JP4204113B2 - 新規な芳香族スルホニウム化合物、これからなる光酸発生剤およびこれを含む光重合性組成物、光造形用樹脂組成物ならびに光学的立体造形法 - Google Patents
新規な芳香族スルホニウム化合物、これからなる光酸発生剤およびこれを含む光重合性組成物、光造形用樹脂組成物ならびに光学的立体造形法 Download PDFInfo
- Publication number
- JP4204113B2 JP4204113B2 JP29189898A JP29189898A JP4204113B2 JP 4204113 B2 JP4204113 B2 JP 4204113B2 JP 29189898 A JP29189898 A JP 29189898A JP 29189898 A JP29189898 A JP 29189898A JP 4204113 B2 JP4204113 B2 JP 4204113B2
- Authority
- JP
- Japan
- Prior art keywords
- group
- optical
- resin composition
- compound
- dimensional modeling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C381/00—Compounds containing carbon and sulfur and having functional groups not covered by groups C07C301/00 - C07C337/00
- C07C381/12—Sulfonium compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/687—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing sulfur
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0037—Production of three-dimensional images
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Polymers & Plastics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Epoxy Resins (AREA)
- Materials For Photolithography (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
- Polymerisation Methods In General (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29189898A JP4204113B2 (ja) | 1997-12-04 | 1998-10-14 | 新規な芳香族スルホニウム化合物、これからなる光酸発生剤およびこれを含む光重合性組成物、光造形用樹脂組成物ならびに光学的立体造形法 |
| DE69811942T DE69811942T2 (de) | 1997-12-04 | 1998-12-04 | Aromatische sulfone, ihre verwendung in substanzen, welche lichtinduziert säure freisetzen, photopolymerisierbare gemische diese enthaltend, stereolithographische harze und stereolithographischer prozess |
| US09/555,632 US6368769B1 (en) | 1997-12-04 | 1998-12-04 | Aromatic sulfonium compounds, photoacid generators comprising the same, photopolymerizable compositions containing the same, stereolithographic resin compositions, and stereolithographic process |
| PCT/JP1998/005472 WO1999028295A1 (fr) | 1997-12-04 | 1998-12-04 | Composes sulfonium, generateurs photoacides les renfermant, compositions photopolymerisables les renfermant, compositions de resines stereolithographiques, et procede de stereolithographie |
| EP98957164A EP1036789B1 (en) | 1997-12-04 | 1998-12-04 | Novel aromatic sulfonium compounds, photoacid generators comprising the same, photopolymerizable compositions containing the same, stereolithographic resin compositions, and stereolithographic process |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9-334529 | 1997-12-04 | ||
| JP33452997 | 1997-12-04 | ||
| JP29189898A JP4204113B2 (ja) | 1997-12-04 | 1998-10-14 | 新規な芳香族スルホニウム化合物、これからなる光酸発生剤およびこれを含む光重合性組成物、光造形用樹脂組成物ならびに光学的立体造形法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000186071A JP2000186071A (ja) | 2000-07-04 |
| JP2000186071A5 JP2000186071A5 (https=) | 2005-10-27 |
| JP4204113B2 true JP4204113B2 (ja) | 2009-01-07 |
Family
ID=26558750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29189898A Expired - Lifetime JP4204113B2 (ja) | 1997-12-04 | 1998-10-14 | 新規な芳香族スルホニウム化合物、これからなる光酸発生剤およびこれを含む光重合性組成物、光造形用樹脂組成物ならびに光学的立体造形法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6368769B1 (https=) |
| EP (1) | EP1036789B1 (https=) |
| JP (1) | JP4204113B2 (https=) |
| DE (1) | DE69811942T2 (https=) |
| WO (1) | WO1999028295A1 (https=) |
Families Citing this family (69)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6136497A (en) * | 1998-03-30 | 2000-10-24 | Vantico, Inc. | Liquid, radiation-curable composition, especially for producing flexible cured articles by stereolithography |
| US6100007A (en) * | 1998-04-06 | 2000-08-08 | Ciba Specialty Chemicals Corp. | Liquid radiation-curable composition especially for producing cured articles by stereolithography having high heat deflection temperatures |
| US6379866B2 (en) | 2000-03-31 | 2002-04-30 | Dsm Desotech Inc | Solid imaging compositions for preparing polypropylene-like articles |
| US6762002B2 (en) | 1998-07-10 | 2004-07-13 | Dsm Desotech, Inc. | Solid imaging compositions for preparing polypropylene-like articles |
| US6287748B1 (en) | 1998-07-10 | 2001-09-11 | Dsm N.V. | Solid imaging compositions for preparing polyethylene-like articles |
| US6660446B2 (en) * | 2000-05-30 | 2003-12-09 | Fuji Photo Film Co., Ltd. | Heat-sensitive composition and planographic printing plate |
| AU2002306752B2 (en) * | 2001-03-30 | 2008-10-16 | The Arizona Board Of Regents On Behalf Of The University Of Arizona | Materials, methods, and uses for photochemical generation of acids and/or radical species |
| TWI246525B (en) * | 2001-11-06 | 2006-01-01 | Wako Pure Chem Ind Ltd | Hybrid onium salt |
| JP2004091698A (ja) * | 2002-09-02 | 2004-03-25 | Konica Minolta Holdings Inc | 活性光線硬化型組成物、活性光線硬化型インクとそれを用いた画像形成方法及びインクジェット記録装置 |
| AU2003268671A1 (en) | 2002-09-25 | 2004-04-19 | Asahi Denka Co.Ltd. | Novel aromatic sulfonium salt compound, photo-acid generator comprising the same and photopolymerizable composition containing the same, resin composition for optical three-dimensional shaping, and method of optically forming three-dimensional shape |
| US20040077745A1 (en) * | 2002-10-18 | 2004-04-22 | Jigeng Xu | Curable compositions and rapid prototyping process using the same |
| US20040137368A1 (en) * | 2003-01-13 | 2004-07-15 | 3D Systems, Inc. | Stereolithographic resins containing selected oxetane compounds |
| JP2005060518A (ja) * | 2003-08-12 | 2005-03-10 | Konica Minolta Medical & Graphic Inc | 光重合性組成物およびインクジェットインク |
| JP4595311B2 (ja) * | 2003-11-06 | 2010-12-08 | コニカミノルタエムジー株式会社 | 活性光線硬化型インクジェットインク組成物、それを用いた画像形成方法及びインクジェット記録装置 |
| US7282324B2 (en) | 2004-01-05 | 2007-10-16 | Microchem Corp. | Photoresist compositions, hardened forms thereof, hardened patterns thereof and metal patterns formed using them |
| US20050260522A1 (en) * | 2004-02-13 | 2005-11-24 | William Weber | Permanent resist composition, cured product thereof, and use thereof |
| JP4716749B2 (ja) * | 2004-02-20 | 2011-07-06 | 株式会社Adeka | 新規な芳香族スルホニウム塩化合物、これからなる光酸発生剤およびこれを含む光重合性組成物、光学的立体造形用樹脂組成物ならびに光学的立体造形法 |
| CN1849560B (zh) * | 2004-03-26 | 2011-12-07 | 东京応化工业株式会社 | 感光性树脂组合物及使用该组合物的图案形成方法 |
| JP4492209B2 (ja) * | 2004-05-14 | 2010-06-30 | 東亞合成株式会社 | 光学物品の製造方法 |
| US7449280B2 (en) * | 2004-05-26 | 2008-11-11 | Microchem Corp. | Photoimageable coating composition and composite article thereof |
| KR100698917B1 (ko) * | 2004-06-22 | 2007-03-22 | 미쓰이 가가쿠 가부시키가이샤 | 이온성 화합물 및 그것을 함유하는 수지 조성물과 그 용도 |
| US20060172230A1 (en) * | 2005-02-02 | 2006-08-03 | Dsm Ip Assets B.V. | Method and composition for reducing waste in photo-imaging applications |
| US7799885B2 (en) | 2005-11-30 | 2010-09-21 | Corning Incorporated | Photo or electron beam curable compositions |
| JP4695996B2 (ja) * | 2006-02-27 | 2011-06-08 | 富士フイルム株式会社 | 感光性組成物及び該感光性組成物を用いたパターン形成方法 |
| CN101466804B (zh) * | 2006-04-13 | 2012-02-22 | 西巴控股有限公司 | 硫鎓盐引发剂 |
| JP5168860B2 (ja) * | 2006-09-14 | 2013-03-27 | 株式会社スリーボンド | 光重合性組成物 |
| US20080103226A1 (en) | 2006-10-31 | 2008-05-01 | Dsm Ip Assets B.V. | Photo-curable resin composition |
| CN101952248B (zh) * | 2007-10-10 | 2014-04-16 | 巴斯夫欧洲公司 | 锍盐引发剂 |
| KR101599562B1 (ko) | 2007-10-10 | 2016-03-03 | 바스프 에스이 | 술포늄 염 개시제 |
| EP2223948B1 (en) | 2007-11-01 | 2013-01-23 | Adeka Corporation | Salt compound, cationic polymerization initiator and cationically polymerizable composition |
| JPWO2009113217A1 (ja) * | 2008-03-11 | 2011-07-21 | 国立大学法人京都大学 | 新規な光カチオン重合開始剤 |
| JP5721630B2 (ja) | 2008-10-20 | 2015-05-20 | ビーエーエスエフ ソシエタス・ヨーロピアBasf Se | スルホニウム誘導体および潜在酸としてのその使用 |
| KR101700980B1 (ko) | 2009-02-20 | 2017-01-31 | 산아프로 가부시키가이샤 | 술포늄염, 광산 발생제 및 감광성 수지 조성물 |
| CN102459354B (zh) * | 2009-06-08 | 2014-08-20 | 三洋化成工业株式会社 | 感光性组合物 |
| IN2012DN03022A (https=) | 2009-10-01 | 2015-07-31 | Hitachi Chemical Co Ltd | |
| CN102471255B (zh) * | 2009-10-26 | 2015-06-03 | 株式会社艾迪科 | 芳香族锍盐化合物 |
| JP5717959B2 (ja) * | 2009-11-17 | 2015-05-13 | 株式会社Adeka | 芳香族スルホニウム塩化合物 |
| CN106125509B (zh) | 2009-12-17 | 2019-12-17 | 帝斯曼知识产权资产管理有限公司 | 用于加成法制造的可led固化的液体树脂组合物 |
| CN102725689B (zh) | 2010-01-22 | 2014-10-08 | 帝斯曼知识产权资产管理有限公司 | 能固化成具有选择性视觉效果的层的液体可辐射固化树脂及其使用方法 |
| KR101813298B1 (ko) | 2010-02-24 | 2017-12-28 | 바스프 에스이 | 잠재성 산 및 그의 용도 |
| KR101537654B1 (ko) | 2010-04-22 | 2015-07-17 | 히타치가세이가부시끼가이샤 | 유기 일렉트로닉스 재료, 중합 개시제 및 열중합 개시제, 잉크 조성물, 유기 박막 및 그 제조 방법, 유기 일렉트로닉스 소자, 유기 일렉트로 루미네센스 소자, 조명 장치, 표시 소자, 및 표시 장치 |
| EP2502728B1 (en) | 2011-03-23 | 2017-01-04 | DSM IP Assets B.V. | Lightweight and high strength three-dimensional articles producible by additive fabrication processes |
| KR101263673B1 (ko) * | 2011-08-03 | 2013-05-22 | 금호석유화학 주식회사 | 술포늄 화합물, 광산발생제 및 레지스트 조성물 |
| JP5828715B2 (ja) * | 2011-08-25 | 2015-12-09 | サンアプロ株式会社 | スルホニウム塩、光酸発生剤、硬化性組成物およびレジスト組成物 |
| EP2851386B1 (en) * | 2012-05-18 | 2017-08-16 | Cmet Inc. | Resin composition for optical stereolithography |
| CN103012227A (zh) * | 2013-01-04 | 2013-04-03 | 同济大学 | 一种高光生酸量子产率硫鎓盐类光生酸剂、制备方法及其应用 |
| CN106939074B (zh) | 2013-03-08 | 2020-06-16 | 日立化成株式会社 | 含有离子性化合物的处理液 |
| KR20140131609A (ko) * | 2013-05-02 | 2014-11-14 | 삼성디스플레이 주식회사 | 감광성 수지 조성물, 패턴 형성 방법 및 이를 이용한 액정 표시 장치 |
| JP6240409B2 (ja) * | 2013-05-31 | 2017-11-29 | サンアプロ株式会社 | スルホニウム塩および光酸発生剤 |
| EP2842980B1 (en) | 2013-08-09 | 2021-05-05 | DSM IP Assets B.V. | Low-viscosity liquid radiation curable dental aligner mold resin compositions for additive manufacturing |
| EP3266815B1 (en) | 2013-11-05 | 2021-11-03 | Covestro (Netherlands) B.V. | Stabilized matrix-filled liquid radiation curable resin compositions for additive fabrication |
| JP6169545B2 (ja) * | 2014-09-09 | 2017-07-26 | 富士フイルム株式会社 | 重合性組成物、インクジェット記録用インク組成物、インクジェット記録方法、及び記録物 |
| WO2016153711A1 (en) * | 2015-03-23 | 2016-09-29 | Dow Global Technologies Llc | Photocurable compositions for three-dimensional printing |
| CN107636025B (zh) * | 2015-06-08 | 2021-02-02 | 帝斯曼知识产权资产管理有限公司 | 用于加成法制造的液体、混杂的紫外/可见光可辐射固化树脂组合物 |
| US10604659B2 (en) | 2015-06-08 | 2020-03-31 | Dsm Ip Assets B.V. | Liquid, hybrid UV/VIS radiation curable resin compositions for additive fabrication |
| EP3567428B1 (en) | 2015-10-01 | 2021-06-23 | DSM IP Assets B.V. | Liquid, hybrid uv/vis radiation curable resin compositions for additive fabrication |
| JP2018536731A (ja) | 2015-11-17 | 2018-12-13 | ディーエスエム アイピー アセッツ ビー.ブイ.Dsm Ip Assets B.V. | 改善された付加造形用アンチモンフリー放射線硬化性組成物およびインベストメント鋳造プロセスにおけるその用途 |
| JP2017115072A (ja) * | 2015-12-25 | 2017-06-29 | 株式会社ダイセル | 立体造形用硬化性組成物 |
| JP6798071B2 (ja) | 2016-03-14 | 2020-12-09 | ディーエスエム アイピー アセッツ ビー.ブイ.Dsm Ip Assets B.V. | 改善された靭性および耐高温性を有する付加造形用放射線硬化性組成物 |
| JP6807530B2 (ja) * | 2016-11-10 | 2021-01-06 | 岡本化学工業株式会社 | 光学的立体造形用組成物 |
| JP7223693B2 (ja) | 2016-12-23 | 2023-02-16 | スリーエム イノベイティブ プロパティズ カンパニー | ポリマー及び重合性成分を含むプリント可能な組成物、物品、並びにそれから物品を製造する方法 |
| CN109456242B (zh) * | 2017-09-06 | 2021-02-12 | 常州强力电子新材料股份有限公司 | 硫鎓盐光引发剂、其制备方法、包含其的光固化组合物及其应用 |
| CN111788269B (zh) | 2017-12-15 | 2023-10-20 | 科思创(荷兰)有限公司 | 用于高温喷射粘性热固性材料以经由增材制造创建固体制品的组合物和方法 |
| CN111526977B (zh) | 2017-12-29 | 2022-07-01 | 科思创(荷兰)有限公司 | 用于加成制造的组合物和制品及其使用方法 |
| JP7763576B2 (ja) * | 2018-07-11 | 2025-11-04 | 住友化学株式会社 | 塩、酸発生剤、レジスト組成物及びレジストパターンの製造方法 |
| US12252561B2 (en) | 2019-08-30 | 2025-03-18 | Stratasys, Inc. | Liquid, hybrid UV/VIS radiation curable resin compositions for additive fabrication |
| WO2021042013A1 (en) | 2019-08-30 | 2021-03-04 | Dsm Ip Assets B.V. | Liquid, hybrid uv/vis radiation curable resin compositions for additive fabrication |
| JP7715713B2 (ja) * | 2020-07-23 | 2025-07-30 | サンアプロ株式会社 | 光酸発生剤 |
| JP7779862B2 (ja) | 2020-12-14 | 2025-12-03 | サンアプロ株式会社 | 光酸発生剤及びこれを用いた感光性組成物 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3625219B2 (ja) * | 1993-06-18 | 2005-03-02 | 日本化薬株式会社 | 新規オニウム塩、光重合開始剤、これを含有するエネルギー線硬化性組成物及びその硬化物 |
| CA2187046A1 (fr) | 1996-10-03 | 1998-04-03 | Alain Vallee | Sulfonylimidures et sulfonylmethylures, leur utilisation comme photoinitiateur |
| JP3844824B2 (ja) * | 1996-11-26 | 2006-11-15 | 株式会社Adeka | エネルギー線硬化性エポキシ樹脂組成物、光学的立体造形用樹脂組成物及び光学的立体造形方法 |
-
1998
- 1998-10-14 JP JP29189898A patent/JP4204113B2/ja not_active Expired - Lifetime
- 1998-12-04 US US09/555,632 patent/US6368769B1/en not_active Expired - Lifetime
- 1998-12-04 DE DE69811942T patent/DE69811942T2/de not_active Expired - Fee Related
- 1998-12-04 EP EP98957164A patent/EP1036789B1/en not_active Expired - Lifetime
- 1998-12-04 WO PCT/JP1998/005472 patent/WO1999028295A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| JP2000186071A (ja) | 2000-07-04 |
| EP1036789B1 (en) | 2003-03-05 |
| EP1036789A4 (en) | 2001-04-04 |
| DE69811942T2 (de) | 2003-09-04 |
| DE69811942D1 (de) | 2003-04-10 |
| US6368769B1 (en) | 2002-04-09 |
| WO1999028295A1 (fr) | 1999-06-10 |
| EP1036789A1 (en) | 2000-09-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4204113B2 (ja) | 新規な芳香族スルホニウム化合物、これからなる光酸発生剤およびこれを含む光重合性組成物、光造形用樹脂組成物ならびに光学的立体造形法 | |
| JP5131888B2 (ja) | 新規な芳香族スルホニウム塩化合物、これからなる光酸発生剤およびこれを含む光重合性組成物、光学的立体造形用樹脂組成物並びに光学的立体造形法 | |
| KR101602756B1 (ko) | 염 화합물, 양이온 중합 개시제 및 양이온 중합성 조성물 | |
| US6096796A (en) | Photo-curable resin composition | |
| EP0938026B1 (en) | Photocurable liquid resin composition | |
| EP1171502B1 (en) | Resin composition for photofabrication of three dimensional objects | |
| EP0837366B1 (en) | Photocurable resin composition | |
| JP3626275B2 (ja) | 光硬化性樹脂組成物 | |
| JP3715244B2 (ja) | 光硬化性樹脂組成物 | |
| JP4716749B2 (ja) | 新規な芳香族スルホニウム塩化合物、これからなる光酸発生剤およびこれを含む光重合性組成物、光学的立体造形用樹脂組成物ならびに光学的立体造形法 | |
| JP2004137172A (ja) | 新規な芳香族スルホニウム化合物、これからなる光酸発生剤およびこれを含む光重合性組成物、インクジェット用インク組成物ならびにインクジェット記録方法 | |
| US20040110857A1 (en) | Photo-curable resin composition containing cyclic acetal compound and cured product | |
| JP2011089088A (ja) | 光学的立体造形用放射線硬化性液状樹脂組成物及びそれを光硬化させて得られる立体造形物 | |
| EP0848293B1 (en) | Photo-curable resin composition | |
| JP2007002073A (ja) | 光学的立体造形用樹脂組成物及びこれを用いた光学的立体造形方法 | |
| JP2006316213A (ja) | 光学的立体造形用樹脂組成物及びこれを用いた光学的立体造形方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20050804 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20050804 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080708 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080908 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20081010 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20081014 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111024 Year of fee payment: 3 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121024 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131024 Year of fee payment: 5 |
|
| EXPY | Cancellation because of completion of term |