JP4221360B2 - キャリアによって支持されるコンポーネントの基板上の所望の位置への移動に好適な方法、及びこのために設計される装置 - Google Patents
キャリアによって支持されるコンポーネントの基板上の所望の位置への移動に好適な方法、及びこのために設計される装置 Download PDFInfo
- Publication number
- JP4221360B2 JP4221360B2 JP2004507304A JP2004507304A JP4221360B2 JP 4221360 B2 JP4221360 B2 JP 4221360B2 JP 2004507304 A JP2004507304 A JP 2004507304A JP 2004507304 A JP2004507304 A JP 2004507304A JP 4221360 B2 JP4221360 B2 JP 4221360B2
- Authority
- JP
- Japan
- Prior art keywords
- carrier
- substrate
- component
- moved
- desired position
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 100
- 238000000034 method Methods 0.000 title claims abstract description 23
- 239000003292 glue Substances 0.000 claims description 3
- 238000005286 illumination Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- -1 OEN Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
Description
キャリアの第1の水平方向における移動と、基板の第1の水平方向に垂直な第2の水平方向における移動は、単純なやり方で、コンポーネントを基板上の如何なる所望の位置の上方に位置付けすることを可能にする。
Claims (9)
- キャリアによって支持されるコンポーネントの基板上の所望の位置への移動に好適な方法であって、
・ 前記コンポーネントを前記キャリアに対して、前記コンポーネントと前記キャリアとの間において置かれる中間層を使用して、取り付ける段階と、
・ 前記基板に面する前記キャリアの側面に置かれる前記コンポーネントを支持する前記キャリアを、前記コンポーネントが前記基板上の前記所望の位置に対向して置かれるまで、前記基板に対して移動させる段階と、
・ 前記コンポーネントと前記キャリアとの間の接続が壊れ、且つ前記コンポーネントが前記キャリアから前記基板に移動されるよう、前記コンポーネントが前記キャリアに対して取り付けられる前記キャリアの領域に光線ビームを当てる段階と、
を有し、
前記中間層は、前記コンポーネントから、並びに前記コンポーネントが取外された前記キャリアの前記領域から、取外される、
方法。 - 前記光線ビームは、Nd−YAGレーザ、CO2レーザ、ダイオードレーザ、又はエキシマレーザによって励起されることを特徴とする請求項1記載の方法。
- 前記コンポーネントを支持する前記キャリアは、第1の水平方向に移動され、一方、前記キャリアの下方に置かれる前記基板は、前記コンポーネントが、前記基板上の前記所望の位置に対向して位置付けられるまで前記第1の水平方向に垂直な第2の水平方向に移動されることを特徴とする請求項1又は2記載の方法。
- 幾つかのコンポーネントが、幾つかの光ビームによって、前記キャリアから、単一の基板又は幾つかの基板に同時に移動されることを特徴とする請求項1乃至3のうちいずれか一項記載の方法。
- 前記コンポーネントは、前記基板に移動された後に、前記基板に、はんだ又はレーザ溶接によって接続されることを特徴とする請求項1乃至4のうちいずれか一項記載の方法。
- 前記コンポーネントは、前記基板に移動された後に、前記基板に、導電性のりによって接続されることを特徴とする請求項1乃至4のうちいずれか一項記載の方法。
- 前記コンポーネントは、前記基板に移動された後に、前記基板に、導電性エポキシ樹脂によって接続されることを特徴とする請求項1乃至4のうちいずれか一項記載の方法。
- キャリアによって支持されるコンポーネントの基板上の所望の位置への移動に好適である装置であって、
前記コンポーネントは、前記コンポーネントと前記キャリアとの間におかれる中間層を使用して、前記キャリアに対して取り付けられ、
当該装置は、キャリア運搬装置及び基板運搬装置が設けられ、
前記基板運搬装置に面していない前記キャリア運搬装置の側部に少なくとも部分的に置かれる照明装置が更に設けられ、
動作時に、コンポーネントを支持するキャリアは、前記キャリア運搬装置及び前記基板運搬装置によって、前記基板運搬装置によって支持される基板に対して位置付けられることが可能であり、一方、光線ビームは、前記照明装置によって前記キャリアの領域に当てられることが可能であり、前記コンポーネントは、前記キャリアから取外され、前記キャリアから前記基板まで移動され、
前記中間層は、前記コンポーネントから、並びに前記コンポーネントが取外された前記キャリアの前記領域から、取外される、
ことを特徴とする装置。 - 前記照明装置は、レーザであることを特徴とする請求項8記載の装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02077043 | 2002-05-24 | ||
PCT/IB2003/001909 WO2003101171A1 (en) | 2002-05-24 | 2003-05-08 | Method suitable for transferring a component supported by a carrier to a desired position on a substrate, and a device designed for this |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005527115A JP2005527115A (ja) | 2005-09-08 |
JP4221360B2 true JP4221360B2 (ja) | 2009-02-12 |
Family
ID=29558364
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004507304A Expired - Fee Related JP4221360B2 (ja) | 2002-05-24 | 2003-05-08 | キャリアによって支持されるコンポーネントの基板上の所望の位置への移動に好適な方法、及びこのために設計される装置 |
Country Status (9)
Country | Link |
---|---|
US (1) | US8661655B2 (ja) |
EP (1) | EP1512317B1 (ja) |
JP (1) | JP4221360B2 (ja) |
KR (1) | KR20050008733A (ja) |
CN (1) | CN1287653C (ja) |
AT (1) | ATE474444T1 (ja) |
AU (1) | AU2003223079A1 (ja) |
DE (1) | DE60333364D1 (ja) |
WO (1) | WO2003101171A1 (ja) |
Families Citing this family (4)
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WO2005024908A2 (en) | 2003-09-05 | 2005-03-17 | Si2 Technologies, Inc. | Laser transfer articles and method of making |
US10304709B2 (en) | 2015-04-28 | 2019-05-28 | Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelikj Onderzoek Tno | Apparatus and method for contactless transfer and soldering of chips using a flash lamp |
US11214015B2 (en) | 2019-08-23 | 2022-01-04 | SelfArray, Inc. | Methods and systems for controlling temperature across a region defined by using thermally conductive elements |
EP3933902B1 (en) | 2020-06-29 | 2023-05-03 | IMEC vzw | A method for positioning components on a substrate |
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2003
- 2003-05-08 WO PCT/IB2003/001909 patent/WO2003101171A1/en active Application Filing
- 2003-05-08 KR KR10-2004-7018910A patent/KR20050008733A/ko not_active Application Discontinuation
- 2003-05-08 AU AU2003223079A patent/AU2003223079A1/en not_active Abandoned
- 2003-05-08 EP EP03719050A patent/EP1512317B1/en not_active Expired - Lifetime
- 2003-05-08 CN CNB038117789A patent/CN1287653C/zh not_active Expired - Fee Related
- 2003-05-08 US US10/515,470 patent/US8661655B2/en not_active Expired - Fee Related
- 2003-05-08 AT AT03719050T patent/ATE474444T1/de not_active IP Right Cessation
- 2003-05-08 JP JP2004507304A patent/JP4221360B2/ja not_active Expired - Fee Related
- 2003-05-08 DE DE60333364T patent/DE60333364D1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CN1656868A (zh) | 2005-08-17 |
EP1512317A1 (en) | 2005-03-09 |
AU2003223079A1 (en) | 2003-12-12 |
CN1287653C (zh) | 2006-11-29 |
ATE474444T1 (de) | 2010-07-15 |
KR20050008733A (ko) | 2005-01-21 |
DE60333364D1 (de) | 2010-08-26 |
JP2005527115A (ja) | 2005-09-08 |
WO2003101171A1 (en) | 2003-12-04 |
US8661655B2 (en) | 2014-03-04 |
EP1512317B1 (en) | 2010-07-14 |
US20060081572A1 (en) | 2006-04-20 |
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