JP4195056B2 - 多層印刷回路基板およびその製造方法 - Google Patents
多層印刷回路基板およびその製造方法 Download PDFInfo
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- JP4195056B2 JP4195056B2 JP2006346159A JP2006346159A JP4195056B2 JP 4195056 B2 JP4195056 B2 JP 4195056B2 JP 2006346159 A JP2006346159 A JP 2006346159A JP 2006346159 A JP2006346159 A JP 2006346159A JP 4195056 B2 JP4195056 B2 JP 4195056B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 26
- 239000000758 substrate Substances 0.000 claims description 106
- 239000003054 catalyst Substances 0.000 claims description 59
- 238000000034 method Methods 0.000 claims description 49
- 229910052751 metal Inorganic materials 0.000 claims description 39
- 239000002184 metal Substances 0.000 claims description 39
- 239000000243 solution Substances 0.000 claims description 38
- 229920000867 polyelectrolyte Polymers 0.000 claims description 19
- 239000002245 particle Substances 0.000 claims description 13
- 239000002313 adhesive film Substances 0.000 claims description 12
- 238000001179 sorption measurement Methods 0.000 claims description 10
- 125000002091 cationic group Chemical group 0.000 claims description 8
- 238000004381 surface treatment Methods 0.000 claims description 8
- 239000005518 polymer electrolyte Substances 0.000 claims description 7
- 239000003792 electrolyte Substances 0.000 claims description 6
- 229920001448 anionic polyelectrolyte Polymers 0.000 claims description 5
- 238000005553 drilling Methods 0.000 claims description 5
- 239000012528 membrane Substances 0.000 claims description 5
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 claims description 4
- 229920002845 Poly(methacrylic acid) Polymers 0.000 claims description 4
- 229920002518 Polyallylamine hydrochloride Polymers 0.000 claims description 4
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 4
- 229920001467 poly(styrenesulfonates) Polymers 0.000 claims description 4
- 229920000767 polyaniline Polymers 0.000 claims description 4
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 4
- 150000003839 salts Chemical class 0.000 claims description 4
- 125000000129 anionic group Chemical group 0.000 claims description 3
- 238000007598 dipping method Methods 0.000 claims description 3
- 150000002940 palladium Chemical class 0.000 claims description 3
- RCNOGGGBSSVMAS-UHFFFAOYSA-N 2-thiophen-3-ylacetic acid Chemical compound OC(=O)CC=1C=CSC=1 RCNOGGGBSSVMAS-UHFFFAOYSA-N 0.000 claims description 2
- 229920002125 Sokalan® Polymers 0.000 claims description 2
- 150000003057 platinum Chemical class 0.000 claims description 2
- 229920002006 poly(N-vinylimidazole) polymer Polymers 0.000 claims description 2
- 150000001450 anions Chemical class 0.000 claims 1
- 150000001768 cations Chemical class 0.000 claims 1
- 238000007654 immersion Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 32
- 238000007747 plating Methods 0.000 description 23
- HHXNVASVVVNNDG-UHFFFAOYSA-N 1,2,3,4,5-pentachloro-6-(2,3,6-trichlorophenyl)benzene Chemical compound ClC1=CC=C(Cl)C(C=2C(=C(Cl)C(Cl)=C(Cl)C=2Cl)Cl)=C1Cl HHXNVASVVVNNDG-UHFFFAOYSA-N 0.000 description 13
- 238000007641 inkjet printing Methods 0.000 description 11
- 239000000126 substance Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 239000010949 copper Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 230000003197 catalytic effect Effects 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 229920006318 anionic polymer Polymers 0.000 description 3
- 229920006317 cationic polymer Polymers 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 238000013019 agitation Methods 0.000 description 2
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 239000011087 paperboard Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- DCPDZFRGNJDWPP-UHFFFAOYSA-N 1,2,3,4,5-pentachloro-6-(2,4,5-trichlorophenyl)benzene Chemical compound C1=C(Cl)C(Cl)=CC(Cl)=C1C1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl DCPDZFRGNJDWPP-UHFFFAOYSA-N 0.000 description 1
- 101150003085 Pdcl gene Proteins 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 230000002779 inactivation Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000001338 self-assembly Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0565—Resist used only for applying catalyst, not for plating itself
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0709—Catalytic ink or adhesive for electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Laminated Bodies (AREA)
Description
103 自己組織膜(SAM)
105 非接着膜
107 マイクロホール
109 触媒粒子
110,120 触媒回路パターン
112 静電吸着フィルム
1091 金属膜
1101,1201 金属回路
200 両面PCB
203 自己組織膜(SAM)
205 非接着膜
206,207,208 マイクロホール
209 触媒粒子
210,220 触媒回路パターン
240 絶縁層
2061 隠れホール
2071 埋込みホール
2081 スルーホール
2101,2201 金属回路
Claims (25)
- 印刷回路基板(PCB)を製造する方法であって、
基板を用意すること、
第1の自己組織膜(SAM)を、基板の少なくとも一方の面に形成すること、
非接着性の膜を、第1のSAMの上に形成すること、
少なくとも1つのマイクロホールを基板に形成すること、
第2のSAMをマイクロホール表面に形成すること、
触媒粒子を、前記基板の少なくとも一方の面およびマイクロホール表面に供給すること、および
触媒回路パターンを基板上に形成すること、を含む方法。 - 基板を電解質に浸漬して、金属回路を基板に形成し、金属膜をマイクロホールに形成すること、をさらに含む請求項1記載の方法。
- 基板を、促進剤溶液に浸漬することをさらに含む請求項1記載の方法。
- 基板を、第1の高分子電解質溶液の中に浸漬すること、
基板を、第1の高分子電解質溶液とは反対の電荷を有する第2の高分子電解質溶液の中に浸漬すること、および
基板を、第1の高分子電解質溶液とは同じ電荷を有する第3の高分子電解質溶液の中に浸漬すること、を含む請求項1記載の方法。 - マイクロホールを形成するステップは、基板を孔加工してマイクロホールを形成すること、を含む請求項1記載の方法。
- 多層の印刷回路基板(PCB)を製造する方法であって、
基板を用意すること、
自己組織膜(SAM)を基板の各面に形成すること、
非接着性の膜をSAMの上に形成すること、
少なくとも1つのマイクロホールを基板に形成すること、
SAMをマイクロホール表面に形成すること、
触媒粒子を、基板の少なくとも一方の面およびマイクロホール表面に塗布すること、
触媒マイクロ供給および促進剤溶液浸漬によって、触媒回路パターンを基板上に形成すること、および
基板を電解液に浸漬して、金属回路を基板上に形成し、金属膜をマイクロホール内に形成すること、を含む方法。 - 絶縁層を、両面PCBの少なくとも一方の面に接着すること、および
両面PCBを形成するステップを1回繰り返して、多層PCBを形成すること、を含む請求項6記載の方法。 - マイクロホールを形成するステップは、基板を孔加工してマイクロホールを形成すること、を含む請求項6記載の方法。
- 孔加工ステップは、多層PCBの埋込みホール、隠れホールまたはスルーホールを形成する請求項8記載の方法。
- 自己組織膜(SAM)を形成するステップは、導電表面処理プロセスを含み、
該プロセスは、基板を、第1の高分子電解質溶液の中に浸漬すること、
基板を、第1の高分子電解質溶液とは反対の電荷を有する第2の高分子電解質溶液の中に浸漬すること、および
基板を、第1の高分子電解質溶液とは同じ電荷を有する第3の高分子電解質溶液の中に浸漬すること、を含む請求項6記載の方法。 - 触媒は、パラジウム塩触媒またはプラチナ塩触媒を含む請求項6記載の方法。
- 少なくとも1つのマイクロホールを有する基板と、
基板の少なくとも一方の面において、マイクロホール表面に形成された自己組織膜(SAM)と、
該マイクロホール表面に形成された触媒層と、
触媒層とともに、マイクロホール表面に形成された金属膜と、
SAMの上に形成された第1回路とを備える両面印刷回路基板。 - SAMは、陰イオンおよび陽イオンの高分子電解質溶液により形成された層をさらに含む請求項12記載の両面印刷回路基板。
- 陰イオンの高分子電解質溶液は、ポリアクリル酸(PAA)、ポリメタクリル酸(PMA)、ポリ(スチレンスルホナート)(PSS)、ポリ(3−チオフェン酢酸)(PTAA)またはこれらの何れかの組合せからなるグループから選択される請求項13記載の両面印刷回路基板。
- 陽イオンの高分子電解質溶液は、ポリアリルアミン塩酸塩(PAH)、ポリビニルアルコール(PVA)、ポリビニルイミダゾール(PVI+)、ポリ(ビニルピロリドン)(PVP+)、ポリアニリン(PAN)またはこれらの何れかの組合せからなるグループから選択される請求項13記載の両面印刷回路基板。
- 触媒は、触媒含有金属塩を含む請求項12記載の両面印刷回路基板。
- 第1回路の上に、静電吸着フィルムをさらに備える請求項12記載の両面印刷回路基板。
- 第1回路は、触媒回路を含む請求項12記載の両面印刷回路基板。
- 少なくとも1つのマイクロホールを有する第1基板と、
第1基板の各面において、マイクロホール表面に形成された第1自己組織膜(SAM)と、
該マイクロホール表面に形成された第1触媒層と、
介在した第1触媒層とともにマイクロホール表面に形成された第1金属膜と、
介在した第1SAMとともに第1基板の一方の面に形成された第1回路と、
介在した第1SAMとともに第1基板の他方の面に形成された第2回路とを備える多層印刷回路基板(PCB)。 - 第1基板の一方の面に接着し、少なくとも1つのマイクロホールを有する第2基板と、
第2基板の一方の面において、マイクロホール表面に形成された第2自己組織膜(SAM)と、
第2基板でのマイクロホール表面に形成された第2触媒層と、
第2基板でのマイクロホール表面に形成された第2金属膜とをさらに備える請求項19記載の多層印刷回路基板。 - 介在した第2SAMとともに第2基板の面に形成された第3回路とをさらに備える請求項20記載の多層印刷回路基板。
- 各第1および第2SAMは、陰イオンおよび陽イオンの高分子電解質溶液で形成された層をさらに含む請求項20記載の多層印刷回路基板。
- マイクロホールは、埋込みホールである請求項19記載の多層印刷回路基板。
- マイクロホールは、隠れホールである請求項19記載の多層印刷回路基板。
- マイクロホールは、スルーホールである請求項19記載の多層印刷回路基板。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW94147547 | 2005-12-30 |
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JP2007184592A JP2007184592A (ja) | 2007-07-19 |
JP4195056B2 true JP4195056B2 (ja) | 2008-12-10 |
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JP2006346159A Expired - Fee Related JP4195056B2 (ja) | 2005-12-30 | 2006-12-22 | 多層印刷回路基板およびその製造方法 |
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JP (1) | JP4195056B2 (ja) |
KR (1) | KR100885701B1 (ja) |
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KR100841170B1 (ko) * | 2007-04-26 | 2008-06-24 | 삼성전자주식회사 | 저저항 금속 배선 형성방법, 금속 배선 구조 및 이를이용하는 표시장치 |
US8017022B2 (en) * | 2007-12-28 | 2011-09-13 | Intel Corporation | Selective electroless plating for electronic substrates |
CN102415222B (zh) * | 2009-04-24 | 2015-02-04 | 住友电气工业株式会社 | 用于印刷布线板的基板、印刷布线板及其制造方法 |
KR101474571B1 (ko) * | 2009-05-13 | 2014-12-19 | 에스케이이노베이션 주식회사 | 고분자 전해질 다층박막 촉매 및 그 제조 방법 |
KR101377084B1 (ko) * | 2009-11-24 | 2014-03-25 | 유니-픽셀 디스플레이스, 인코포레이티드 | 표면 에너지 수정에 의한 전기 도전성 패턴의 형성 |
US8587950B2 (en) * | 2011-05-31 | 2013-11-19 | Server Technology, Inc. | Method and apparatus for multiple input power distribution to adjacent outputs |
US9204561B2 (en) * | 2012-04-17 | 2015-12-01 | Advanced Flexible Circuits Co., Ltd. | Method of manufacturing a structure of via hole of electrical circuit board |
TWI498055B (zh) * | 2012-04-17 | 2015-08-21 | Adv Flexible Circuits Co Ltd | The conductive through hole structure of the circuit board |
USD771602S1 (en) * | 2014-01-22 | 2016-11-15 | Agc Automotive Americas R&D, Inc. | Antenna |
CN106134299B (zh) | 2014-03-20 | 2018-10-23 | 住友电气工业株式会社 | 印刷线路板用基板、印刷线路板以及制造印刷线路板用基板的方法 |
WO2015147219A1 (ja) | 2014-03-27 | 2015-10-01 | 住友電気工業株式会社 | プリント配線板用基板、プリント配線板及びプリント配線板用基板の製造方法 |
KR102281459B1 (ko) * | 2014-11-05 | 2021-07-27 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
US10076028B2 (en) | 2015-01-22 | 2018-09-11 | Sumitomo Electric Industries, Ltd. | Substrate for printed circuit board, printed circuit board, and method for producing printed circuit board |
EP3412121A4 (en) * | 2016-02-01 | 2020-01-22 | Elcoflex OY | METHOD FOR PRODUCING AN EXTREMELY THIN FLEXIBLE MULTI-LAYERED CIRCUIT BOARD AND FLEXIBLE MULTI-LAYERED CIRCUIT BOARD |
WO2018136036A1 (en) | 2017-01-17 | 2018-07-26 | Hewlett-Packard Development Company, L.P. | Multi-layered printed circuit board |
CN112970337B (zh) | 2019-02-14 | 2022-05-24 | 奥宝科技有限公司 | 用于制备具有高度密集导体的pcb产品的方法及设备 |
WO2021184231A1 (zh) * | 2020-03-18 | 2021-09-23 | 柏承科技(昆山)股份有限公司 | 低成本及高制程能力的印刷电路板制造方法 |
WO2024016346A1 (zh) * | 2022-07-22 | 2024-01-25 | 深圳市创芯微电子有限公司 | 一种咪头电路板加工工艺、制品、咪头及电子产品 |
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KR100601493B1 (ko) * | 2004-12-30 | 2006-07-18 | 삼성전기주식회사 | 하프에칭된 본딩 패드 및 절단된 도금 라인을 구비한bga 패키지 및 그 제조 방법 |
-
2006
- 2006-10-31 US US11/554,882 patent/US7834274B2/en active Active
- 2006-12-01 KR KR1020060120848A patent/KR100885701B1/ko active IP Right Grant
- 2006-12-14 DE DE102006059159A patent/DE102006059159A1/de not_active Ceased
- 2006-12-15 TW TW095147280A patent/TWI328416B/zh not_active IP Right Cessation
- 2006-12-22 JP JP2006346159A patent/JP4195056B2/ja not_active Expired - Fee Related
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2010
- 2010-10-12 US US12/902,518 patent/US20110023297A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
KR100885701B1 (ko) | 2009-02-26 |
US20110023297A1 (en) | 2011-02-03 |
US7834274B2 (en) | 2010-11-16 |
KR20070072361A (ko) | 2007-07-04 |
TW200740337A (en) | 2007-10-16 |
TWI328416B (en) | 2010-08-01 |
US20070153488A1 (en) | 2007-07-05 |
JP2007184592A (ja) | 2007-07-19 |
DE102006059159A1 (de) | 2007-07-12 |
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