TWI724899B - Capacitive element heat dissipation structure of controller - Google Patents

Abstract

A heat dissipation structure for a capacitive element of a controller. The controller includes a heat dissipation base plate on which a control circuit board is arranged, and the heat dissipation base plate is also arranged with a power circuit board, and the power circuit board is located between the heat dissipation base plate and the control circuit board. And the power circuit board is attached to the heat dissipation base plate; the capacitive element heat dissipation structure of the controller includes: a plurality of capacitive elements arranged on the control circuit board, and the plurality of capacitive elements are filled with A heat-conducting material, a heat-conducting element is arranged between the plurality of capacitive elements.

Description

Capacitive element heat dissipation structure of controller

The present invention relates to a heat dissipation structure for a capacitive element of a controller, in particular to a control that adds a heat-conducting element between the capacitive elements, which can guide the heat generated by the capacitive element to the heat dissipation base plate to quickly dissipate heat and increase the service life of the capacitive element The heat dissipation structure of the capacitor element of the device.

The controller includes components such as a heat dissipation base plate, a control circuit board, and a power circuit board. The control circuit board and the power circuit board are arranged on the heat dissipation base plate. The power circuit board is attached to the heat dissipation base plate. The controller also includes capacitive elements. On the control circuit board.

Furthermore, power circuit boards usually generate heat. The heat generated by power circuit boards can be quickly dissipated by the heat dissipation base plate. Capacitive elements will also generate heat due to large current output, but the heat generated by capacitor elements can only be natural Heat dissipation, the heat dissipation speed is slow, the capacitor element will accumulate too much heat energy due to the long-term high current output, which may cause the temperature to be too high and reduce the life of the capacitor element, and even cause the function to fail. Therefore, how to make the capacitor element can quickly dissipate heat? Increasing the service life of capacitive elements is an important issue at present.

In view of this, the inventors actively researched and developed the present invention after years of experience in research and development of related products, and after continuous experiments and improvements.

The main purpose of the present invention is to provide a heat dissipation structure for the capacitive element of the controller, which can guide the heat generated by the capacitive element to the heat dissipation base plate to quickly dissipate heat and increase the capacitance. The service life of the component.

In order to achieve the above objective, the present invention provides a heat dissipation structure for a capacitive element of a controller. The controller includes a heat dissipation base plate, a control circuit board is arranged on the heat dissipation base plate, and a power circuit board is also arranged on the heat dissipation base plate. The board is located between the heat dissipation base plate and the control circuit board, and the power circuit board is attached to the heat dissipation base plate; the capacitive element heat dissipation structure of the controller includes: a plurality of capacitive elements arranged on the control circuit board A heat-conducting material is filled between the plurality of capacitive elements, and a heat-conducting element is arranged between the plurality of capacitive elements.

According to the first embodiment of the present invention, one end of the heat-conducting element is located in the heat-conducting material, the other end of the heat-conducting element is located in the groove on the heat dissipation base plate, and the heat-conducting material is filled between the heat-conducting element and the groove .

According to the second embodiment of the present invention, the heat-conducting element and the heat dissipation base plate are integrally formed, and one end of the heat-conducting element is located in the heat-conducting material.

According to the third embodiment of the present invention, one end of the heat-conducting element is fixedly connected to the control circuit board by a fastener, and the power circuit board extends below the capacitive element, and the heat-conducting element is located on the power circuit board.

In order to make the purpose, features and advantages of the present invention easier to understand by those with ordinary knowledge in the field, a preferred embodiment is given below in conjunction with the accompanying drawings and described in detail as follows.

10: Cooling bottom plate

11: Control circuit board

12: Power circuit board

13: Capacitive element

14: Thermally conductive material

15: Thermal element

FIG. 1 is a perspective view of the first embodiment and the second embodiment of the heat dissipation structure of the capacitive element of the controller of the present invention.

Fig. 2 is a perspective cross-sectional view taken along line 2-2 in Fig. 1.

Fig. 3 is a plan sectional view of Fig. 2.

Fig. 4 is a perspective cross-sectional view taken along line 2-2 in Fig. 1.

Fig. 5 is a plan sectional view of Fig. 4.

6 is a perspective view of the third embodiment of the heat dissipation structure of the capacitive element of the controller of the present invention.

Fig. 7 is a perspective sectional view taken along line 7-7 in Fig. 6;

Fig. 8 is a plan sectional view of Fig. 7.

1 to 8, the present invention relates to a heat dissipation structure of a capacitive element of a controller. The controller includes a heat dissipation base plate 10 on which a control circuit board 11 is arranged, and the heat dissipation base plate 10 is also arranged There is a power circuit board 12, the power circuit board 12 is located between the heat dissipation base board 10 and the control circuit board 11, and the power circuit board 12 is attached to the heat dissipation base board 10; the capacitive element heat dissipation structure of the controller includes There are: a plurality of capacitive elements 13 arranged on the control circuit board 11, a heat-conducting material 14 is filled between the plurality of capacitive elements 13, and a heat-conducting element 15 is arranged between the plurality of capacitive elements 13.

Please refer to FIGS. 1 to 3, which are a perspective view, a perspective cross-sectional view, and a plan cross-sectional view of the first embodiment of the present invention. According to the first embodiment of the present invention, one end of the heat-conducting element 15 is located in the heat-conducting material 14, the other end of the heat-conducting element 15 is located in the groove on the heat-dissipating bottom plate 10, and there is a gap between the heat-conducting element 15 and the groove. The thermal conductive material 14 is filled.

Please refer to FIG. 1, FIG. 4, and FIG. 5, which are a perspective view, a perspective cross-sectional view, and a plan cross-sectional view of the second embodiment of the present invention. According to the second embodiment of the present invention, the heat-conducting element 15 and the heat dissipation base plate 10 are integrally formed, and one end of the heat-conducting element 15 is located in the heat-conducting material 14. The other end of the heat conducting element 15 and the heat dissipation base plate 10 are integrally formed.

Please refer to FIGS. 6 to 8, which are a perspective view, a perspective cross-sectional view, and a plan cross-sectional view of the third embodiment of the present invention. According to the third embodiment of the present invention, one end of the heat-conducting element 15 is fixedly connected to the control circuit board 11 by a fastener, and the power circuit board 12 extends below the capacitive element 13, and the heat-conducting element 15 is located at the power On the circuit board 12.

Following the above-mentioned embodiment, the heat conducting element 15 is a heat pipe, which has the characteristics of rapid temperature equalization.

Following the above-mentioned embodiment, the heat-conducting element 15 is made of a metal material with fast uniform temperature characteristics.

With the heat dissipation structure of the capacitor element of the controller of the present invention, the heat energy generated by the capacitor element can be guided to the heat dissipation base plate to quickly dissipate heat, thereby increasing the service life of the capacitor element.

Although the present invention has been disclosed as above in the preferred embodiment, it is not intended to limit the present invention. Anyone familiar with this technology can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of protection shall be subject to the scope of the attached patent application.

10: Cooling bottom plate

11: Control circuit board

12: Power circuit board

13: Capacitive element

14: Thermally conductive material

15: Thermal element

Claims (6)

A heat dissipation structure for a capacitive element of a controller. The controller includes a heat dissipation base plate on which a control circuit board is arranged, and the heat dissipation base plate is also arranged with a power circuit board, and the power circuit board is located between the heat dissipation base plate and the control circuit board. And the power circuit board is attached to the heat dissipation base plate; the heat dissipation structure of the capacitive element of the controller includes: A plurality of capacitive elements are arranged on the control circuit board, a heat-conducting material is filled between the plurality of capacitive elements, and a heat-conducting element is arranged between the plurality of capacitive elements. The capacitive element heat dissipation structure of the controller according to claim 1, wherein one end of the heat conduction element is located in the heat conduction material, the other end of the heat conduction element is located in a groove on the heat dissipation base plate, and the heat conduction element and the groove The space is also filled with the thermally conductive material. The heat dissipation structure of the capacitive element of the controller according to claim 1, wherein the heat conduction element and the heat dissipation base plate are integrally formed, and one end of the heat conduction element is located in the heat conduction material. The heat dissipation structure of the capacitive element of the controller according to claim 1, wherein one end of the heat-conducting element is fixedly connected to the control circuit board by a fastener, and the power circuit board extends below the capacitive element, and the heat-conducting element is located The power circuit board. The heat dissipation structure of the capacitive element of the controller according to claim 1, wherein the heat-conducting element is a heat pipe. The heat dissipation structure of the capacitive element of the controller according to claim 1, wherein the heat-conducting element is made of a metal material with rapid temperature uniformity characteristics.

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