JP4250898B2 - 回路パターンの検査方法及びその装置 - Google Patents

回路パターンの検査方法及びその装置 Download PDF

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Publication number
JP4250898B2
JP4250898B2 JP2002045569A JP2002045569A JP4250898B2 JP 4250898 B2 JP4250898 B2 JP 4250898B2 JP 2002045569 A JP2002045569 A JP 2002045569A JP 2002045569 A JP2002045569 A JP 2002045569A JP 4250898 B2 JP4250898 B2 JP 4250898B2
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defect
image
threshold
threshold value
defect candidate
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Japanese (ja)
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JP2003006614A (ja
JP2003006614A5 (https=
Inventor
高志 広井
正浩 渡辺
千絵 宍戸
朝宏 久邇
麻紀 田中
裕史 宮井
安彦 奈良
真理 野副
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Hitachi Ltd
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Hitachi Ltd
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10056—Microscopic image
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
JP2002045569A 2001-02-22 2002-02-22 回路パターンの検査方法及びその装置 Expired - Fee Related JP4250898B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/791,911 US6898305B2 (en) 2001-02-22 2001-02-22 Circuit pattern inspection method and apparatus
US09/791,911 2001-02-22

Publications (3)

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JP2003006614A JP2003006614A (ja) 2003-01-10
JP2003006614A5 JP2003006614A5 (https=) 2005-08-11
JP4250898B2 true JP4250898B2 (ja) 2009-04-08

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US (1) US6898305B2 (https=)
JP (1) JP4250898B2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
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WO2023136030A1 (ja) 2022-01-14 2023-07-20 富士フイルム株式会社 情報処理装置、情報処理方法、及び情報処理プログラム

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JP4654093B2 (ja) 2005-08-31 2011-03-16 株式会社日立ハイテクノロジーズ 回路パターン検査方法及びその装置
JP4336672B2 (ja) * 2005-09-26 2009-09-30 アドバンスド・マスク・インスペクション・テクノロジー株式会社 試料検査装置、試料検査方法及びプログラム
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KR101647010B1 (ko) * 2008-06-19 2016-08-10 케이엘에이-텐코어 코오포레이션 웨이퍼의 하나 이상의 특성들을 결정하기 위한 컴퓨터-구현 방법들, 컴퓨터-판독 가능 매체, 및 시스템들
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CN110389127B (zh) * 2019-07-03 2020-08-14 浙江大学 一种金属陶瓷零件识别及表面缺陷检测系统和方法
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JP7469740B2 (ja) * 2020-05-27 2024-04-17 京セラドキュメントソリューションズ株式会社 ベルト検査システムおよびベルト検査プログラム
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Publication number Priority date Publication date Assignee Title
WO2023136030A1 (ja) 2022-01-14 2023-07-20 富士フイルム株式会社 情報処理装置、情報処理方法、及び情報処理プログラム

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US6898305B2 (en) 2005-05-24
US20020114506A1 (en) 2002-08-22
JP2003006614A (ja) 2003-01-10

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