TWI357788B - - Google Patents

Download PDF

Info

Publication number
TWI357788B
TWI357788B TW94131533A TW94131533A TWI357788B TW I357788 B TWI357788 B TW I357788B TW 94131533 A TW94131533 A TW 94131533A TW 94131533 A TW94131533 A TW 94131533A TW I357788 B TWI357788 B TW I357788B
Authority
TW
Taiwan
Prior art keywords
aluminum
carbonized
aluminum layer
layer
thickness
Prior art date
Application number
TW94131533A
Other languages
English (en)
Chinese (zh)
Other versions
TW200618697A (en
Inventor
Goh Iwamoto
Hideki Hirotsuru
Kazunori Hirahara
Original Assignee
Denki Kagaku Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo Kk filed Critical Denki Kagaku Kogyo Kk
Publication of TW200618697A publication Critical patent/TW200618697A/zh
Application granted granted Critical
Publication of TWI357788B publication Critical patent/TWI357788B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C04B41/515—Other specific metals
    • C04B41/5155—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • C04B41/88—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
    • C04B2111/00844—Uses not provided for elsewhere in C04B2111/00 for electronic applications
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09018—Rigid curved substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12007—Component of composite having metal continuous phase interengaged with nonmetal continuous phase
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249955—Void-containing component partially impregnated with adjacent component
    • Y10T428/249956—Void-containing component is inorganic
    • Y10T428/249957—Inorganic impregnant
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249971—Preformed hollow element-containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249971—Preformed hollow element-containing
    • Y10T428/249974—Metal- or silicon-containing element
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249986—Void-containing component contains also a solid fiber or solid particle
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249987—With nonvoid component of specified composition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249987—With nonvoid component of specified composition
    • Y10T428/24999—Inorganic
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Ceramic Products (AREA)
TW094131533A 2004-09-14 2005-09-13 Aluminum-silicon carbide composite TW200618697A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004266144 2004-09-14

Publications (2)

Publication Number Publication Date
TW200618697A TW200618697A (en) 2006-06-01
TWI357788B true TWI357788B (enExample) 2012-02-01

Family

ID=36059931

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094131533A TW200618697A (en) 2004-09-14 2005-09-13 Aluminum-silicon carbide composite

Country Status (7)

Country Link
US (1) US7838107B2 (enExample)
EP (1) EP1796164B1 (enExample)
JP (1) JP4761157B2 (enExample)
KR (1) KR101021450B1 (enExample)
CN (1) CN100472766C (enExample)
TW (1) TW200618697A (enExample)
WO (1) WO2006030676A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9506197D0 (en) 1995-03-27 1995-05-17 Hoffmann La Roche Inhibition of tau-tau association.
JP4996600B2 (ja) * 2006-04-26 2012-08-08 電気化学工業株式会社 アルミニウム−炭化珪素質複合体及びそれを用いた放熱部品
CN101438401B (zh) * 2006-05-09 2013-08-28 电气化学工业株式会社 铝-碳化硅质复合体及其加工方法
JP2010024077A (ja) * 2008-07-17 2010-02-04 Denki Kagaku Kogyo Kk アルミニウム−炭化珪素質複合体及びその製造方法
WO2010140541A1 (ja) * 2009-06-02 2010-12-09 電気化学工業株式会社 アルミニウム－黒鉛質複合体、それを用いた放熱部品及びｌｅｄ発光部材
JP5602566B2 (ja) * 2010-09-30 2014-10-08 日本ファインセラミックス株式会社 アルミニウム−炭化珪素質複合体からなる伝熱部材
JP5662834B2 (ja) * 2011-02-22 2015-02-04 電気化学工業株式会社 アルミニウム−炭化珪素質複合体の製造方法
CN103433491B (zh) * 2013-09-18 2015-05-13 湖南航天工业总公司 一种碳化硅igbt基板骨架真空压力渗铝装置及双面覆铝方法
CN103658659A (zh) * 2013-12-05 2014-03-26 湖南航天诚远精密机械有限公司 双面覆铝铝碳化硅igbt基板的近净成形方法
JPWO2016002943A1 (ja) * 2014-07-04 2017-06-08 デンカ株式会社 放熱部品及びその製造方法
WO2016013648A1 (ja) * 2014-07-24 2016-01-28 電気化学工業株式会社 複合体及びその製造方法
WO2016017689A1 (ja) * 2014-07-31 2016-02-04 電気化学工業株式会社 アルミニウム‐炭化珪素質複合体及びその製造方法
CN106796920B (zh) * 2014-08-06 2019-09-24 电化株式会社 散热部件及其制造方法
JP6623173B2 (ja) * 2014-12-18 2019-12-18 デンカ株式会社 炭化珪素質複合体の製造方法
CN104617204B (zh) * 2015-01-16 2017-07-14 隆科电子(惠阳)有限公司 一种碳化硅基电路板及其制备方法
CN106145952B (zh) * 2015-03-23 2019-06-11 隆科电子(惠阳)有限公司 高绝缘碳化硅陶瓷基板与碳化硅基电路板及其制备方法
CN109309066B (zh) * 2017-07-27 2020-10-20 比亚迪股份有限公司 一种陶瓷覆铝铜板及其制备方法、散热元件和igbt模组
WO2020013300A1 (ja) * 2018-07-13 2020-01-16 デンカ株式会社 金属－炭化珪素質複合体、及び金属－炭化珪素質複合体の製造方法
JP2022013968A (ja) * 2018-11-14 2022-01-19 デンカ株式会社 放熱基板を収容するパッケージおよび梱包箱
JP7116689B2 (ja) * 2019-01-30 2022-08-10 デンカ株式会社 放熱部材およびその製造方法
CN112552079B (zh) * 2019-09-26 2023-09-12 航天特种材料及工艺技术研究所 一种金属化陶瓷基复合材料及曲面金属化的方法
EP3958302A1 (de) 2020-08-17 2022-02-23 Infineon Technologies AG Bodenplatte für ein halbleitermodul und verfahren zum herstellen einer bodenplatte
CN114603315B (zh) * 2022-02-28 2023-03-24 江南大学 一种金属基陶瓷复合材料基板拱形表面的车削成形方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5119864A (en) 1988-11-10 1992-06-09 Lanxide Technology Company, Lp Method of forming a metal matrix composite through the use of a gating means
US5004035A (en) * 1988-11-10 1991-04-02 Lanxide Technology Company, Lp Method of thermo-forming a novel metal matrix composite body and products produced therefrom
US5465481A (en) * 1993-10-04 1995-11-14 Motorola, Inc. Method for fabricating a semiconductor package
JPH1129379A (ja) * 1997-02-14 1999-02-02 Ngk Insulators Ltd 半導体ヒートシンク用複合材料及びその製造方法
JP3468358B2 (ja) * 1998-11-12 2003-11-17 電気化学工業株式会社 炭化珪素質複合体及びその製造方法とそれを用いた放熱部品
JP3496816B2 (ja) * 1999-06-25 2004-02-16 電気化学工業株式会社 金属−セラミックス複合体とそれを用いた放熱部品
JP2001291809A (ja) * 2000-04-07 2001-10-19 Denki Kagaku Kogyo Kk 放熱部品
JP2004022964A (ja) * 2002-06-19 2004-01-22 Hitachi Metals Ltd Ａｌ−ＳｉＣ系複合体およびそれを用いた放熱部品、半導体モジュール装置
JP3792180B2 (ja) 2002-07-10 2006-07-05 電気化学工業株式会社 放熱部品の製造方法
JP3913130B2 (ja) * 2002-07-16 2007-05-09 電気化学工業株式会社 アルミニウム−炭化珪素質板状複合体
US20040246682A1 (en) * 2003-06-09 2004-12-09 Sumitomo Metal (Smi) Eectronics Devices Inc. Apparatus and package for high frequency usages and their manufacturing method

Also Published As

Publication number Publication date
CN1977378A (zh) 2007-06-06
WO2006030676A1 (ja) 2006-03-23
US20070248829A1 (en) 2007-10-25
CN100472766C (zh) 2009-03-25
JP4761157B2 (ja) 2011-08-31
TW200618697A (en) 2006-06-01
JPWO2006030676A1 (ja) 2008-05-15
US7838107B2 (en) 2010-11-23
EP1796164A4 (en) 2011-11-09
KR20070064293A (ko) 2007-06-20
EP1796164B1 (en) 2020-01-01
EP1796164A1 (en) 2007-06-13
KR101021450B1 (ko) 2011-03-15

Similar Documents

Publication Publication Date Title
TWI357788B (enExample)
CN101427367B (zh) 铝-碳化硅复合体和使用该复合体的散热零件
CN101361184B (zh) 铝-碳化硅复合体和使用该复合体的散热零件
JP3468358B2 (ja) 炭化珪素質複合体及びその製造方法とそれを用いた放熱部品
TWI796503B (zh) 金屬-碳化矽質複合體、及金屬-碳化矽質複合體之製造方法
WO2010007974A1 (ja) アルミニウム－ダイヤモンド系複合体の製造方法
CN106463484B (zh) 铝-碳化硅质复合体及功率模块用基底板
CN106796925B (zh) 铝-碳化硅质复合体及其制造方法
JP2020123638A (ja) 放熱部材およびその製造方法
JP3907620B2 (ja) セラミックス回路基板一体型アルミニウム−炭化珪素質複合体及びその製造方法
JP3548991B2 (ja) 放熱基板及びその製造方法
WO2002045161A1 (fr) Carte de circuit ceramique de type integre et procede pour la produire
JP7050978B1 (ja) 成形体及びその製造方法
JP2020012194A (ja) 金属−炭化珪素質複合体及びその製造方法
WO2021200011A1 (ja) 素子搭載基板、および素子搭載基板の製造方法
JP3737072B2 (ja) アルミニウム−炭化珪素質複合体とその製造方法
JP2004055577A (ja) アルミニウム−炭化珪素質板状複合体
JP3732193B2 (ja) アルミニウム−炭化珪素質複合体及びその製造方法
JP4127379B2 (ja) アルミニウム−炭化珪素複合体の製造方法
JP4357380B2 (ja) アルミニウム合金−炭化珪素質複合体の製造方法
JP2020123713A (ja) 放熱部材およびその製造方法
JP2012171838A (ja) アルミニウム−炭化珪素質複合体の製造方法
CN118056272A (zh) 散热构件
JP2004225149A (ja) アルミニウム−セラミックス複合体の製造方法
JP2002164464A (ja) ベース板一体型セラミックス回路基板とその製法

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent