JP2006511067A - 小さい対象物の操作 - Google Patents
小さい対象物の操作 Download PDFInfo
- Publication number
- JP2006511067A JP2006511067A JP2004559990A JP2004559990A JP2006511067A JP 2006511067 A JP2006511067 A JP 2006511067A JP 2004559990 A JP2004559990 A JP 2004559990A JP 2004559990 A JP2004559990 A JP 2004559990A JP 2006511067 A JP2006511067 A JP 2006511067A
- Authority
- JP
- Japan
- Prior art keywords
- small object
- substrate
- small
- carrier
- manipulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H5/00—Feeding articles separated from piles; Feeding articles to machines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68359—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during manufacture of interconnect decals or build up layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/951—Supplying the plurality of semiconductor or solid-state bodies
- H01L2224/95101—Supplying the plurality of semiconductor or solid-state bodies in a liquid medium
- H01L2224/95102—Supplying the plurality of semiconductor or solid-state bodies in a liquid medium being a colloidal droplet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/9512—Aligning the plurality of semiconductor or solid-state bodies
- H01L2224/95143—Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
- H01L2224/95145—Electrostatic alignment, i.e. polarity alignment with Coulomb charges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (11)
- 小さい対象物を運ぶキャリアと、
前記小さい対象物を受け取る基板と、
前記小さい対象物を、前記キャリア及び/又は前記基板に着脱可能に結合させる流体液滴と、
を有する、小さい対象物を操作するシステム。 - 運搬流体液滴が、前記キャリアに配置される、請求項1に記載の小さい対象物を操作するシステム。
- 目標流体液滴が、前記基板に配置される、請求項1又は2に記載の小さい対象物を操作するシステム。
- 目標流体液滴が、前記基板の予め決められた位置に又は予め決められたパターンに配置される、請求項1に記載の小さい対象物を操作するシステム。
- 前記流体液滴のサイズの前記対象物のサイズに対する比率は、1/10乃至1/3の範囲にある、請求項1に記載の小さい対象物を操作するシステム。
- 前記基板が、1つ又は複数の電極を備える、請求項1に記載の小さい対象物を操作するシステム。
- 前記電極が、前記小さい対象物の形状に対応する形状をもつ、請求項6に記載の小さい対象物を操作するシステム。
- ピックアップ運搬液滴が配置されるピックアッププレートと、
フィーダ目標液滴が配置されるフィーディングプレートと、
複数の配置電極が配置される配置プレートと、
基板目標液滴が配置されるデバイス基板と、
を有し、前記フィーディングプレート及び前記配置プレートが、ジョイント、特にフレキシブルジョイントによって結合される、小さい対象物を操作するシステム。 - 空の流体液滴から、前記小さい対象物を担持する運搬流体液滴を区別するために、前記ピックアッププレートの前記運搬流体液滴に応答する検出システムと、
前記ピックアッププレートから前記空の流体液滴を除去するために、前記検出システムに応答する液滴廃棄システムと、
を備える、請求項8に記載の小さい対象物を操作するシステム。 - 高い濡れ性をもつ面と、低い濡れ性をもつ面とを有する小さい対象物を操作する方法であって、
前記小さい対象物の前記低い濡れ性をもつ面が、キャリアの運搬流体液滴のところにくるように、前記小さい対象物を前記キャリアに配置するステップと、
前記小さい対象物の前記高い濡れ性をもつ面が、基板の配置領域と接触するように、前記小さい対象物を有する前記キャリアを前記基板と接触させるステップと、
前記基板から前記キャリアを離すステップと、
を含む方法。 - 目標流体液滴が、前記配置領域に配置される、請求項10に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02080391 | 2002-12-18 | ||
PCT/IB2003/005255 WO2004055886A2 (en) | 2002-12-18 | 2003-11-17 | Manipulation of objects with fluid droplets |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006511067A true JP2006511067A (ja) | 2006-03-30 |
JP4263173B2 JP4263173B2 (ja) | 2009-05-13 |
Family
ID=32524056
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004559990A Expired - Fee Related JP4263173B2 (ja) | 2002-12-18 | 2003-11-17 | 小さい対象物の操作 |
Country Status (8)
Country | Link |
---|---|
US (1) | US20060226013A1 (ja) |
EP (1) | EP1586114A2 (ja) |
JP (1) | JP4263173B2 (ja) |
KR (1) | KR20050085750A (ja) |
CN (1) | CN100431130C (ja) |
AU (1) | AU2003276604A1 (ja) |
TW (1) | TW200512450A (ja) |
WO (1) | WO2004055886A2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011081095A1 (ja) * | 2009-12-28 | 2011-07-07 | 東京エレクトロン株式会社 | 実装方法及び実装装置 |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090014682A1 (en) * | 2005-05-20 | 2009-01-15 | Jsr Corporation | Carrier Polymer Particle, Process for Producing the Same, Magnetic Particle for Specific Trapping, and Process for Producing the Same |
JP4808642B2 (ja) * | 2006-02-02 | 2011-11-02 | パナソニック株式会社 | 電子部品の実装方法および電子部品の実装装置 |
CN102272909B (zh) * | 2008-12-13 | 2015-04-08 | 米尔鲍尔股份公司 | 制造电子组装的方法和设备,采用该方法或在该设备中制造的电子组装 |
WO2011002957A2 (en) * | 2009-07-01 | 2011-01-06 | Advanced Liquid Logic, Inc. | Droplet actuator devices and methods |
US8628648B2 (en) * | 2009-07-07 | 2014-01-14 | The University Of Akron | Apparatus and method for manipulating micro component |
US8926065B2 (en) | 2009-08-14 | 2015-01-06 | Advanced Liquid Logic, Inc. | Droplet actuator devices and methods |
CN102650512B (zh) * | 2011-02-25 | 2014-09-10 | 上海衡芯生物科技有限公司 | 液滴测量方法及液滴控制方法 |
US8602532B2 (en) * | 2011-04-30 | 2013-12-10 | Hewlett-Packard Development Company, L.P. | Electrowetting mechanism for fluid-application device |
WO2013040562A2 (en) * | 2011-09-15 | 2013-03-21 | Advanced Liquid Logic Inc | Microfluidic loading apparatus and methods |
WO2014014892A2 (en) * | 2012-07-16 | 2014-01-23 | Cornell University | System and methods for electrowetting based pick and place assembly |
US10285316B2 (en) * | 2013-10-21 | 2019-05-07 | Fuji Corporation | Electronic component mounting device |
US10278318B2 (en) * | 2015-12-18 | 2019-04-30 | Intel Corporation | Method of assembling an electronic component using a probe having a fluid thereon |
US10558204B2 (en) * | 2016-09-19 | 2020-02-11 | Palo Alto Research Center Incorporated | System and method for scalable real-time micro-object position control with the aid of a digital computer |
US10777527B1 (en) * | 2019-07-10 | 2020-09-15 | Mikro Mesa Technology Co., Ltd. | Method for transferring micro device |
CN114348956A (zh) * | 2020-10-13 | 2022-04-15 | 南京中兴软件有限责任公司 | 微器件转移设备、微器件转移方法、计算机可读存储介质 |
CN112757257B (zh) * | 2021-01-20 | 2022-06-03 | 武汉大学 | 一种电润湿微夹持器及小微物体的夹持方法 |
CN113436776A (zh) * | 2021-05-24 | 2021-09-24 | 广东工业大学 | 一种液滴载体式微小物体定向移动方法 |
US11592010B1 (en) | 2022-05-18 | 2023-02-28 | Toyota Motor Engineering & Manufacturing North America, Inc. | Shape-memory material actuators |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0717628A (ja) * | 1993-06-30 | 1995-01-20 | Sumitomo Sitix Corp | 薄板搬送方法とその装置 |
JP2000133999A (ja) * | 1998-10-23 | 2000-05-12 | Tokin Corp | ワークの位置出し方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3237775A1 (de) * | 1981-10-12 | 1983-04-28 | Daishin Kagaku Kogyo K.K., Niiza, Saitama | Material fuer eine plandruckplatte und verfahren zu dessen herstellung |
JPS5940543A (ja) * | 1982-08-30 | 1984-03-06 | Hitachi Tobu Semiconductor Ltd | 半導体ペレツト移送方法 |
US6130098A (en) * | 1995-09-15 | 2000-10-10 | The Regents Of The University Of Michigan | Moving microdroplets |
US5904824A (en) * | 1997-03-07 | 1999-05-18 | Beckman Instruments, Inc. | Microfluidic electrophoresis device |
US6565727B1 (en) * | 1999-01-25 | 2003-05-20 | Nanolytics, Inc. | Actuators for microfluidics without moving parts |
US6294063B1 (en) * | 1999-02-12 | 2001-09-25 | Board Of Regents, The University Of Texas System | Method and apparatus for programmable fluidic processing |
JP2001274528A (ja) * | 2000-01-21 | 2001-10-05 | Fujitsu Ltd | 薄膜デバイスの基板間転写方法 |
US6773566B2 (en) * | 2000-08-31 | 2004-08-10 | Nanolytics, Inc. | Electrostatic actuators for microfluidics and methods for using same |
EP1358673A1 (en) * | 2001-02-08 | 2003-11-05 | International Business Machines Corporation | Chip transfer method and apparatus |
-
2003
- 2003-11-17 AU AU2003276604A patent/AU2003276604A1/en not_active Abandoned
- 2003-11-17 JP JP2004559990A patent/JP4263173B2/ja not_active Expired - Fee Related
- 2003-11-17 EP EP03813213A patent/EP1586114A2/en not_active Withdrawn
- 2003-11-17 US US10/539,968 patent/US20060226013A1/en not_active Abandoned
- 2003-11-17 WO PCT/IB2003/005255 patent/WO2004055886A2/en active Application Filing
- 2003-11-17 KR KR1020057011290A patent/KR20050085750A/ko not_active Application Discontinuation
- 2003-11-17 CN CNB2003801066557A patent/CN100431130C/zh not_active Expired - Fee Related
- 2003-12-15 TW TW092135367A patent/TW200512450A/zh unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0717628A (ja) * | 1993-06-30 | 1995-01-20 | Sumitomo Sitix Corp | 薄板搬送方法とその装置 |
JP2000133999A (ja) * | 1998-10-23 | 2000-05-12 | Tokin Corp | ワークの位置出し方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011081095A1 (ja) * | 2009-12-28 | 2011-07-07 | 東京エレクトロン株式会社 | 実装方法及び実装装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2004055886A3 (en) | 2004-12-29 |
CN100431130C (zh) | 2008-11-05 |
EP1586114A2 (en) | 2005-10-19 |
CN1729561A (zh) | 2006-02-01 |
WO2004055886A2 (en) | 2004-07-01 |
TW200512450A (en) | 2005-04-01 |
KR20050085750A (ko) | 2005-08-29 |
US20060226013A1 (en) | 2006-10-12 |
AU2003276604A8 (en) | 2004-07-09 |
JP4263173B2 (ja) | 2009-05-13 |
AU2003276604A1 (en) | 2004-07-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4263173B2 (ja) | 小さい対象物の操作 | |
US6514790B1 (en) | Method for handling a plurality of circuit chips | |
US11114411B2 (en) | Semiconductor chip transfer method and transfer tool | |
JP5388862B2 (ja) | シリコンウェハを分離させるための方法および装置 | |
CN104067381A (zh) | 微器件传送头加热器组件及传送微器件的方法 | |
US20070145103A1 (en) | Electrostatic methods and apparatus for mounting and demounting particles from a surface having an array of tacky and non-tacky areas | |
US20080025822A1 (en) | Device and method for handling an object of interest using a directional adhesive structure | |
KR102391430B1 (ko) | 다이 본딩 장치 | |
CN104054168A (zh) | 传送微器件的方法 | |
TW200947641A (en) | Die bonding apparatus | |
TW200817758A (en) | Sticking and holding apparatus and sticking and holding method thereof | |
JP2008047700A (ja) | 保持装置及び基板受け渡し方法 | |
WO2006057335A1 (ja) | ダイボンディング装置 | |
US10604358B2 (en) | Device, system and method for aligning electronic components | |
JP2018114475A (ja) | 塗布装置および塗布方法 | |
JP2010087066A (ja) | 半導体チップ、実装基板及び半導体装置の製造方法 | |
TWI656587B (zh) | 接合裝置及方法 | |
JP2764532B2 (ja) | バンプの接合方法および接合装置 | |
CN112216627B (zh) | 转移微型元件的方法和元件转移系统 | |
JP4221360B2 (ja) | キャリアによって支持されるコンポーネントの基板上の所望の位置への移動に好適な方法、及びこのために設計される装置 | |
JP2011143979A (ja) | パーツフィーダ | |
JPH06225750A (ja) | 細胞搬送装置および細胞搬送方法 | |
KR101230841B1 (ko) | 웨이퍼 자동 분리 시스템 | |
KR20230168973A (ko) | 전자 구성 요소를 이송하기 위한 이송 디바이스 | |
JPH10202516A (ja) | ウェーハ接着装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20061116 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080918 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20081031 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20081127 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20081211 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20090113 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20090210 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120220 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |