CN101291805B - 低粘附性材料、树脂成形模及防污性材料 - Google Patents
低粘附性材料、树脂成形模及防污性材料 Download PDFInfo
- Publication number
- CN101291805B CN101291805B CN2006800392783A CN200680039278A CN101291805B CN 101291805 B CN101291805 B CN 101291805B CN 2006800392783 A CN2006800392783 A CN 2006800392783A CN 200680039278 A CN200680039278 A CN 200680039278A CN 101291805 B CN101291805 B CN 101291805B
- Authority
- CN
- China
- Prior art keywords
- surface layer
- main body
- low
- resin
- thermal expansion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/001—Joining burned ceramic articles with other burned ceramic articles or other articles by heating directly with other burned ceramic articles
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
- C04B2237/345—Refractory metal oxides
- C04B2237/348—Zirconia, hafnia, zirconates or hafnates
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006108869A JP4230492B2 (ja) | 2006-04-11 | 2006-04-11 | 低密着性材料、樹脂成形型及び防汚性材料 |
| JP108869/2006 | 2006-04-11 | ||
| PCT/JP2006/326026 WO2007116571A1 (ja) | 2006-04-11 | 2006-12-27 | 低密着性材料、樹脂成形型および防汚性材料 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101291805A CN101291805A (zh) | 2008-10-22 |
| CN101291805B true CN101291805B (zh) | 2012-06-20 |
Family
ID=38580873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006800392783A Expired - Fee Related CN101291805B (zh) | 2006-04-11 | 2006-12-27 | 低粘附性材料、树脂成形模及防污性材料 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7901797B2 (enExample) |
| EP (1) | EP2006083B1 (enExample) |
| JP (1) | JP4230492B2 (enExample) |
| KR (1) | KR100923623B1 (enExample) |
| CN (1) | CN101291805B (enExample) |
| TW (1) | TW200738581A (enExample) |
| WO (1) | WO2007116571A1 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3996138B2 (ja) * | 2004-03-26 | 2007-10-24 | Towa株式会社 | 低密着性材料及び樹脂成形型 |
| JP5554898B2 (ja) * | 2008-03-24 | 2014-07-23 | Towa株式会社 | 低密着性材料及びその製造方法、成形型及びその製造方法、並びに、防汚性材料及びその製造方法 |
| JP5561992B2 (ja) * | 2009-10-09 | 2014-07-30 | Towa株式会社 | 低密着性材料、防汚性材料、成形型、及び、それらの製造方法 |
| CN102407703A (zh) * | 2010-09-25 | 2012-04-11 | 天津市阿波罗信息技术有限公司 | 又一种数字化防伪印刷的处理方法 |
| CN102442096B (zh) * | 2010-10-09 | 2014-12-17 | 天津市阿波罗信息技术有限公司 | 一种在文字字库中埋入信息的可变信息印刷方法 |
| GB201022127D0 (en) * | 2010-12-31 | 2011-02-02 | Element Six Production Pty Ltd | A superhard structure and method of making same |
| JP6366348B2 (ja) * | 2014-05-09 | 2018-08-01 | Towa株式会社 | 成形型 |
| WO2015198184A1 (en) * | 2014-06-24 | 2015-12-30 | Bombardier Inc. | A thermally expansive molding tool and a method of molding with such tool |
| JP6335812B2 (ja) * | 2015-02-16 | 2018-05-30 | 三菱電機株式会社 | 成形用金型、およびその製造方法 |
| JP6462454B2 (ja) * | 2015-03-30 | 2019-01-30 | Towa株式会社 | 成形型および低密着性材料 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0505738B1 (en) * | 1991-03-28 | 1997-09-17 | General Electric Company | Multilayered mold structure for hot surface molding in a short cycle time |
| CN2381460Y (zh) * | 1999-04-14 | 2000-06-07 | 徐文忠 | 复合坚韧耐磨树脂基模具 |
| CN1753769A (zh) * | 2003-05-13 | 2006-03-29 | 可乐丽股份有限公司 | 树脂成形用模具及该树脂成形用模具的制造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04149074A (ja) | 1990-10-09 | 1992-05-22 | Toshiba Tungaloy Co Ltd | 高強度積層セラミックス焼結体 |
| JPH04364945A (ja) | 1991-06-12 | 1992-12-17 | Inax Corp | 高強度多結晶焼結セラミックス積層体 |
| JP2912125B2 (ja) | 1993-08-10 | 1999-06-28 | 東レ株式会社 | 陶磁器板およびその製造方法 |
| JP2005193610A (ja) * | 2004-01-09 | 2005-07-21 | Towa Corp | 複合材料及び樹脂成形型 |
| JP3996138B2 (ja) | 2004-03-26 | 2007-10-24 | Towa株式会社 | 低密着性材料及び樹脂成形型 |
| JP2006017335A (ja) | 2004-06-30 | 2006-01-19 | Okawara Mfg Co Ltd | 被処理物の分散性を向上させた連続式伝導伝熱乾燥機並びにその運転方法 |
| JP2006131429A (ja) * | 2004-11-02 | 2006-05-25 | Towa Corp | 低密着性材料及び樹脂成形型 |
| JP3974152B2 (ja) | 2006-01-26 | 2007-09-12 | Towa株式会社 | 低密着性材料、樹脂成形型及び防汚性材料 |
-
2006
- 2006-04-11 JP JP2006108869A patent/JP4230492B2/ja not_active Expired - Fee Related
- 2006-12-27 WO PCT/JP2006/326026 patent/WO2007116571A1/ja not_active Ceased
- 2006-12-27 CN CN2006800392783A patent/CN101291805B/zh not_active Expired - Fee Related
- 2006-12-27 KR KR1020087001220A patent/KR100923623B1/ko not_active Expired - Fee Related
- 2006-12-27 EP EP06843408.3A patent/EP2006083B1/en not_active Ceased
- 2006-12-27 US US11/988,802 patent/US7901797B2/en not_active Expired - Fee Related
- 2006-12-29 TW TW095150112A patent/TW200738581A/zh not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0505738B1 (en) * | 1991-03-28 | 1997-09-17 | General Electric Company | Multilayered mold structure for hot surface molding in a short cycle time |
| CN2381460Y (zh) * | 1999-04-14 | 2000-06-07 | 徐文忠 | 复合坚韧耐磨树脂基模具 |
| CN1753769A (zh) * | 2003-05-13 | 2006-03-29 | 可乐丽股份有限公司 | 树脂成形用模具及该树脂成形用模具的制造方法 |
Non-Patent Citations (4)
| Title |
|---|
| JP平4-149074A 1992.05.22 |
| JP特开2005-274478A 2005.10.06 |
| JP特开平4-364945A 1992.12.17 |
| JP特开平7-52120A 1995.02.28 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101291805A (zh) | 2008-10-22 |
| EP2006083A2 (en) | 2008-12-24 |
| JP4230492B2 (ja) | 2009-02-25 |
| KR20080031284A (ko) | 2008-04-08 |
| KR100923623B1 (ko) | 2009-10-23 |
| EP2006083A4 (en) | 2012-10-24 |
| EP2006083B1 (en) | 2017-04-05 |
| EP2006083A9 (en) | 2009-07-01 |
| TWI344412B (enExample) | 2011-07-01 |
| US7901797B2 (en) | 2011-03-08 |
| JP2007276402A (ja) | 2007-10-25 |
| US20090107361A1 (en) | 2009-04-30 |
| TW200738581A (en) | 2007-10-16 |
| WO2007116571A1 (ja) | 2007-10-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10553519B2 (en) | Heat radiating member and method for producing the same | |
| CN103733331B (zh) | 半导体元件用散热器件 | |
| CN111357100B (zh) | 散热板及其制造方法 | |
| CN111164747B (zh) | 用于散热的热结构及其制造方法 | |
| CN101291805B (zh) | 低粘附性材料、树脂成形模及防污性材料 | |
| EP2305400A1 (en) | Aluminum-diamond composite and method for producing the same | |
| CN108290380B (zh) | 层叠体及层叠体的制造方法 | |
| TWI669386B (zh) | Composite and manufacturing method thereof | |
| CN113210611A (zh) | 表面覆金属层的铜金刚石复合材料及其制备方法和应用 | |
| CN107891636B (zh) | 铜-钼铜-铜复合板的制备方法 | |
| CN110732673A (zh) | 一种制备金属和陶瓷复合工件的方法 | |
| JP6105262B2 (ja) | アルミニウム−ダイヤモンド系複合体放熱部品 | |
| JP3996138B2 (ja) | 低密着性材料及び樹脂成形型 | |
| JP5366859B2 (ja) | 窒化珪素基板およびそれを用いた半導体モジュール | |
| JP2006131429A (ja) | 低密着性材料及び樹脂成形型 | |
| JP3974152B2 (ja) | 低密着性材料、樹脂成形型及び防汚性材料 | |
| JP7705247B2 (ja) | 電極埋設部材、基板保持部材、およびその製造方法 | |
| JP5554898B2 (ja) | 低密着性材料及びその製造方法、成形型及びその製造方法、並びに、防汚性材料及びその製造方法 | |
| JP4134238B2 (ja) | 密着性の評価方法 | |
| JP6378247B2 (ja) | 積層体、パワーモジュールおよび積層体の製造方法 | |
| KR20240088312A (ko) | 세라믹 기판의 제조방법 | |
| TW200811300A (en) | A treatment method of metalization of metal or ceramic substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120620 Termination date: 20171227 |