JP4209456B1 - 積層接合装置用治具 - Google Patents

積層接合装置用治具 Download PDF

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Publication number
JP4209456B1
JP4209456B1 JP2008041336A JP2008041336A JP4209456B1 JP 4209456 B1 JP4209456 B1 JP 4209456B1 JP 2008041336 A JP2008041336 A JP 2008041336A JP 2008041336 A JP2008041336 A JP 2008041336A JP 4209456 B1 JP4209456 B1 JP 4209456B1
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JP
Japan
Prior art keywords
chuck
alignment
substrate
jig
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2008041336A
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English (en)
Japanese (ja)
Other versions
JP2009200304A (ja
Inventor
諭 田原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Heavy Industries Ltd
Original Assignee
Mitsubishi Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Heavy Industries Ltd filed Critical Mitsubishi Heavy Industries Ltd
Priority to JP2008041336A priority Critical patent/JP4209456B1/ja
Priority to PCT/JP2008/073720 priority patent/WO2009104345A1/ja
Priority to TW98100504A priority patent/TWI386276B/zh
Application granted granted Critical
Publication of JP4209456B1 publication Critical patent/JP4209456B1/ja
Publication of JP2009200304A publication Critical patent/JP2009200304A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Micromachines (AREA)
JP2008041336A 2008-02-22 2008-02-22 積層接合装置用治具 Active JP4209456B1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008041336A JP4209456B1 (ja) 2008-02-22 2008-02-22 積層接合装置用治具
PCT/JP2008/073720 WO2009104345A1 (ja) 2008-02-22 2008-12-26 積層接合装置用治具
TW98100504A TWI386276B (zh) 2008-02-22 2009-01-08 層積接合裝置用治具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008041336A JP4209456B1 (ja) 2008-02-22 2008-02-22 積層接合装置用治具

Publications (2)

Publication Number Publication Date
JP4209456B1 true JP4209456B1 (ja) 2009-01-14
JP2009200304A JP2009200304A (ja) 2009-09-03

Family

ID=40325701

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008041336A Active JP4209456B1 (ja) 2008-02-22 2008-02-22 積層接合装置用治具

Country Status (3)

Country Link
JP (1) JP4209456B1 (zh)
TW (1) TWI386276B (zh)
WO (1) WO2009104345A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112014005278B4 (de) * 2014-01-28 2021-09-16 Ev Group E. Thallner Gmbh Vorrichtung und Verfahren zum Lösen eines Trägerwafers
US10133186B2 (en) 2016-10-20 2018-11-20 Mapper Lithography Ip B.V. Method and apparatus for aligning substrates on a substrate support unit
TWI738449B (zh) * 2020-08-03 2021-09-01 致茂電子股份有限公司 晶圓檢測系統及其晶圓檢測設備
CN114472098A (zh) * 2022-01-27 2022-05-13 苏州希盟智能装备有限公司 一种光波导片点胶贴合设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2662131B2 (ja) * 1991-12-26 1997-10-08 松下電器産業株式会社 ボンディング装置
KR100507584B1 (ko) * 1996-10-08 2005-08-10 히다치 가세고교 가부시끼가이샤 반도체 장치, 반도체칩 탑재용 기판, 이들의 제조법,접착제, 및 양면 접착 필름
JP2000106391A (ja) * 1998-07-28 2000-04-11 Ngk Insulators Ltd 半導体支持装置、その製造方法、接合体の製造方法および接合体
JP3896938B2 (ja) * 2002-09-25 2007-03-22 松下電工株式会社 積層板の製造方法
JP2005288673A (ja) * 2004-04-06 2005-10-20 Mitsubishi Heavy Ind Ltd 微小構造体の製造装置
JP2006232477A (ja) * 2005-02-24 2006-09-07 Fuji Photo Film Co Ltd シート体位置決め治具及びそれを用いた描画装置

Also Published As

Publication number Publication date
TWI386276B (zh) 2013-02-21
WO2009104345A1 (ja) 2009-08-27
TW200940245A (en) 2009-10-01
JP2009200304A (ja) 2009-09-03

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