JP6233238B2 - Dust-proof structure of electronic equipment - Google Patents

Description

  The present invention relates to a dustproof structure for an electronic device that prevents dust from entering a gap formed between a circuit board disposed in the case of the electronic device and the surface of the case.

  As a dustproof structure of this type of electronic device, a dustproof structure disclosed in Patent Document 1 below is known. In this dustproof structure, a circuit board (printed circuit board) with mounting components mounted on the surface is placed in the case of an electronic device (power supply unit), and molten resin is injected into the case so as to embed the circuit board. The injected resin is cured. According to this dustproof structure, since the resin is filled in the gap formed between the circuit board and the surface of the case, the intrusion of dust into the gap can be prevented by the resin. It is possible to prevent the occurrence of a tracking phenomenon due to ignition discharge caused by dust.

JP 2013-115270 A (page 6-9, FIG. 3)

  However, the following problems to be solved exist in the dust-proof structure of the electronic device. In other words, the above-mentioned dustproof structure for an electronic device requires a device for melting the resin, a device for injecting the molten resin, and a device for curing the injected resin. However, there is a problem to be solved that the time required for manufacturing the electronic device becomes long because the time required for curing the resin is required. Further, in the dustproof structure of the electronic device, there is a problem to be solved that stress is generated in the electronic component mounted on the circuit board due to thermal expansion and contraction of the resin.

  The present invention has been made to solve such a problem, and can suppress the cost of equipment, reduce the time required for manufacturing, and avoid the occurrence of stress in electronic components mounted on a circuit board. The main object is to provide a dustproof structure for electronic equipment.

To achieve the above object, dustproof structure of an electronic device according to the present invention, the support walls, and electronic components in dustproof structure of an electronic device and a circuit board attached to the supporting wall while being mounted on the surface there are, frame dust filter having a cushioning property, along the outer edge of the particular region in a state in contact with the opposing surface and the opposing surface between the counter surface and the supporting wall and the supporting wall of the circuit board And is sandwiched in a slightly compressed state by the circuit board and the support wall, and surrounds a specific gap that is a space between the specific region and the support wall on the facing surface. It is out.

Further, in the dustproof structure for an electronic device according to the present invention, a spacer for mounting the circuit board is erected on the support wall, and the dustproof filter has a relief for preventing interference with the spacer. Is formed.
Moreover, the dustproof structure of the electronic device according to the present invention is configured in a frame body in which the dustproof filter is aligned with three sides excluding one side contacting the wall portion of the four sides of the square circuit board.

According to the dustproof structure of the electronic device of the present invention, the dustproof filter having cushioning properties is in contact with the facing surface between the specific region and the supporting wall on the facing surface of the circuit board , and the circuit board. With a simple configuration in which it is sandwiched and arranged in a state where it is slightly compressed by the support wall, it is possible to prevent the intrusion of dust into the specific gap (that is, the intrusion and adhesion of dust into the specific area on the opposite surface of the circuit board). As a result of being surely prevented by this dustproof filter, it is possible to prevent the occurrence of a tracking phenomenon due to ignition discharge caused by dust that has entered the specific gap.

In addition, according to the dustproof structure of this electronic device, a dustproof structure can be realized with a simple operation by placing a dustproof filter having cushioning properties between the circuit board and the support wall, sandwiched between the circuit board and the support wall. As a result, the time required for manufacturing can be reduced and the equipment cost can be greatly reduced compared to the conventional dustproof structure in which the gap formed between the circuit board and the surface of the case is filled with resin. Can be suppressed. Further, dust filter because it is composed of a material having cushions property, it is possible to prevent the generation of stress on the electronic components in contact.

It is a figure for demonstrating a dustproof structure, Comprising: It is a disassembled perspective view of the electronic device 1 in the state which abbreviate | omitted each wall part which stands | starts up from the four sides of the wall part 11 of case 2, and the upper wall part facing the wall part 11 . FIG. 3 is a cross-sectional view of the electronic device 1 in a state where each wall portion rising from four sides of the wall portion 11 and an upper wall portion facing the wall portion 11 are illustrated (a cross-sectional view taken along the line WW in FIG. 1). It is a figure for demonstrating a dustproof structure, Comprising: It is an exploded perspective view of 1 A of electronic devices in the state which abbreviate | omitted each wall part which stands | starts up from the four sides of the wall part 11 of case 2, and the upper wall part facing the wall part 11 . It is sectional drawing (WW sectional view taken on the line in FIG. 3) of the electronic device 1A for demonstrating a dustproof structure. It is a figure for demonstrating a dustproof structure, Comprising: In the state which abbreviate | omitted the wall part except the wall part 14 of each wall part which stands | starts up from the four sides of the wall part 11 of case 2, and the upper wall part facing the wall part 11 It is a disassembled perspective view of the electronic device 1B. It is sectional drawing (WW sectional view taken on the line in FIG. 5) of the electronic device 1B for demonstrating a dustproof structure. It is a figure for demonstrating a dustproof structure, Comprising: It is an exploded perspective view of 1 C of electronic devices in the state which abbreviate | omitted each wall part which stands | starts up from the four sides of the wall part 11 of case 2, and the upper wall part facing the wall part 11 . FIG. 8 is a cross-sectional view (a cross-sectional view taken along the line WW in FIG. 7) of the electronic device 1 </ b> C in a state where each wall portion rising from four sides of the wall portion 11 and an upper wall portion facing the wall portion 11 are illustrated. It is sectional drawing along the plane parallel to the circuit board 3 of the electronic device 1D for demonstrating a dustproof structure.

  Hereinafter, embodiments of a dust-proof structure of an electronic device will be described with reference to the drawings.

  An electronic apparatus 1 as an electronic apparatus having a dustproof structure shown in FIGS. 1 and 2 is a power supply device as an example, and includes a case 2, a circuit board 3, and a dustproof filter 4.

  In the case 2, a part of the wall 11 (in this example, the lower wall as shown in FIGS. 1 and 2 as an example) functions as a support wall (hereinafter also referred to as the support wall 11) for mounting the circuit board 3. Is configured to do. As an example, as shown in FIG. 1, the wall portion 11 is provided with a spacer 12 for mounting the circuit board 3 on its inner surface (position corresponding to a later-described screw hole 3 a formed in the circuit board 3. It functions as a support wall.

  As shown in FIGS. 1 and 2, the circuit board 3 is formed in a square shape (rectangular or square) as shown in FIGS. 1 and 2, and one surface 31 is configured as a main mounting surface of the electronic component 33. Note that the circuit board 3 may have a shape other than a square in plan view (for example, various shapes such as a triangle, a rhombus, a pentagon or more polygon, an ellipse, a circle, and a sector). As shown in FIGS. 1 and 2, the circuit board 3 basically has the other surface 32 (the back surface of the one surface 31 and the surface facing the support wall 11. The electronic component 33 is hardly mounted, and only a small electronic component 33 with a short height is mounted even if it is mounted. Further, the circuit board 3 is formed with a screw hole 3 a for screwing the circuit board 3 to the spacer 12.

  The dustproof filter 4 has a breathable structure such as a three-dimensional network structure (a structure in which resin fibers are three-dimensionally arranged in a random manner) or a non-closed cell structure, and is flame retardant, insulating and cushioning ( It is composed of a filter material formed in a sheet shape (a sheet shape formed with a substantially constant thickness over the entire surface) having a performance for absorbing unevenness on the other side in contact.

  In addition, in this example, as an example, the entire area of the surface 32 facing the support wall 11 of the circuit board 3 is defined in a specific region (which prevents intrusion of dust and tracking phenomenon due to ignition discharge caused by the entered dust). This is an area that should be avoided). Therefore, the dust filter 4 has a size over the entire area of the facing surface 32 of the circuit board 3 facing the support wall 11, that is, the shape in plan view is substantially the same as the shape in plan view of the circuit board 3. As shown in FIG. 1, the dust filter 4 is provided with a relief 13 for preventing interference with the spacer 12, so that the plan view shape of the dust filter 4 is the plan view of the circuit board 3 in this respect. Although it is different from the shape, this difference is assumed to be within the same range. In this example, the escape 13 is formed by cutting out a part of the dust-proof filter 4 as an example. However, the escape 13 can be formed by a through-hole formed in a part.

  The dust filter 4 is formed so that its thickness is slightly larger than the length of the spacer 12.

  In this electronic apparatus 1, the circuit board 3 is attached to the support wall 11 as follows. First, the dustproof filter 4 is placed on the surface of the support wall 11 where the spacers 12 are erected, with the spacers 12 positioned in the respective reliefs 13. Next, the circuit board 3 is placed on the dust filter 4, and the four corners of the circuit board 3 are brought into contact with the end surface of the spacer 12 (the upper surface in FIGS. 1 and 2) so as to slightly compress the dust filter 4. . Finally, the tip of the mounting screw 21 is inserted into each screw hole 3 a of the circuit board 3, and the mounting screw 21 is screwed into the screw hole 12 a formed in the end face of the spacer 12.

  Thereby, the circuit board 3 is attached to the support wall 11 via the spacer 12, and the dustproof filter 4 has a specific area on the facing surface 32 of the circuit board 3 facing the support wall 11 (in this example, the entire area of the facing surface 32). Between the circuit board 3 and the support wall 11 in a state of being sandwiched between the circuit board 3 and the support wall 11 in a state covering the entire specific gap portion SAS between the circuit board 3 and the support wall 11. In this case, the specific gap SAS is a gap formed between the specific area of the gap AS formed between the facing surface 32 of the circuit board 3 and the support wall 11 and the support wall 11. In this example, as described above, since the entire facing surface 32 of the circuit board 3 is the specific region, the entire gap AS formed between the facing surface 32 of the circuit board 3 and the support wall 11 is It is a specific gap portion SAS.

  As described above, in the electronic device 1, the specific gap portion SAS between the support wall 11 and the specific region (the entire region of the counter surface 32 in this example) on the surface 32 facing the support wall 11 of the circuit board 3. A dust-proof structure in which the dust-proof filter 4 is disposed in a state over the whole is adopted.

  Therefore, according to the dustproof structure of the electronic device 1, the dustproof filter 4 is specified by a simple configuration in which the dustproof filter 4 is disposed between the support wall 11 and the specified region on the surface 32 facing the support wall 11 of the circuit board 3. As a result of the dust filter 4 being able to reliably prevent the intrusion of dust into the air gap SAS (that is, the intrusion and adhesion of dust into the specific area on the facing surface 32 of the circuit board 3), the intrusion into the specific air gap SAS is achieved. It is possible to prevent the occurrence of a tracking phenomenon due to ignition discharge caused by the generated dust.

  In addition, according to the dustproof structure of the electronic device 1, the dustproof structure can be realized by a simple operation of disposing the dustproof filter 4 between the circuit board 3 and the support wall 11. Compared to a dustproof structure in which a gap formed between the surface of the case and a resin is filled, the time required for manufacturing can be shortened, and the equipment cost can be significantly reduced. Moreover, since the dustproof filter 4 is generally made of a material having cushioning properties, it is possible to prevent stress from being generated in the electronic component 33 that is in contact therewith.

  Further, according to the dustproof structure of the electronic device 1, the dustproof filter 4 is made of a filter material having air permeability, so that the electronic component 33 mounted on the specific region of the circuit board 3 can be separated from the specific gap portion SAS. Heat can be released to the outside of the specific gap portion SAS through the dust filter 4, and the presence of the dust filter 4 causes the temperature of the electronic component 33 in the specific region to rise excessively. Can be prevented.

The electronic device 1 employs a dustproof structure in which the dustproof filter 4 is disposed over the entire specific gap portion SAS between the circuit board 3 and the support wall 11. A dustproof structure in which the dustproof filter 4A is disposed between the circuit board 3 and the support wall 11 so as to surround the specific gap portion SAS can be adopted as in the electronic device 1A shown in FIG. Here, the state surrounding the particular gap portion SAS, in a plan view in the circuit board 3, the dust filter 4 A along the outer edge of the particular region in the opposing surface 32 of the circuit board 3 is disposed in a frame shape It shall mean the state of being. Further, the state surrounding the particular gap portion SAS, with a dust filter 4 A along the entire outer edge of the specific region including the condition to be disposed in a frame shape (closed frame shape), as described below, this One part of the wall portion constituting the case 2 at one part of the outer edge of the specific region and one of electronic components (an electronic component directly attached to the case 2 without being mounted on the circuit board 3). In the case where the portions are arranged, the state includes a state of being arranged in a frame shape (open frame shape) on the outer edge of the specific region excluding a part of the outer edge where these are arranged.

  Hereinafter, although the dustproof structure of the electronic device 1A will be described, the same components as those of the electronic device 1 are denoted by the same reference numerals, and redundant description will be omitted.

  An electronic apparatus 1A as an electronic apparatus having a dustproof structure shown in FIGS. 3 and 4 is a power supply device as an example, and includes a case 2, a circuit board 3, and a dustproof filter 4A, and other components excluding the dustproof filter 4A Is configured in the same manner as the electronic device 1. 3 and 4, the illustration of the electronic components mounted on the circuit board 3 is omitted.

  The dust filter 4A is made of, for example, a filter material made of the same material as that of the dust filter 4 and is formed in a square frame according to the outer shape of the square circuit board 3 as shown in FIG. With this configuration, as shown in FIG. 4, the dust filter 4 </ b> A is in a state (closed frame-like shape) along the entire outer edge of a specific region (in this example, the entire region of the facing surface 32) on the facing surface 32 of the circuit board 3. In the state, the circuit board 3 and the support wall 11 are interposed between the facing surface 32 of the circuit board 3 and the support wall 11.

  As described above, in the electronic apparatus 1A, the specific gap portion SAS between the support wall 11 and the specific region on the surface 32 facing the support wall 11 of the circuit board 3 (in this example, the entire region of the surface 32). A dustproof structure is adopted in which the dustproof filter 4A is arranged in a frame shape along the entire outer edge.

  Therefore, according to the dust-proof structure of the electronic device 1A, the dust-proof filter 4A is specified by a simple configuration in which the dust-proof filter 4A is disposed between the support wall 11 and the specific region on the surface 32 facing the support wall 11 of the circuit board 3. As a result of the dust-proof filter 4A being able to reliably prevent the intrusion of dust into the space SAS (that is, the intrusion and adhesion of dust into the specific area on the facing surface 32 of the circuit board 3), the dust enters the specific space SAS. It is possible to prevent the occurrence of a tracking phenomenon due to ignition discharge caused by the generated dust.

  In addition, according to the dustproof structure of the electronic device 1A, the dustproof structure can be realized by a simple operation of disposing the dustproof filter 4A between the circuit board 3 and the support wall 11. Compared to a dustproof structure in which a gap formed between the surface of the case and a resin is filled, the time required for manufacturing can be shortened, and the equipment cost can be significantly reduced. Further, since the dustproof filter 4A is generally made of a material having cushioning properties, it is possible to prevent stress from being generated in the electronic component 33 that is in contact therewith.

  Further, according to the dust-proof structure of the electronic device 1A, the dust-proof filter 4A is made of a filter material having air permeability, so that the electronic component 33 mounted in the specific region of the circuit board 3 can be connected to the specific gap portion SAS. Can be appropriately released outside the specific gap portion SAS through the dust filter 4A, and the presence of the dust filter 4A causes the temperature of the electronic component 33 in the specific region to rise excessively. Can be prevented. In addition, according to the dust-proof structure of the electronic apparatus 1A, the inner region of the specific gap SAS surrounded by the frame-shaped dust-proof filter 4A is configured as a gap where no filter exists, so that the dust-proof filter 4A is formed. By reducing the amount of the filter material, the product cost can be reduced, and the electronic component 33 mounted on the specific area of the circuit board 3 can be cooled more efficiently.

  In the electronic apparatus 1A described above, as one aspect of the state surrounding the specific gap portion SAS, the dustproof filter 4A is disposed in a frame shape (closed frame shape) along the entire outer edge of the specific region, thereby providing a dustproof filter. 4A is used to surround the specific gap portion SAS. However, as in the electronic apparatus 1B shown in FIGS. 5 and 6, a member ( A part of a wall part (wall part other than the support wall 11) constituting the case 2 and a part of an electronic component (an electronic part directly attached to the case 2) disposed in the case 2. In this example, as an example When the wall portion 14) constituting the case 2 is disposed, a dustproof filter is formed in a frame shape (open frame shape) on the outer edge of the specific region excluding a part of the outer edge where the member is disposed. By disposing 4B, the specific air gap SAS is surrounded by the dust filter 4B. It is also possible to adopt a configuration in which a state.

  Hereinafter, although the dustproof structure of the electronic device 1B will be described, the same components as those of the electronic device 1A are denoted by the same reference numerals, and redundant description will be omitted.

  An electronic device 1B as an electronic device having a dustproof structure shown in FIGS. 5 and 6 is a power supply device as an example, and includes a case 2, a circuit board 3, and a dustproof filter 4B, and other components excluding the dustproof filter 4A. Is configured the same as the electronic apparatus 1A. 5 and 6, illustration of the electronic components mounted on the circuit board 3 is omitted.

  As shown in FIGS. 5 and 6, the circuit board 3 is attached to the support wall 11 in a state where one side thereof is in contact with a part of the wall portion 14 (wall portion other than the support wall 11) of the case 2. For this reason, in this electronic device 1B, the wall part 14 is arrange | positioned in a part of outer edge of the specific area | region (the whole area of the opposing surface 32 in this example) in the opposing surface 32 of the circuit board 3. As shown in FIG.

  The dustproof filter 4B is made of, for example, a filter material made of the same material as that of the dustproof filter 4A, and, as shown in FIG. 5, three of the four sides of the rectangular circuit board 3 are excluded except for one side that contacts the wall portion 14. A frame body (an open frame body having a U-shape in plan view) is formed in accordance with the side. With this configuration, as shown in FIGS. 5 and 6, the dust filter 4 </ b> B is in a state along the outer edges along the three sides of the outer edges of the specific region on the facing surface 32 of the circuit board 3 (open frame-like shape). In the state), the circuit board 3 and the support wall 11 are sandwiched between the facing surface 32 of the circuit board 3 and the support wall 11.

  As described above, in the electronic apparatus 1B, the specific gap portion SAS between the support wall 11 and the specific region (the entire region of the counter surface 32 in this example) on the surface 32 facing the support wall 11 of the circuit board 3 is used. The dustproof filter 4B is arranged in a frame shape (open frame shape in a U shape in plan view) in a state along all other outer edges except the outer edge where the intrusion of dust is suppressed by the wall portion 14 of the outer edge. Adopted a dustproof structure.

  Therefore, according to the dust-proof structure of the electronic device 1B, the dust-proof filter 4B is specified by a simple configuration in which the dust-proof filter 4B is disposed between the support wall 11 and the specific region on the surface 32 facing the support wall 11 of the circuit board 3. As a result of the dust-proof filter 4B being able to reliably prevent the intrusion of dust into the air gap SAS (that is, the intrusion and adhesion of dust into the specific area on the facing surface 32 of the circuit board 3), the intrusion into the specific air gap SAS is achieved. It is possible to prevent the occurrence of a tracking phenomenon due to ignition discharge caused by the generated dust.

  Further, according to the dustproof structure of the electronic apparatus 1B, the dustproof structure can be realized by a simple operation of disposing the dustproof filter 4B between the circuit board 3 and the support wall 11. Compared to a dustproof structure in which a gap formed between the surface of the case and a resin is filled, the time required for manufacturing can be shortened, and the equipment cost can be significantly reduced. Further, since the dustproof filter 4B is generally made of a material having cushioning properties, it is possible to prevent stress from being generated in the electronic component 33 that is in contact therewith.

  Further, according to the dust-proof structure of the electronic device 1B, the dust-proof filter 4B is made of a filter material having air permeability, so that the electronic component 33 mounted in the specific region of the circuit board 3 can be connected to the specific gap portion SAS. Can be appropriately released outside the specific gap portion SAS through the dust filter 4B, and the temperature of the electronic component 33 in the specific region excessively increases due to the presence of the dust filter 4B. Can be prevented. Further, according to the dustproof structure of the electronic device 1B, the inner area of the specific gap SAS surrounded by the frame-shaped dustproof filter 4B and the wall 14 of the case 2 is configured as a gap where no filter exists. In addition, the amount of filter material for forming the dustproof filter 4B can be reduced, so that the product cost can be reduced, and the electronic component 33 mounted on the specific area of the circuit board 3 can be cooled more efficiently. it can.

  In the electronic devices 1, 1A and 1B, the entire region of the surface 32 facing the support wall 11 of the circuit board 3 is a specific region. However, the present invention is not limited to this, and the electronic devices shown in FIGS. Like the device 1C, a part of the surface 32 facing the support wall 11 of the circuit board 3 is a specific region SA (a region indicated by a one-dot chain line in FIG. 7, for example, an electronic component 33 to which a high voltage is supplied. As a region where sparks are easily generated), a specific gap portion SAS between the specific region SA and the support wall 11 on the facing surface 32 (the entire region of the facing surface 32 of the circuit board 3 and the support wall 11). It is also possible to employ a configuration in which the dustproof filter 4 is disposed only in a part of the gap AS between the two. In addition, about the same structure as the electronic device 1, the same code | symbol is attached | subjected and the overlapping description is abbreviate | omitted. And also in the dustproof structure of this electronic device 1C, there can exist an effect similar to the dustproof structure of the above-mentioned electronic device 1. FIG.

  Although not shown, the circuit board 3 and the support wall 11 are formed in a state in which the dustproof filter 4 is formed on the frame like the electronic devices 1A and 1B and surrounds the specific gap portion SAS that is a part of the gap portion AS. It is also possible to employ a configuration in which the dustproof filter 4 is disposed between the electronic device 1 and the dustproof structure of the electronic device, and the same effects as the dustproof structure of the electronic devices 1A and 1B can be obtained.

  Further, in an electronic device in which a fan 41 is disposed in an intake hole 2a provided in the case 2 as in the electronic device 1D shown in FIG. 9, the fan 41 allows outside air to enter the case 2 through the intake hole 2a. By forcibly supplying the air in the case 2, an air flow (air flow indicated by an arrow in the figure) from the intake hole 2 a toward the exhaust hole 2 b provided in the case 2 is generated in the case 2. Members such as the circuit board 3 and the electronic component 33 mounted on the circuit board 3 are forcibly air-cooled. Although not shown in the figure, the configuration described above may be adopted even if a configuration is adopted in which the fan 41 is disposed in the exhaust hole 2b and the air in the case 2 is forcibly discharged outside the case 2 through the exhaust hole 2b. A similar airflow can be generated in the case 2. In addition, about the same structure as the electronic device 1, the same code | symbol is attached | subjected and the overlapping description is abbreviate | omitted.

  In the electronic apparatus 1 </ b> D having this configuration, a specific region on the facing surface 32 of the circuit board 3 (in this example, the entire surface of the facing surface 32 is an example, but it may be a part of the facing surface 32) and the support wall 11. The air flowing into the specific gap portion SAS mainly flows from the outer edge portion located on the upstream side of the airflow in the outer edge portion of the specific gap portion SAS.

  Specifically, in this electronic device 1D, the rectangular circuit board 3 has a pair of opposing sides (the right side and the left side in FIG. 9) intersecting the airflow (a state that is substantially orthogonal in the figure). Thus, it is attached to the support wall 11 of the case 2 with the right side arranged on the fan 41 side. The electronic component 33, the screw hole 3a, the mounting screw 21 and the spacer 12 are not shown. Therefore, in this electronic device 1D, the air flowing into the specific gap portion SAS is mainly from the outer edge portion ED1 (the outer edge portion along the right side of the circuit board 3) on the right side of the specific gap portion SAS located on the upstream side of the airflow. Inflow. For this reason, dust carried by air also mainly enters the specific gap SAS from the outer edge ED1.

  For this reason, in this electronic device 1D, for example, a columnar (rectangular columnar or circular columnar or cylindrical shape when viewed from the end face side) is disposed on the outer edge ED1 of the specific gap SAS, The dust filter 4C prevents dust from entering the specific gap portion SAS. In addition, as described above, the air flowing into the specific gap portion SAS flows mainly from the outer edge portion ED1 located on the upstream side of the airflow, but also from the outer edge portions ED2 and ED3 along the airflow in the specific gap portion SAS. Break into. For this reason, in this electronic device 1D, the dust-proof filter 4C is also disposed on the outer edge portions ED2 and ED3 of the specific gap portion SAS, and the dust-proof filter 4C also prevents the intrusion of dust into the specific gap portion SAS. ing. As described above, in the electronic device 1D, the dustproof filter 4C is disposed not only on the outer edge portion ED1 where the amount of dust invades, but also on the outer edge portions ED2 and ED3. When the amount of dust intrusion is not so large, the arrangement of the dustproof filter 4C on one or both of the outer edge portions ED2 and ED3 can be omitted.

  Thus, according to the electronic apparatus 1D, the outer edge portion located at least on the upstream side of the airflow among the outer edge portions of the specific gap portion SAS between the specific region on the facing surface 32 of the circuit board 3 and the support wall 11. Due to a simple configuration in which the dust filter 4C is disposed on the ED1, dust intrusion into the specific gap portion SAS (that is, dust intrusion and adhesion to a specific region on the opposite surface of the circuit board) is substantially prevented by the dust filter 4C. As a result of being able to be prevented, it is possible to significantly reduce the occurrence of the tracking phenomenon due to the ignition discharge caused by the dust that has entered the specific gap portion SAS.

  In addition, the dust-proof structure of the electronic device 1D can realize the dust-proof structure by a simple operation of disposing the dust-proof filter 4C between the circuit board 3 and the support wall 11, thereby reducing the manufacturing time. And the equipment cost can be greatly reduced. Further, since the dustproof filter 4C is generally made of a cushioning material, even if there is an electronic component that is in contact with the dustproof filter 4C, stress should not be generated in the electronic component. it can.

  Further, in the dustproof structure of each electronic device described above, a specific air gap portion SAS is removed from the electronic component 33 mounted in a specific region of the circuit board 3 by adopting a filter material having air permeability as a filter material of the dustproof filter. The heat generated inside can be appropriately released to the outside of the specific gap portion SAS through the dust filter 4, but the electronic component 33 mounted in the specific region of the circuit board 3 is an electronic component 33 that generates little heat. In this case, the heat generated from the electronic component 33 into the specific gap portion SAS is reduced, and even if this heat is trapped in the dustproof filter 4, the temperature of the electronic component 33 mounted in the specific region due to this heat There will be no situation where the price rises excessively. For this reason, in such a case, a dustproof filter can also be comprised with the filter raw material which does not have air permeability.

  In addition, the power supply device has been described as an example of the electronic devices 1, 1 </ b> A, 1 </ b> B, 1 </ b> C, and 1 </ b> D, but the above dustproof structure can be applied to electronic devices other than the power supply device. .

1,1A, 1B, 1C, 1D Electronic equipment
3 Circuit board
4, 4A, 4B, 4C Dust-proof filter 11 Support wall 32 Opposing surface SAS Specific gap

Claims (3)

Support walls, and the electronic component is a dustproof structure of an electronic device and a circuit board attached to the supporting wall while being mounted on the surface,
Dust filter having a cushioning property, distribution in a frame shape along the outer edge of the particular region in the state a and the opposing surface in contact with the facing surfaces between the counter surface and the supporting wall and the supporting wall of the circuit board And an electron that is sandwiched between the circuit board and the support wall and is slightly compressed by the circuit board and the support wall, and surrounds a specific gap portion that is a space between the specific region and the support wall on the facing surface. Dust-proof structure of equipment. A spacer for mounting the circuit board is erected on the support wall,
The dustproof structure for an electronic device according to claim 1, wherein the dustproof filter is formed with a relief for preventing interference with the spacer. The dustproof structure for an electronic device according to claim 1 or 2, wherein the dustproof filter is configured in a frame body that matches three sides excluding one side that contacts a wall portion of the four sides of the square circuit board.

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