JP4230492B2 - 低密着性材料、樹脂成形型及び防汚性材料 - Google Patents
低密着性材料、樹脂成形型及び防汚性材料 Download PDFInfo
- Publication number
- JP4230492B2 JP4230492B2 JP2006108869A JP2006108869A JP4230492B2 JP 4230492 B2 JP4230492 B2 JP 4230492B2 JP 2006108869 A JP2006108869 A JP 2006108869A JP 2006108869 A JP2006108869 A JP 2006108869A JP 4230492 B2 JP4230492 B2 JP 4230492B2
- Authority
- JP
- Japan
- Prior art keywords
- main body
- surface layer
- resin
- low adhesion
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 title claims description 238
- 229920005989 resin Polymers 0.000 title claims description 149
- 239000011347 resin Substances 0.000 title claims description 149
- 230000003373 anti-fouling effect Effects 0.000 title claims description 18
- 239000002344 surface layer Substances 0.000 claims description 160
- 239000012530 fluid Substances 0.000 claims description 33
- 239000000126 substance Substances 0.000 claims description 26
- 238000000465 moulding Methods 0.000 claims description 21
- 239000006104 solid solution Substances 0.000 claims description 13
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 claims description 12
- 229910000831 Steel Inorganic materials 0.000 claims description 10
- 239000010959 steel Substances 0.000 claims description 10
- 239000002131 composite material Substances 0.000 claims description 9
- 239000005416 organic matter Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 description 16
- 239000000758 substrate Substances 0.000 description 10
- 229910001315 Tool steel Inorganic materials 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 230000005674 electromagnetic induction Effects 0.000 description 3
- 230000003628 erosive effect Effects 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 238000001721 transfer moulding Methods 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 230000009969 flowable effect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229910009043 WC-Co Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- -1 for example Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 239000002436 steel type Substances 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/001—Joining burned ceramic articles with other burned ceramic articles or other articles by heating directly with other burned ceramic articles
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
- C04B2237/345—Refractory metal oxides
- C04B2237/348—Zirconia, hafnia, zirconates or hafnates
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Laminated Bodies (AREA)
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006108869A JP4230492B2 (ja) | 2006-04-11 | 2006-04-11 | 低密着性材料、樹脂成形型及び防汚性材料 |
| US11/988,802 US7901797B2 (en) | 2006-04-11 | 2006-12-27 | Low-adhesion material, resin molding die, and soil resistant material |
| EP06843408.3A EP2006083B1 (en) | 2006-04-11 | 2006-12-27 | Low-adhesion material, mold for shaping resin and stainproof material |
| CN2006800392783A CN101291805B (zh) | 2006-04-11 | 2006-12-27 | 低粘附性材料、树脂成形模及防污性材料 |
| PCT/JP2006/326026 WO2007116571A1 (ja) | 2006-04-11 | 2006-12-27 | 低密着性材料、樹脂成形型および防汚性材料 |
| KR1020087001220A KR100923623B1 (ko) | 2006-04-11 | 2006-12-27 | 저밀착성 재료, 수지 성형틀 및 방오성 재료 |
| TW095150112A TW200738581A (en) | 2006-04-11 | 2006-12-29 | Low-adhesion material, mold for shaping resin and stainproof material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006108869A JP4230492B2 (ja) | 2006-04-11 | 2006-04-11 | 低密着性材料、樹脂成形型及び防汚性材料 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007276402A JP2007276402A (ja) | 2007-10-25 |
| JP4230492B2 true JP4230492B2 (ja) | 2009-02-25 |
Family
ID=38580873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006108869A Expired - Fee Related JP4230492B2 (ja) | 2006-04-11 | 2006-04-11 | 低密着性材料、樹脂成形型及び防汚性材料 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7901797B2 (enExample) |
| EP (1) | EP2006083B1 (enExample) |
| JP (1) | JP4230492B2 (enExample) |
| KR (1) | KR100923623B1 (enExample) |
| CN (1) | CN101291805B (enExample) |
| TW (1) | TW200738581A (enExample) |
| WO (1) | WO2007116571A1 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3996138B2 (ja) * | 2004-03-26 | 2007-10-24 | Towa株式会社 | 低密着性材料及び樹脂成形型 |
| JP5554898B2 (ja) * | 2008-03-24 | 2014-07-23 | Towa株式会社 | 低密着性材料及びその製造方法、成形型及びその製造方法、並びに、防汚性材料及びその製造方法 |
| JP5561992B2 (ja) * | 2009-10-09 | 2014-07-30 | Towa株式会社 | 低密着性材料、防汚性材料、成形型、及び、それらの製造方法 |
| CN102407703A (zh) * | 2010-09-25 | 2012-04-11 | 天津市阿波罗信息技术有限公司 | 又一种数字化防伪印刷的处理方法 |
| CN102442096B (zh) * | 2010-10-09 | 2014-12-17 | 天津市阿波罗信息技术有限公司 | 一种在文字字库中埋入信息的可变信息印刷方法 |
| GB201022127D0 (en) * | 2010-12-31 | 2011-02-02 | Element Six Production Pty Ltd | A superhard structure and method of making same |
| JP6366348B2 (ja) * | 2014-05-09 | 2018-08-01 | Towa株式会社 | 成形型 |
| WO2015198184A1 (en) * | 2014-06-24 | 2015-12-30 | Bombardier Inc. | A thermally expansive molding tool and a method of molding with such tool |
| JP6335812B2 (ja) * | 2015-02-16 | 2018-05-30 | 三菱電機株式会社 | 成形用金型、およびその製造方法 |
| JP6462454B2 (ja) * | 2015-03-30 | 2019-01-30 | Towa株式会社 | 成形型および低密着性材料 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04149074A (ja) | 1990-10-09 | 1992-05-22 | Toshiba Tungaloy Co Ltd | 高強度積層セラミックス焼結体 |
| US5176839A (en) * | 1991-03-28 | 1993-01-05 | General Electric Company | Multilayered mold structure for hot surface molding in a short cycle time |
| JPH04364945A (ja) | 1991-06-12 | 1992-12-17 | Inax Corp | 高強度多結晶焼結セラミックス積層体 |
| JP2912125B2 (ja) | 1993-08-10 | 1999-06-28 | 東レ株式会社 | 陶磁器板およびその製造方法 |
| CN2381460Y (zh) * | 1999-04-14 | 2000-06-07 | 徐文忠 | 复合坚韧耐磨树脂基模具 |
| WO2004101248A1 (ja) * | 2003-05-13 | 2004-11-25 | Kuraray Co., Ltd. | 樹脂成形用金型及び該樹脂成形用金型の製造方法 |
| JP2005193610A (ja) * | 2004-01-09 | 2005-07-21 | Towa Corp | 複合材料及び樹脂成形型 |
| JP3996138B2 (ja) | 2004-03-26 | 2007-10-24 | Towa株式会社 | 低密着性材料及び樹脂成形型 |
| JP2006017335A (ja) | 2004-06-30 | 2006-01-19 | Okawara Mfg Co Ltd | 被処理物の分散性を向上させた連続式伝導伝熱乾燥機並びにその運転方法 |
| JP2006131429A (ja) * | 2004-11-02 | 2006-05-25 | Towa Corp | 低密着性材料及び樹脂成形型 |
| JP3974152B2 (ja) | 2006-01-26 | 2007-09-12 | Towa株式会社 | 低密着性材料、樹脂成形型及び防汚性材料 |
-
2006
- 2006-04-11 JP JP2006108869A patent/JP4230492B2/ja not_active Expired - Fee Related
- 2006-12-27 WO PCT/JP2006/326026 patent/WO2007116571A1/ja not_active Ceased
- 2006-12-27 CN CN2006800392783A patent/CN101291805B/zh not_active Expired - Fee Related
- 2006-12-27 KR KR1020087001220A patent/KR100923623B1/ko not_active Expired - Fee Related
- 2006-12-27 EP EP06843408.3A patent/EP2006083B1/en not_active Ceased
- 2006-12-27 US US11/988,802 patent/US7901797B2/en not_active Expired - Fee Related
- 2006-12-29 TW TW095150112A patent/TW200738581A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CN101291805A (zh) | 2008-10-22 |
| EP2006083A2 (en) | 2008-12-24 |
| KR20080031284A (ko) | 2008-04-08 |
| KR100923623B1 (ko) | 2009-10-23 |
| EP2006083A4 (en) | 2012-10-24 |
| EP2006083B1 (en) | 2017-04-05 |
| EP2006083A9 (en) | 2009-07-01 |
| TWI344412B (enExample) | 2011-07-01 |
| CN101291805B (zh) | 2012-06-20 |
| US7901797B2 (en) | 2011-03-08 |
| JP2007276402A (ja) | 2007-10-25 |
| US20090107361A1 (en) | 2009-04-30 |
| TW200738581A (en) | 2007-10-16 |
| WO2007116571A1 (ja) | 2007-10-18 |
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