JP2981398B2 - Substrate cooling device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate cooling apparatus for cooling a heat-generating component on a substrate using a fan.

[0002]

2. Description of the Related Art LS in electronic devices such as computers
Japanese Patent Application Laid-Open No. 4-16224 discloses a cooling device for I and IC chips.
No. 97, for example. FIG.
In brief, reference numeral 86 indicates a housing of the device, on which a plurality of substrates 81 on which a plurality of IC chips 82 and a plurality of LSI packages 84 are arranged are mounted.
A jet cooling device 87 having a fan 85 for supplying a cooling fluid between the substrates 81 arranged substantially in parallel and having an air supply duct 90 is provided at an upper portion, and an exhaust port 88 is provided at a lower portion.
Is provided. A small fan 83 is mounted on the substrate 81 where cooling is necessary,
A soundproof wall 89 is provided so as to surround a cooling device such as a fan. In FIG. 11, the jet cooling device 87 shown by a broken line is detachable, and
If the calorific value of the two groups is low, the jet cooling device 87
And can be applied as a parallel flow cooling device using a conventional fan 85.

As described above, in the prior art, the cooling fluid has been blown into each board mainly by a retractable fan with a primary focus on uniform cooling, and each board has a wall with a small hole called a duct to enhance the heat radiation effect. A high-heat package was provided with a small heat-dissipating fan to control the rotation of the small fan in accordance with the amount of heat generated to achieve uniform cooling.

[0004]

The prior art has a structure in which a cooling fan is blown onto a substrate by a retractable fan and the flow of the cooling fluid is controlled by a duct, while the main focus is on uniform cooling. flow there is room for improvement in directing the efficient cooling fluid to the necessary portions consideration has not been made in pairs to flow a portion of a small resistance. In addition, the conventional technology has focused on uniform cooling and sprayed the board with a retractable fan on the board. An increase in power consumption has occurred. Further, the prior art focuses on uniform cooling, and no consideration has been given to board warpage due to mounting of large-capacity components that generate heat.

[0005]

According to a first aspect of the present invention, there is provided an apparatus for cooling a substrate, comprising: a housing for covering an entire substrate on which circuit components are mounted;
Heat generated inside the housing and mounted on the substrate
A radiating pipe that covers the components, connected to the radiating pipe
And a heat-dissipating fan mounted on the board.
In suppressing the cooling device the heat generation of heat generating component that, the
Cooling air intake for taking in cooling fluid from outside
A mouth is provided, and the heat radiating pipe is provided inside the housing.
Cover the high heat-generating components among the heat-generating components mounted on the board.
In addition, the heat dissipation pipe has a cooling air inlet of the housing.
The cooling fluid taken in from inside the heat dissipation pipe
A cooling vent for the heat radiation pipe is provided on the outer periphery of the heat radiation pipe,
Driving the cooling fan cools the external cooling fluid.
Through the cooling air vent and through the cooling vent
A cooling device for a substrate, characterized in that a heat-generating component is cooled by communicating with a heat-radiating pipe .

[0006] Cooling device substrate according to claim 2, wherein, the release
The heat pipe has a dust adhesion filter on its circumscribed surface.
Only with a cooling device substrate according to claim 1, characterized in that.

[0007]

[0008]

According to the cooling device of the first aspect, in the cooling device using the heat radiation fan, the flow of the cooling fluid (air) as shown in FIG. 1 is forcibly applied to the circuit component group arranged on the substrate.
The cooling fluid from the outside of the housing
Vent), and a cooling fan is used to draw cooling fluid.
Heat-dissipating pipes, especially for high-heat components on the board.
In the row position, and furthermore,
Cooling fluid taken in from the cooling air inlet is taken inside the pipe.
By providing the cooling vents for insertion, it is possible to increase the heat radiation efficiency with respect to the high heat-generating components and to prevent a rise in temperature applied to all components. In addition, by using a heat-radiating pipe made of a material with good heat conductivity such as aluminum, fixing high-heat-generating parts that normally require heat-radiating fins to the heat-radiating pipe increases the heat-radiating effect and reduces the number of heat-radiating parts. Can be
Reduction of the noise amount by reducing or fan power consumption it is possible to suppress the flow rate of the good cooling fluid cooling fan from <br/> in that produce efficient for high heat-generating component can be realized. Furthermore, heat dissipation
High heat generation (large capacity processing) by using a conductive material for the pipe
Process) Absorbs unnecessary radiation noise emitted from components with pipes
To reduce the noise of the whole product and
The effect of noise on parts can be suppressed. Also , by fixing a heat-radiating pipe that improves the heat-radiating efficiency so as to bridge the substrate as shown in FIG. 4, the mechanical strength of the substrate can be improved, and the substrate can be prevented from warping due to heat generation of components. , Can be strengthened against impact. Further , since the board can be warped by soldering a large number of components, the board can be smoothly incorporated into the housing.

[0009]

According to the cooling device of the present invention, the dust adhering filter is provided on the circumscribed surface of the heat radiating pipe for improving the heat radiating effect, so that the dust can be prevented from dropping onto the substrate due to the suction force of the heat radiating fan. In addition, a short circuit between components due to humidity or the like can be prevented. In addition , the efficiency of the cleaning operation can be improved by adhering the dust to the filter of the pipe portion.

[0011]

(Embodiment 1) An embodiment of the present invention will be described with reference to FIGS.

[0012] Figure 1 is an overall configuration diagram of a cooling device of the present invention, each of such plurality of IC or LSI and the resonators on the substrate 3,4
The seed circuit components 6 are mounted, and the high heat-generating components 5 are mounted on the substrate in substantially one line in order to increase the cooling efficiency. A discharge type fan 9 is mounted to supply a cooling fluid to a component having an increased temperature in the set, and the fan 9 is called a fan BOX 10 (or also serves as a power supply BOX) and is covered by a housing. The fan box 10 has a function of uniformly generating a cooling fluid on a substrate requiring the cooling fluid. The cooling fluid drawing hole 11 is a hole for drawing a cooling fluid from the substrate 3. The substrate 3 is provided with a perforated cooling pipe so as to cover the high heat generating portion, and is used for efficiently flowing the cooling fluid. The cooling pipe 2 is configured to fit into the cooling fluid drawing hole 11 of the fan BOX 10 when mounting the board. The holes 13 in the product housing 1 are for the purpose of drawing in a cooling fluid for natural cooling and forced cooling. A heat radiating pipe 2 is provided so as to cover a portion where the high heat generating component 5 is mounted on substantially one line on the substrate 3.
Is fixed to the substrate 3 (see FIG. 4). As the fixing method, a method such as screwing as shown in FIG. 6 and a method of fixing a nail as shown in FIG. 7 can be considered. The cooling effect can be improved by making a cooling vent hole 8 for taking in a cooling fluid near the high heat generating component 5 in the heat radiating pipe 2. (The position of the hole depends on the amount of heat generated.) The heat radiating pipe 2 has a structure that fits into the cooling fluid drawing hole 11 of the fan BOX 10 when the substrate 3 is set inside the product. When the power of the product is turned on, a structure in which the fan 9 rotates and efficiently discharges the raised air inside the product (substrate) heated by the high heat generating component 5 through the heat radiation pipe 2 to the outside of the product can be realized. The material of the heat radiating pipe may be resin or metal. Also,
Radiation fins (parts that increase the contact area with the cooling fluid)
The material of the radiating pipe and the like heat transfer properties of a material (aluminum) for the component 7 in need of FIG high heat generating component 5
By fixing as described above, a high calorific value can be absorbed by the cooling fluid to prevent a rise in temperature.

[0013] Figure 2 is a diagram showing a method of attaching to the product substrate, the substrate 3 is inserted into the board insertion guide rail 12 is fixed. The substrate 4 has also been inserted and fixed in the same manner as the board insertion guide rails (not shown).

FIG. 5 is a view taken in the direction of arrow A in FIG. 4, and shows the warp direction of the substrate. Usually, the substrate shown in FIG. 4 has a warp shown in FIG. 5, but the heat radiation pipe according to the present invention is fixed so as to bridge the substrate as shown in FIG. 4, thereby improving the mechanical strength of the substrate in the direction of the arrow in FIG. can do.

FIG. 10 shows another embodiment of the shape of the cooling pipe. Various shapes are conceivable based on the layout of the high heat-generating components on the substrate. FIG. 10 shows a typical shape among them. Yes, the arrows represent the flow of the wind.

Embodiment 2 Another embodiment of the present invention will be described with reference to FIG.

FIG. 8 is an explanatory view in the case where the cooling pipe is made of a conductive material. In this method, a claw 17 is provided at the lower portion of the heat radiating pipe and inserted into a hole 18 on the substrate to bend and fasten the tip. . In this case, a ground pattern 15 is provided on the board of the above-mentioned fastening portion (contact portion), and unnecessary radiation noise generated from a high heat-generating component (large-capacity processing component) is generated by being connected to a heat radiation pipe. A shield wall that can be absorbed by the source can be configured, and the influence on other products and components inside the same substrate can be prevented. Also, the above-mentioned method of fastening the heat radiating pipe to the substrate may be, of course, the screw fastening described above. As a conductive material, a copper plate is generally used in terms of processing and cost.

(Embodiment 3) Another embodiment of the present invention will be described with reference to FIG. In FIG. 9, reference numeral 14 denotes a dust adsorption filter, which is fixed to the outer surface of the heat radiation pipe. The fixing method may be bonding or fitting. In addition, as a dust prevention filter, a sponge material,
Any material having air permeability such as a felt material may be used. Examples of the materials used in the embodiments of the present invention include HIMELON HN603B (0.15 mm thick) and HIMELON HN604B (0.25 mm thick).
mm), Himeron N9295B (thickness 0.35 mm)
(All manufactured by Nippon Felt Industry Co., Ltd.). Others are the same as in the first embodiment, and the description is omitted.

[0019]

Effects of the Invention According to the cooling apparatus according to claim 1, the heat dissipation in the cooling device using the fan, for forcing the flow of cooling fluid (air) as shown in FIG. 1 to a circuit component group arranged on the substrate Hole for taking in cooling fluid from outside of the housing
(Cooling air inlet), and further cooled by a radiating fan
Radiation pipe for drawing fluid, especially high heat generation of substrate
Provided at the position where components are arranged, and the outer peripheral surface of the radiation pipe
Pipe the cooling fluid taken in from the cooling inlet of the housing
By providing the cooling vent for taking in the inside, it is possible to prevent the temperature rise to be given to the whole of the part with increasing the heat dissipation efficiency against a high heat-generating component. In addition, by using a heat-radiating pipe made of a material with good heat conductivity such as aluminum, fixing high-heat-generating parts that normally require heat-radiating fins to the heat-radiating pipe increases the heat-radiating effect and reduces the number of heat-radiating parts. can be the reduction of reduction and the fan according to the noise amount of the power consumption can be suppressed the air volume of more cooling fans that generate efficient cooling fluid against the high heat-generating component can be realized. Change
In addition, high heat is generated by using a conductive material for the radiation pipe.
(Large-capacity processing) Unwanted radiation noise emitted from components
To reduce the overall noise of the product and
The effect of noise on components inside the unit can be suppressed.
You. Also , by fixing a heat-radiating pipe that improves the heat-radiating efficiency so as to bridge the substrate as shown in FIG. 4, the mechanical strength of the substrate can be improved, and the substrate can be prevented from warping due to heat generation of components. , Can be strengthened against impact
You. Furthermore, the board can be smoothly incorporated into the housing because the board can be warped by soldering a large number of components.

[0020]

According to the cooling device of the second aspect , by providing the dust adhering filter on the circumscribed surface of the heat radiating pipe for improving the heat radiating effect, it is possible to prevent dust from dropping onto the substrate due to the suction force of the heat radiating fan. In addition, a short circuit between components due to humidity or the like can be prevented. In addition , the efficiency of the cleaning operation can be improved by adhering the dust to the filter of the pipe portion.

[Brief description of the drawings]

FIG. 1 shows an overall configuration diagram of a cooling device of the present invention.

FIG. 2 is an explanatory diagram showing a method of attaching a substrate to a product.

FIG. 3 is an explanatory view showing an example in which a component requiring a radiation fin is fixed to a cooling pipe.

FIG. 4 is an explanatory view showing a method of attaching a cooling pipe to a substrate.

FIG. 5 is a view taken in the direction of arrow A in FIG.

FIG. 6 is an explanatory diagram of a specific fastening method between the substrate and the cooling pipe in FIG. 4;

FIG. 7 is an explanatory view of a specific fastening method between the substrate and the cooling pipe in FIG. 4;

FIG. 8 is an explanatory diagram when a cooling pipe is made of a conductive material.

FIG. 9 is an explanatory view showing a method of attaching a dust adsorption filter to a cooling pipe.

FIG. 10 is an explanatory view showing another embodiment of the shape of the cooling pipe.

FIG. 11 is an overall configuration diagram of a conventional cooling device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Product housing 2 Heat dissipation pipe 3 Substrate 4 Substrate 5 High heat-generating component 6 IC, LSI 7 High heat-generating component (thing which needs a fin) 8 Cooling ventilation hole 9 Fan 10 Fan BOX 11 Cooling fluid draw-in hole 12 Board insertion guide rail 13 Product Vent Hole 14 Dust Suction Filter 15 Ground Pattern 16 Screw 81 Board 82 IC Chip 83 Small Fan 84 LSI Package 85 Fan 86 Housing 87 Jet Cooling Device 88 Exhaust Port 89 Soundproof Wall 90 Air Supply Duct

Claims (2)

(57) [Claims] 1. A circuit board on which circuit components are mounted.
A housing, mounted inside the housing and mounted on the substrate;
A radiating pipe for covering the heat-generating component, and a radiating pipe connected to the radiating pipe.
And a cooling fan that is mounted on the board.
In the cooling device for suppressing the heat generation of the mounted heat-generating component , the casing includes a cooling device for taking in a cooling fluid from outside.
An intake port is provided, and the heat dissipation pipe is provided inside the housing and mounted on a substrate
It has been covered with high-heat-generating components of the heat-generating component, and more said radiating pipe, from the cooling air inlet of the housing
To take in the cooling fluid that has been taken into the heat dissipation pipe
Cooling vents are provided on the outer periphery of the heat radiating pipe, and the cooling fan
From the cooling air inlet to the inside of the housing, and through the cooling vent
A cooling device for cooling the heat-generating component by communicating with a heat-radiating pipe . 2. The radiating pipe has dust on its circumscribed surface.
2. The substrate cooling device according to claim 1, further comprising an attachment filter .