en) * 2005-07-11 2007-01-25 Nidec Corporation Centrifugal fan
US20070217149A1 (en) * 2006-03-14 2007-09-20 Sunonwealth Electric Machine Industry Co., Ltd. Heat-dissipating fan
US20110146966A1 (en) * 2009-12-23 2011-06-23 Micronel Ag Cooling Device
CN102467200A (en) * 2010-11-12 2012-05-23 英业达股份有限公司 Server cabinet
US20140192484A1 (en) * 2013-01-04 2014-07-10 Hon Hai Precision Industry Co., Ltd. Fan controlling system and electronic device using same
US10428817B2 (en) 2016-03-18 2019-10-01 Signify Holding B.V. Cooling arrangement for cooling an apparatus

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013089313A (en) * 2011-10-13 2013-05-13 Tyco Electronics Japan Kk Connector
CN104632717B (en) * 2013-11-12 2017-04-12 巨铠实业股份有限公司 Cooling structure with ceiling fan controller containing box
WO2020061920A1 (en) * 2018-09-27 2020-04-02 西门子（中国）有限公司 Circuit board heat dissipation system, circuit board and robot joint

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4554473A (en) * 1980-05-10 1985-11-19 Papst-Motoren Gmbh & Co. Kg Brushless direct current motor system
US5343104A (en) * 1992-05-27 1994-08-30 Nippon Densan Corporation Fan motor
US20010036409A1 (en) * 2000-03-30 2001-11-01 Yoshitaka Murata Electric blower and electric cleaner using same
US6462443B2 (en) * 2001-01-18 2002-10-08 Sunonwealth Electric Machine Industry Co., Ltd. Brushless D.C. motors structure
US6509704B1 (en) * 1998-01-23 2003-01-21 Comair Rotron, Inc. Low profile motor
US6762521B2 (en) * 2000-12-20 2004-07-13 Trw Automotive Electronics & Components Gmbh & Co. Kg Drive unit for a fan in a vehicle
US6864616B2 (en) * 2001-10-09 2005-03-08 General Electric Company Method and apparatus for forming an electric motor having stacked laminations
US20050116554A1 (en) * 2001-12-14 2005-06-02 Viktor Dano Electric drive unit
US20050123423A1 (en) * 2002-03-02 2005-06-09 Michael Weisser Fan having an integrated ip protection

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5274268A (en) * 1987-04-01 1993-12-28 Semiconductor Energy Laboratory Co., Ltd. Electric circuit having superconducting layered structure
JP2610469B2 (en) * 1988-02-26 1997-05-14 株式会社 半導体エネルギー研究所 Method for forming carbon or carbon-based coating
US5388027A (en) * 1993-07-29 1995-02-07 Motorola, Inc. Electronic circuit assembly with improved heatsinking
US5467251A (en) * 1993-10-08 1995-11-14 Northern Telecom Limited Printed circuit boards and heat sink structures
US5936646A (en) * 1996-06-28 1999-08-10 Eastman Kodak Company Image processing equipment with thermally efficient heat dissipating element
US6401807B1 (en) * 1997-04-03 2002-06-11 Silent Systems, Inc. Folded fin heat sink and fan attachment
US6109890A (en) * 1998-07-02 2000-08-29 Sunonwealth Electric Machine Industry Co., Ltd. Miniature blower assembly for outputting air in a certain direction
US6129528A (en) * 1998-07-20 2000-10-10 Nmb Usa Inc. Axial flow fan having a compact circuit board and impeller blade arrangement
US20020000239A1 (en) * 1999-09-27 2002-01-03 Krishna G. Sachdev Removal of cured silicone adhesive for reworking electronic components
JP3749659B2 (en) * 2000-10-12 2006-03-01 建準電機工業股▲分▼有限公司 Balanced piece fixed structure of brushless DC motor
US20020193027A1 (en) * 2001-02-28 2002-12-19 Dana David E. Coating solubility of impregnated glass fiber strands
US6527522B2 (en) * 2001-07-03 2003-03-04 Yen Sun Technology Corp. Heat dissipation fan structure
TW535863U (en) * 2002-05-07 2003-06-01 Delta Electronics Inc Cooling fan
JP2004172224A (en) * 2002-11-18 2004-06-17 Advics:Kk Heat radiation structure of electronic component in electronic control apparatus
JP2004172459A (en) * 2002-11-21 2004-06-17 Advics:Kk Heat dissipation structure of electronic component in electronic controller
US20040257774A1 (en) * 2003-06-20 2004-12-23 Hao-Cheng Lin Heat-dissipating fan device with light-emitting capability

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4554473A (en) * 1980-05-10 1985-11-19 Papst-Motoren Gmbh & Co. Kg Brushless direct current motor system
US5343104A (en) * 1992-05-27 1994-08-30 Nippon Densan Corporation Fan motor
US6509704B1 (en) * 1998-01-23 2003-01-21 Comair Rotron, Inc. Low profile motor
US20010036409A1 (en) * 2000-03-30 2001-11-01 Yoshitaka Murata Electric blower and electric cleaner using same
US6762521B2 (en) * 2000-12-20 2004-07-13 Trw Automotive Electronics & Components Gmbh & Co. Kg Drive unit for a fan in a vehicle
US6462443B2 (en) * 2001-01-18 2002-10-08 Sunonwealth Electric Machine Industry Co., Ltd. Brushless D.C. motors structure
US6864616B2 (en) * 2001-10-09 2005-03-08 General Electric Company Method and apparatus for forming an electric motor having stacked laminations
US20050116554A1 (en) * 2001-12-14 2005-06-02 Viktor Dano Electric drive unit
US20050123423A1 (en) * 2002-03-02 2005-06-09 Michael Weisser Fan having an integrated ip protection

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070020085A1 (en) * 2005-07-11 2007-01-25 Nidec Corporation Centrifugal fan
US7903406B2 (en) * 2005-07-11 2011-03-08 Nidec Corporation Centrifugal fan
US20070217149A1 (en) * 2006-03-14 2007-09-20 Sunonwealth Electric Machine Industry Co., Ltd. Heat-dissipating fan
US7345884B2 (en) * 2006-03-14 2008-03-18 Sunonwealth Electic Machine Industry Co., Ltd. Heat-dissipating fan
US20110146966A1 (en) * 2009-12-23 2011-06-23 Micronel Ag Cooling Device
CN102467200A (en) * 2010-11-12 2012-05-23 英业达股份有限公司 Server cabinet
US20140192484A1 (en) * 2013-01-04 2014-07-10 Hon Hai Precision Industry Co., Ltd. Fan controlling system and electronic device using same
US10428817B2 (en) 2016-03-18 2019-10-01 Signify Holding B.V. Cooling arrangement for cooling an apparatus

Also Published As

Publication number Publication date
JP2004319949A (en) 2004-11-11
TW566828U (en) 2003-12-11
US20100150757A1 (en) 2010-06-17
US20080112136A1 (en) 2008-05-15
JP4255326B2 (en) 2009-04-15

Similar Documents

Publication Publication Date Title
US20100150757A1 (en) Circuit board adapted to fan and fan structure
JP3578825B2 (en) heatsink
US5597034A (en) High performance fan heatsink assembly
JP4078266B2 (en) Passive cooling device
US20150369257A1 (en) Motor fan
JP2004047998A (en) Heat radiator having a plurality of fin types
US7154750B2 (en) Printed circuit board having cooling means incorporated therein
US7616445B2 (en) Structure and method for efficient thermal dissipation in an electronic assembly
JP2002359331A (en) Slantly attached fan sink
JP2981398B2 (en) Substrate cooling device
USRE40369E1 (en) Heat sink and electronic device employing the same
JPS6255000A (en) Heat sink apparatus
JPH09213849A (en) Cooler of liquid-cooled heat sink
JPH098484A (en) Cooling structure of electronic device
US6399877B1 (en) Heat sink
US6695045B2 (en) Bladed heat sink
CN219533742U (en) Auxiliary radiator for power supply main board
JP2003168884A (en) Electronic component
US20070008701A1 (en) Heat-dissipating device
JP2633504B2 (en) Electronic component cooling device
JP3109750U (en) Circuit board thermal structure
KR200157207Y1 (en) Cooling plate
JPH0817979A (en) Pin fin radiator
KR200293267Y1 (en) Structure of electronic good cooling fan
JP2001244678A (en) Heat dissipation structure of electronic equipment

Legal Events

Date Code Title Description
AS Assignment

Owner name: DELTA ELECTRONICS, INC., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIN, YU-LIANG;DUNG, YU-LUNG;HUANG, YUEH-LUNG;AND OTHERS;REEL/FRAME:015086/0288

Effective date: 20030814

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION