ATE474444T1 - Verfahren zur übertragung von einem an einen träger befestigten bauelement in eine gewünschte lage auf einen träger und einrichtung dafur - Google Patents

Verfahren zur übertragung von einem an einen träger befestigten bauelement in eine gewünschte lage auf einen träger und einrichtung dafur

Info

Publication number
ATE474444T1
ATE474444T1 AT03719050T AT03719050T ATE474444T1 AT E474444 T1 ATE474444 T1 AT E474444T1 AT 03719050 T AT03719050 T AT 03719050T AT 03719050 T AT03719050 T AT 03719050T AT E474444 T1 ATE474444 T1 AT E474444T1
Authority
AT
Austria
Prior art keywords
support
component
substrate
carrier
desired position
Prior art date
Application number
AT03719050T
Other languages
English (en)
Inventor
Johannus Weekamp
Samber Marc De
Johan Bosman
Willem Hoving
Renatus Sanders
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Application granted granted Critical
Publication of ATE474444T1 publication Critical patent/ATE474444T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Road Signs Or Road Markings (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
AT03719050T 2002-05-24 2003-05-08 Verfahren zur übertragung von einem an einen träger befestigten bauelement in eine gewünschte lage auf einen träger und einrichtung dafur ATE474444T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP02077043 2002-05-24
PCT/IB2003/001909 WO2003101171A1 (en) 2002-05-24 2003-05-08 Method suitable for transferring a component supported by a carrier to a desired position on a substrate, and a device designed for this

Publications (1)

Publication Number Publication Date
ATE474444T1 true ATE474444T1 (de) 2010-07-15

Family

ID=29558364

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03719050T ATE474444T1 (de) 2002-05-24 2003-05-08 Verfahren zur übertragung von einem an einen träger befestigten bauelement in eine gewünschte lage auf einen träger und einrichtung dafur

Country Status (9)

Country Link
US (1) US8661655B2 (de)
EP (1) EP1512317B1 (de)
JP (1) JP4221360B2 (de)
KR (1) KR20050008733A (de)
CN (1) CN1287653C (de)
AT (1) ATE474444T1 (de)
AU (1) AU2003223079A1 (de)
DE (1) DE60333364D1 (de)
WO (1) WO2003101171A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005024908A2 (en) 2003-09-05 2005-03-17 Si2 Technologies, Inc. Laser transfer articles and method of making
CN107683522B (zh) * 2015-04-28 2021-10-15 荷兰应用自然科学研究组织Tno 使用闪光灯进行芯片的非接触转移和焊接的设备和方法
US11214015B2 (en) 2019-08-23 2022-01-04 SelfArray, Inc. Methods and systems for controlling temperature across a region defined by using thermally conductive elements
EP3933902B1 (de) 2020-06-29 2023-05-03 IMEC vzw Verfahren zur positionierung von komponenten auf einem substrat

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Also Published As

Publication number Publication date
EP1512317A1 (de) 2005-03-09
DE60333364D1 (de) 2010-08-26
CN1287653C (zh) 2006-11-29
US20060081572A1 (en) 2006-04-20
AU2003223079A1 (en) 2003-12-12
JP2005527115A (ja) 2005-09-08
WO2003101171A1 (en) 2003-12-04
JP4221360B2 (ja) 2009-02-12
US8661655B2 (en) 2014-03-04
KR20050008733A (ko) 2005-01-21
CN1656868A (zh) 2005-08-17
EP1512317B1 (de) 2010-07-14

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties