JP4220731B2 - 電力用半導体装置 - Google Patents

電力用半導体装置 Download PDF

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Publication number
JP4220731B2
JP4220731B2 JP2002178464A JP2002178464A JP4220731B2 JP 4220731 B2 JP4220731 B2 JP 4220731B2 JP 2002178464 A JP2002178464 A JP 2002178464A JP 2002178464 A JP2002178464 A JP 2002178464A JP 4220731 B2 JP4220731 B2 JP 4220731B2
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JP
Japan
Prior art keywords
electrode
power semiconductor
negative
semiconductor elements
positive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002178464A
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English (en)
Japanese (ja)
Other versions
JP2004022960A (ja
JP2004022960A5 (https=
Inventor
修 大徳
琢也 大賀
将光 岡村
良裕 加柴
功 園田
一平 赤木
達也 奥田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2002178464A priority Critical patent/JP4220731B2/ja
Publication of JP2004022960A publication Critical patent/JP2004022960A/ja
Publication of JP2004022960A5 publication Critical patent/JP2004022960A5/ja
Application granted granted Critical
Publication of JP4220731B2 publication Critical patent/JP4220731B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07636—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips

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  • Inverter Devices (AREA)
JP2002178464A 2002-06-19 2002-06-19 電力用半導体装置 Expired - Fee Related JP4220731B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002178464A JP4220731B2 (ja) 2002-06-19 2002-06-19 電力用半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002178464A JP4220731B2 (ja) 2002-06-19 2002-06-19 電力用半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2005142408A Division JP2005252305A (ja) 2005-05-16 2005-05-16 電力用半導体装置

Publications (3)

Publication Number Publication Date
JP2004022960A JP2004022960A (ja) 2004-01-22
JP2004022960A5 JP2004022960A5 (https=) 2005-10-06
JP4220731B2 true JP4220731B2 (ja) 2009-02-04

Family

ID=31176178

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002178464A Expired - Fee Related JP4220731B2 (ja) 2002-06-19 2002-06-19 電力用半導体装置

Country Status (1)

Country Link
JP (1) JP4220731B2 (https=)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4517901B2 (ja) * 2005-03-14 2010-08-04 三菱電機株式会社 電力用半導体モジュールおよびその駆動回路
JP4884121B2 (ja) * 2006-08-02 2012-02-29 三菱電機株式会社 電力制御用半導体装置
JP4580997B2 (ja) * 2008-03-11 2010-11-17 日立オートモティブシステムズ株式会社 電力変換装置
DE102010063274B3 (de) * 2010-12-16 2012-01-26 Semikron Elektronik Gmbh & Co. Kg Vorrichtung zur Ansteuerung eines Leistungshalbleiterschalters über eine Gleichtaktdrossel
CN104303297B (zh) * 2012-05-16 2017-05-17 松下知识产权经营株式会社 电力用半导体模块
CN104380462B (zh) 2012-06-01 2017-05-24 松下知识产权经营株式会社 功率半导体装置
JP6148830B2 (ja) * 2012-07-19 2017-06-14 ローム株式会社 パワーモジュール半導体装置
JP2014056920A (ja) 2012-09-12 2014-03-27 Calsonic Kansei Corp 半導体装置
JP5763026B2 (ja) * 2012-09-24 2015-08-12 株式会社東芝 半導体装置
JP2015006116A (ja) * 2013-06-24 2015-01-08 株式会社デンソー 車両用回転電機
JP2015006118A (ja) * 2013-06-24 2015-01-08 株式会社デンソー 車両用回転電機
EP4579736A3 (en) 2013-11-20 2025-12-31 Rohm Co., Ltd. SWITCHING DEVICE AND ELECTRONIC CIRCUIT
DE102014202030A1 (de) 2014-02-05 2015-08-06 Robert Bosch Gmbh Gleichrichterschaltung, elektronisches Bauelement, Generator und Verfahren zum Betreiben einer Gleichrichterschaltung
JP2015173595A (ja) * 2015-06-02 2015-10-01 株式会社東芝 半導体装置
JP6753475B2 (ja) * 2017-02-06 2020-09-09 富士電機株式会社 半導体モジュール、電気自動車、及びパワーコントロールユニット
JP6969501B2 (ja) * 2018-05-28 2021-11-24 株式会社デンソー 半導体装置
FR3082369B1 (fr) * 2018-06-08 2021-02-19 Valeo Equip Electr Moteur Circuit electrique, bras de commutation et convertisseur de tension
EP3654373B1 (en) * 2018-11-19 2021-01-06 Infineon Technologies AG Multi-chip-package
US20230163055A1 (en) * 2020-04-01 2023-05-25 Panasonic Intellectual Property Management Co., Ltd. Semiconductor module
JP7422636B2 (ja) * 2020-09-29 2024-01-26 三菱電機株式会社 半導体装置の製造方法および半導体装置
WO2024214423A1 (ja) * 2023-04-12 2024-10-17 富士電機株式会社 半導体モジュール

Also Published As

Publication number Publication date
JP2004022960A (ja) 2004-01-22

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