JP4223614B2 - スパッタリング方法及び装置及び電子部品の製造方法 - Google Patents

スパッタリング方法及び装置及び電子部品の製造方法 Download PDF

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Publication number
JP4223614B2
JP4223614B2 JP00800099A JP800099A JP4223614B2 JP 4223614 B2 JP4223614 B2 JP 4223614B2 JP 00800099 A JP00800099 A JP 00800099A JP 800099 A JP800099 A JP 800099A JP 4223614 B2 JP4223614 B2 JP 4223614B2
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substrate
target
diameter
sputtering
distance
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JP2000265263A5 (enExample
JP2000265263A (ja
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孝二 恒川
和男 平田
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Canon Anelva Corp
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Canon Anelva Corp
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JP00800099A 1999-01-12 1999-01-14 スパッタリング方法及び装置及び電子部品の製造方法 Expired - Lifetime JP4223614B2 (ja)

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JP00800099A JP4223614B2 (ja) 1999-01-12 1999-01-14 スパッタリング方法及び装置及び電子部品の製造方法

Applications Claiming Priority (3)

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JP508499 1999-01-12
JP11-5084 1999-01-12
JP00800099A JP4223614B2 (ja) 1999-01-12 1999-01-14 スパッタリング方法及び装置及び電子部品の製造方法

Related Child Applications (2)

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JP2008229489A Division JP4740299B2 (ja) 1999-01-12 2008-09-08 スパッタリング方法及び装置及び電子部品の製造方法
JP2008229523A Division JP4740300B2 (ja) 1999-01-12 2008-09-08 スパッタリング方法及び装置及び電子部品の製造方法

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JP2000265263A JP2000265263A (ja) 2000-09-26
JP2000265263A5 JP2000265263A5 (enExample) 2008-08-21
JP4223614B2 true JP4223614B2 (ja) 2009-02-12

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Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4502160B2 (ja) * 2000-09-27 2010-07-14 キヤノンアネルバ株式会社 磁性膜作成方法及び磁性膜作成装置並びに磁気記録ディスク製造方法
KR20040043046A (ko) * 2002-11-15 2004-05-22 삼성전자주식회사 마그네트론 스퍼터링 장치 및 스퍼터링 방법
JP4673858B2 (ja) * 2005-01-19 2011-04-20 株式会社アルバック スパッタ装置および成膜方法
JP2007291506A (ja) * 2006-03-31 2007-11-08 Canon Inc 成膜方法
JP5259626B2 (ja) 2007-12-26 2013-08-07 キヤノンアネルバ株式会社 スパッタ装置、スパッタ成膜方法
JP5209717B2 (ja) * 2008-06-25 2013-06-12 キヤノンアネルバ株式会社 スパッタリング装置及びその制御用プログラムを記録した記録媒体
KR20110040894A (ko) * 2008-09-09 2011-04-20 캐논 아네르바 가부시키가이샤 자기 저항 소자의 제조 방법, 그 제조 방법에 이용되는 기억 매체
CN102171379B (zh) 2008-09-30 2014-04-23 佳能安内华股份有限公司 溅射装置以及溅射方法
CN102239276A (zh) 2008-12-03 2011-11-09 佳能安内华股份有限公司 等离子体处理装置、磁电阻元件的制造装置、磁性薄膜的成膜方法以及成膜控制程序
JP5280459B2 (ja) * 2008-12-25 2013-09-04 キヤノンアネルバ株式会社 スパッタリング装置
JP4739464B2 (ja) 2008-12-26 2011-08-03 キヤノンアネルバ株式会社 スパッタリング装置、スパッタリング方法及び電子デバイスの製造方法
JP5133232B2 (ja) * 2008-12-26 2013-01-30 株式会社アルバック 成膜装置及び成膜方法
JP5427572B2 (ja) * 2009-12-01 2014-02-26 昭和電工株式会社 マグネトロンスパッタ装置、インライン式成膜装置、磁気記録媒体の製造方法
KR102083955B1 (ko) 2010-06-25 2020-03-03 캐논 아네르바 가부시키가이샤 스퍼터링 장치, 박막증착 방법 및 컨트롤 디바이스
US20130092528A1 (en) * 2010-06-30 2013-04-18 Ulvac, Inc. Film-forming device and film-forming method
US20150114826A1 (en) * 2012-06-18 2015-04-30 Oerlikon Advanced Technologies Ag Pvd apparatus for directional material deposition, methods and workpiece
JP2014241417A (ja) * 2014-07-15 2014-12-25 シャープ株式会社 アルミニウム含有窒化物中間層の製造方法、窒化物層の製造方法および窒化物半導体素子の製造方法
JPWO2020137145A1 (ja) * 2018-12-28 2021-09-09 株式会社アルバック 成膜装置及び成膜方法
KR102465982B1 (ko) 2021-07-13 2022-11-09 에스케이씨솔믹스 주식회사 블랭크 마스크 및 이를 이용한 포토마스크

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