TW200738581A - Low-adhesion material, mold for shaping resin and stainproof material - Google Patents

Low-adhesion material, mold for shaping resin and stainproof material

Info

Publication number
TW200738581A
TW200738581A TW095150112A TW95150112A TW200738581A TW 200738581 A TW200738581 A TW 200738581A TW 095150112 A TW095150112 A TW 095150112A TW 95150112 A TW95150112 A TW 95150112A TW 200738581 A TW200738581 A TW 200738581A
Authority
TW
Taiwan
Prior art keywords
face
low
adhesion
mold
cavity
Prior art date
Application number
TW095150112A
Other languages
English (en)
Chinese (zh)
Other versions
TWI344412B (enExample
Inventor
Takaki Kuno
Yoshinori Noguchi
Keiji Maeda
Satoshi Kitaoka
Naoki Kawashima
Original Assignee
Towa Corp
Japan Fine Ceramics Ct
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp, Japan Fine Ceramics Ct filed Critical Towa Corp
Publication of TW200738581A publication Critical patent/TW200738581A/zh
Application granted granted Critical
Publication of TWI344412B publication Critical patent/TWI344412B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/001—Joining burned ceramic articles with other burned ceramic articles or other articles by heating directly with other burned ceramic articles
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/345—Refractory metal oxides
    • C04B2237/348—Zirconia, hafnia, zirconates or hafnates

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)
TW095150112A 2006-04-11 2006-12-29 Low-adhesion material, mold for shaping resin and stainproof material TW200738581A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006108869A JP4230492B2 (ja) 2006-04-11 2006-04-11 低密着性材料、樹脂成形型及び防汚性材料

Publications (2)

Publication Number Publication Date
TW200738581A true TW200738581A (en) 2007-10-16
TWI344412B TWI344412B (enExample) 2011-07-01

Family

ID=38580873

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095150112A TW200738581A (en) 2006-04-11 2006-12-29 Low-adhesion material, mold for shaping resin and stainproof material

Country Status (7)

Country Link
US (1) US7901797B2 (enExample)
EP (1) EP2006083B1 (enExample)
JP (1) JP4230492B2 (enExample)
KR (1) KR100923623B1 (enExample)
CN (1) CN101291805B (enExample)
TW (1) TW200738581A (enExample)
WO (1) WO2007116571A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3996138B2 (ja) * 2004-03-26 2007-10-24 Ｔｏｗａ株式会社 低密着性材料及び樹脂成形型
JP5554898B2 (ja) * 2008-03-24 2014-07-23 Ｔｏｗａ株式会社 低密着性材料及びその製造方法、成形型及びその製造方法、並びに、防汚性材料及びその製造方法
JP5561992B2 (ja) * 2009-10-09 2014-07-30 Ｔｏｗａ株式会社 低密着性材料、防汚性材料、成形型、及び、それらの製造方法
CN102407703A (zh) * 2010-09-25 2012-04-11 天津市阿波罗信息技术有限公司 又一种数字化防伪印刷的处理方法
CN102442096B (zh) * 2010-10-09 2014-12-17 天津市阿波罗信息技术有限公司 一种在文字字库中埋入信息的可变信息印刷方法
GB201022127D0 (en) * 2010-12-31 2011-02-02 Element Six Production Pty Ltd A superhard structure and method of making same
JP6366348B2 (ja) * 2014-05-09 2018-08-01 Ｔｏｗａ株式会社 成形型
WO2015198184A1 (en) * 2014-06-24 2015-12-30 Bombardier Inc. A thermally expansive molding tool and a method of molding with such tool
JP6335812B2 (ja) * 2015-02-16 2018-05-30 三菱電機株式会社 成形用金型、およびその製造方法
JP6462454B2 (ja) * 2015-03-30 2019-01-30 Ｔｏｗａ株式会社 成形型および低密着性材料

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04149074A (ja) 1990-10-09 1992-05-22 Toshiba Tungaloy Co Ltd 高強度積層セラミックス焼結体
US5176839A (en) * 1991-03-28 1993-01-05 General Electric Company Multilayered mold structure for hot surface molding in a short cycle time
JPH04364945A (ja) 1991-06-12 1992-12-17 Inax Corp 高強度多結晶焼結セラミックス積層体
JP2912125B2 (ja) 1993-08-10 1999-06-28 東レ株式会社 陶磁器板およびその製造方法
CN2381460Y (zh) * 1999-04-14 2000-06-07 徐文忠 复合坚韧耐磨树脂基模具
WO2004101248A1 (ja) * 2003-05-13 2004-11-25 Kuraray Co., Ltd. 樹脂成形用金型及び該樹脂成形用金型の製造方法
JP2005193610A (ja) * 2004-01-09 2005-07-21 Towa Corp 複合材料及び樹脂成形型
JP3996138B2 (ja) 2004-03-26 2007-10-24 Ｔｏｗａ株式会社 低密着性材料及び樹脂成形型
JP2006017335A (ja) 2004-06-30 2006-01-19 Okawara Mfg Co Ltd 被処理物の分散性を向上させた連続式伝導伝熱乾燥機並びにその運転方法
JP2006131429A (ja) * 2004-11-02 2006-05-25 Towa Corp 低密着性材料及び樹脂成形型
JP3974152B2 (ja) 2006-01-26 2007-09-12 Ｔｏｗａ株式会社 低密着性材料、樹脂成形型及び防汚性材料

Also Published As

Publication number Publication date
CN101291805A (zh) 2008-10-22
EP2006083A2 (en) 2008-12-24
JP4230492B2 (ja) 2009-02-25
KR20080031284A (ko) 2008-04-08
KR100923623B1 (ko) 2009-10-23
EP2006083A4 (en) 2012-10-24
EP2006083B1 (en) 2017-04-05
EP2006083A9 (en) 2009-07-01
TWI344412B (enExample) 2011-07-01
CN101291805B (zh) 2012-06-20
US7901797B2 (en) 2011-03-08
JP2007276402A (ja) 2007-10-25
US20090107361A1 (en) 2009-04-30
WO2007116571A1 (ja) 2007-10-18

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees