JP4163756B2 - ホトリソグラフィーによって形成された表面パターンを有するポリマー研磨パッド及びこれに関する方法 - Google Patents

ホトリソグラフィーによって形成された表面パターンを有するポリマー研磨パッド及びこれに関する方法 Download PDF

Info

Publication number
JP4163756B2
JP4163756B2 JP53109098A JP53109098A JP4163756B2 JP 4163756 B2 JP4163756 B2 JP 4163756B2 JP 53109098 A JP53109098 A JP 53109098A JP 53109098 A JP53109098 A JP 53109098A JP 4163756 B2 JP4163756 B2 JP 4163756B2
Authority
JP
Japan
Prior art keywords
pad
precursor
pattern
substrate
photomask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP53109098A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001507997A5 (https=
JP2001507997A (ja
Inventor
リー メルボルン クック
デヴィド ビー. ジェームス
ニナ ジー. チェチック
ウイリアム ディー. バディンガー
Original Assignee
ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド filed Critical ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド
Publication of JP2001507997A publication Critical patent/JP2001507997A/ja
Publication of JP2001507997A5 publication Critical patent/JP2001507997A5/ja
Application granted granted Critical
Publication of JP4163756B2 publication Critical patent/JP4163756B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/22Lapping pads for working plane surfaces characterised by a multi-layered structure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/26Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP53109098A 1997-01-13 1998-01-12 ホトリソグラフィーによって形成された表面パターンを有するポリマー研磨パッド及びこれに関する方法 Expired - Lifetime JP4163756B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US3449297P 1997-01-13 1997-01-13
US60/034,492 1997-01-13
PCT/US1998/000317 WO1998030356A1 (en) 1997-01-13 1998-01-12 Polymeric polishing pad having photolithographically induced surface pattern(s) and methods relating thereto

Publications (3)

Publication Number Publication Date
JP2001507997A JP2001507997A (ja) 2001-06-19
JP2001507997A5 JP2001507997A5 (https=) 2005-09-08
JP4163756B2 true JP4163756B2 (ja) 2008-10-08

Family

ID=21876756

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53109098A Expired - Lifetime JP4163756B2 (ja) 1997-01-13 1998-01-12 ホトリソグラフィーによって形成された表面パターンを有するポリマー研磨パッド及びこれに関する方法

Country Status (6)

Country Link
US (2) US6036579A (https=)
EP (1) EP0984846B1 (https=)
JP (1) JP4163756B2 (https=)
KR (1) KR100487455B1 (https=)
DE (1) DE69827789T2 (https=)
WO (1) WO1998030356A1 (https=)

Families Citing this family (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DK1071955T4 (da) * 1998-04-17 2009-06-15 Innogenetics Nv Forbedrede immundiagnostiske assays, som anvender reduktionsmidler
US6290589B1 (en) * 1998-12-09 2001-09-18 Applied Materials, Inc. Polishing pad with a partial adhesive coating
CN1137013C (zh) * 1999-01-21 2004-02-04 罗德尔控股公司 改进的抛光垫及其抛光方法
US6234875B1 (en) 1999-06-09 2001-05-22 3M Innovative Properties Company Method of modifying a surface
WO2001064396A1 (en) * 2000-02-28 2001-09-07 Rodel Holdings, Inc. Polishing pad surface texture formed by solid phase droplets
US20020058468A1 (en) * 2000-05-03 2002-05-16 Eppert Stanley E. Semiconductor polishing pad
US6860802B1 (en) 2000-05-27 2005-03-01 Rohm And Haas Electric Materials Cmp Holdings, Inc. Polishing pads for chemical mechanical planarization
US6749485B1 (en) 2000-05-27 2004-06-15 Rodel Holdings, Inc. Hydrolytically stable grooved polishing pads for chemical mechanical planarization
JP4959901B2 (ja) * 2000-05-27 2012-06-27 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 化学機械平坦化用溝付き研磨パッド
US6736709B1 (en) 2000-05-27 2004-05-18 Rodel Holdings, Inc. Grooved polishing pads for chemical mechanical planarization
US6685537B1 (en) * 2000-06-05 2004-02-03 Speedfam-Ipec Corporation Polishing pad window for a chemical mechanical polishing tool
US6592443B1 (en) * 2000-08-30 2003-07-15 Micron Technology, Inc. Method and apparatus for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates
US6652764B1 (en) * 2000-08-31 2003-11-25 Micron Technology, Inc. Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates
JP2002141315A (ja) * 2000-11-02 2002-05-17 Hitachi Chem Co Ltd 酸化セリウム研磨剤用cmpパッド及び基板の研磨方法
CN100379522C (zh) 2000-12-01 2008-04-09 东洋橡膠工业株式会社 研磨垫及其制造方法和研磨垫用缓冲层
US6840843B2 (en) 2001-03-01 2005-01-11 Cabot Microelectronics Corporation Method for manufacturing a polishing pad having a compressed translucent region
CN1610962A (zh) * 2001-12-28 2005-04-27 旭化成电子材料元件株式会社 研磨垫及其制法和研磨方法
US6852020B2 (en) * 2003-01-22 2005-02-08 Raytech Innovative Solutions, Inc. Polishing pad for use in chemical—mechanical planarization of semiconductor wafers and method of making same
US7037184B2 (en) * 2003-01-22 2006-05-02 Raytech Innovation Solutions, Llc Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same
US20030194959A1 (en) * 2002-04-15 2003-10-16 Cabot Microelectronics Corporation Sintered polishing pad with regions of contrasting density
US20050276967A1 (en) * 2002-05-23 2005-12-15 Cabot Microelectronics Corporation Surface textured microporous polishing pads
US7025668B2 (en) * 2002-06-18 2006-04-11 Raytech Innovative Solutions, Llc Gradient polishing pad made from paper-making fibers for use in chemical/mechanical planarization of wafers
EP1594656B1 (en) * 2003-02-18 2007-09-12 Parker-Hannifin Corporation Polishing article for electro-chemical mechanical polishing
US6802761B1 (en) * 2003-03-20 2004-10-12 Hitachi Global Storage Technologies Netherlands B.V. Pattern-electroplated lapping plates for reduced loads during single slider lapping and process for their fabrication
US6852982B1 (en) * 2003-07-14 2005-02-08 Fei Company Magnetic lens
US20050069462A1 (en) * 2003-09-30 2005-03-31 International Business Machines Corporation Microfluidics Packaging
US20050069949A1 (en) * 2003-09-30 2005-03-31 International Business Machines Corporation Microfabricated Fluidic Structures
US7204742B2 (en) * 2004-03-25 2007-04-17 Cabot Microelectronics Corporation Polishing pad comprising hydrophobic region and endpoint detection port
JP4845347B2 (ja) * 2004-05-17 2011-12-28 東洋ゴム工業株式会社 研磨パッドおよびその製造方法
TWI254354B (en) * 2004-06-29 2006-05-01 Iv Technologies Co Ltd An inlaid polishing pad and a method of producing the same
NZ562513A (en) * 2005-04-14 2010-10-29 Saint Gobain Abrasives Inc Forming structured abrasive article by partially curing a binder through exposure to actinic radiation and forming a pattern in binder
US20070049164A1 (en) * 2005-08-26 2007-03-01 Thomson Clifford O Polishing pad and method for manufacturing polishing pads
US8192249B2 (en) * 2009-03-12 2012-06-05 Hitachi Global Storage Technologies Netherlands, B.V. Systems and methods for polishing a magnetic disk
KR101044279B1 (ko) * 2009-07-30 2011-06-28 서강대학교산학협력단 Cmp 연마패드와 그의 제조방법
KR101044281B1 (ko) * 2009-07-30 2011-06-28 서강대학교산학협력단 기공이 형성된 cmp 연마패드와 그의 제조방법
TWI423307B (zh) 2010-11-05 2014-01-11 Far Eastern New Century Corp 製造微結構的方法
US20130316621A1 (en) * 2010-12-07 2013-11-28 Jsr Corporation Chemical mechanical polishing pad and chemical mechanical polishing method using same
US8828650B2 (en) 2011-09-13 2014-09-09 Far Eastern New Century Corporation Method for making a retarder
US8894799B2 (en) 2011-09-22 2014-11-25 Dow Global Technologies Llc Method of forming layered-open-network polishing pads
US9108291B2 (en) 2011-09-22 2015-08-18 Dow Global Technologies Llc Method of forming structured-open-network polishing pads
US8801949B2 (en) 2011-09-22 2014-08-12 Dow Global Technologies Llc Method of forming open-network polishing pads
US9067299B2 (en) 2012-04-25 2015-06-30 Applied Materials, Inc. Printed chemical mechanical polishing pad
TWI538777B (zh) * 2012-06-29 2016-06-21 三島光產股份有限公司 硏磨墊成形模具之製造方法,利用該方法製造之硏磨墊成形模具,及利用該模具所製造之硏磨墊
DE102012017874A1 (de) * 2012-09-11 2014-03-27 Hoerbiger Antriebstechnik Holding Gmbh Verfahren zur Herstellung eines Reibbelags sowie Reibbelag
US9993907B2 (en) * 2013-12-20 2018-06-12 Applied Materials, Inc. Printed chemical mechanical polishing pad having printed window
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
KR20240015167A (ko) * 2014-10-17 2024-02-02 어플라이드 머티어리얼스, 인코포레이티드 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 cmp 패드 구성
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
JP6940495B2 (ja) * 2015-10-30 2021-09-29 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 所望のゼータ電位を有する研磨用物品を形成するための装置及び方法
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
KR102302564B1 (ko) * 2016-03-09 2021-09-15 어플라이드 머티어리얼스, 인코포레이티드 패드 구조 및 제조 방법들
US20180304539A1 (en) 2017-04-21 2018-10-25 Applied Materials, Inc. Energy delivery system with array of energy sources for an additive manufacturing apparatus
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
US11260495B2 (en) * 2018-07-27 2022-03-01 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus and methods for chemical mechanical polishing
WO2020050932A1 (en) 2018-09-04 2020-03-12 Applied Materials, Inc. Formulations for advanced polishing pads
JP7321052B2 (ja) * 2019-10-17 2023-08-04 東京エレクトロン株式会社 基板処理装置および装置洗浄方法
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
TWI779275B (zh) 2020-03-31 2022-10-01 望隼科技股份有限公司 防藍光隱形眼鏡、其組合物及製備方法
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
US12220784B2 (en) 2021-10-13 2025-02-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad and preparation thereof
US11679531B2 (en) 2021-10-13 2023-06-20 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad and preparation thereof

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US34492A (en) 1862-02-25 Improvement in portable filters
US3504457A (en) * 1966-07-05 1970-04-07 Geoscience Instr Corp Polishing apparatus
US3905816A (en) * 1974-06-27 1975-09-16 Hercules Inc Preparing lithographic plates utilizing hydrolyzable azoand azido-silane compounds
US3924520A (en) * 1974-06-27 1975-12-09 Hercules Inc Preparing lithographic plates utilizing vinyl monomers containing hydrolyzable silane groups
AU507014B2 (en) * 1975-11-05 1980-01-31 Hercules Inc. Photopolymer compositions
US4174218A (en) * 1975-11-05 1979-11-13 Hercules Incorporated Relief plates from polymer with terminal unsaturation
CA1100148A (en) * 1978-01-04 1981-04-28 Rudolph L. Pohl Photopolymer compositions for printing plates
US4518677A (en) * 1978-01-04 1985-05-21 Hercules Incorporated Process for making printing plates
US4266007A (en) * 1978-06-22 1981-05-05 Hercules Incorporated Multilayer printing plates and process for making same
US4198238A (en) * 1978-06-22 1980-04-15 Hercules Incorporated Photopolymerizable composition
US4332873A (en) * 1979-08-22 1982-06-01 Hercules Incorporated Multilayer printing plates and process for making same
JPS639406Y2 (https=) * 1981-01-22 1988-03-19
JPS58151477A (ja) * 1982-03-02 1983-09-08 Nippon Tenshiyashi Kk 金属製研磨体の製造方法
US4927432A (en) * 1986-03-25 1990-05-22 Rodel, Inc. Pad material for grinding, lapping and polishing
US4836832A (en) * 1986-08-11 1989-06-06 Minnesota Mining And Manufacturing Company Method of preparing coated abrasive having radiation curable binder
AU1215788A (en) * 1987-02-27 1988-09-01 Diabrasive International Ltd. Flexible abrasives
GB8722085D0 (en) * 1987-09-19 1987-10-28 Cambridge Consultants Ink jet nozzle manufacture
US4927431A (en) * 1988-09-08 1990-05-22 Minnesota Mining And Manufacturing Company Binder for coated abrasives
JPH02208601A (ja) * 1989-02-08 1990-08-20 Seiko Instr Inc 光学用窓材及びその製造方法
US5014468A (en) * 1989-05-05 1991-05-14 Norton Company Patterned coated abrasive for fine surface finishing
US5209027A (en) * 1989-10-13 1993-05-11 Tdk Corporation Polishing of the rear surface of a stamper for optical disk reproduction
JPH03202281A (ja) * 1989-12-28 1991-09-04 Nippon Micro Kooteingu Kk 任意の微細凹凸パターンを表面上に有する研磨テープの製造方法
US5209023A (en) * 1990-05-18 1993-05-11 Jerry Bizer Thermoplastic polymer optical lap and method of making same
US5209760A (en) * 1990-05-21 1993-05-11 Wiand Ronald C Injection molded abrasive pad
US5380390B1 (en) * 1991-06-10 1996-10-01 Ultimate Abras Systems Inc Patterned abrasive material and method
US5212910A (en) * 1991-07-09 1993-05-25 Intel Corporation Composite polishing pad for semiconductor process
US5197999A (en) * 1991-09-30 1993-03-30 National Semiconductor Corporation Polishing pad for planarization
GB9122577D0 (en) * 1991-10-24 1991-12-04 Hercules Inc Improved moulding resin with quick-release properties
US5341799A (en) * 1991-12-23 1994-08-30 Hercules Incorporated Urethane polymers for printing plate compositions
US6217984B1 (en) * 1992-05-21 2001-04-17 3M Innovative Properties Company Organometallic monomers and polymers with improved adhesion
US5344688A (en) * 1992-08-19 1994-09-06 Minnesota Mining And Manufacturing Company Coated abrasive article and a method of making same
MY114512A (en) * 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US5216843A (en) * 1992-09-24 1993-06-08 Intel Corporation Polishing pad conditioning apparatus for wafer planarization process
JPH07502461A (ja) * 1992-10-13 1995-03-16 ロクタイト.コーポレイション レンズブロッキング/デブロッキング方法
JPH06179166A (ja) * 1992-10-14 1994-06-28 Seiko Instr Inc 研磨工具とその製造方法
US5436063A (en) * 1993-04-15 1995-07-25 Minnesota Mining And Manufacturing Company Coated abrasive article incorporating an energy cured hot melt make coat
US5489233A (en) * 1994-04-08 1996-02-06 Rodel, Inc. Polishing pads and methods for their use
JP4036272B2 (ja) * 1996-07-18 2008-01-23 日東電工株式会社 粘着剤組成物および粘着シート類
US5766277A (en) * 1996-09-20 1998-06-16 Minnesota Mining And Manufacturing Company Coated abrasive article and method of making same
US5730764A (en) * 1997-01-24 1998-03-24 Williamson; Sue Ellen Coated abrasive systems employing ionizing irradiation cured epoxy resins as binder
WO1998035789A1 (en) * 1997-02-18 1998-08-20 Ferronato Sandro Giovanni Guis Method of forming a high precision flexible abrasive member

Also Published As

Publication number Publication date
DE69827789T2 (de) 2005-11-10
WO1998030356A1 (en) 1998-07-16
EP0984846A4 (en) 2000-03-15
DE69827789D1 (de) 2004-12-30
US6036579A (en) 2000-03-14
EP0984846A1 (en) 2000-03-15
US6210254B1 (en) 2001-04-03
KR20000070068A (ko) 2000-11-25
JP2001507997A (ja) 2001-06-19
EP0984846B1 (en) 2004-11-24
KR100487455B1 (ko) 2005-05-09

Similar Documents

Publication Publication Date Title
JP4163756B2 (ja) ホトリソグラフィーによって形成された表面パターンを有するポリマー研磨パッド及びこれに関する方法
TWI737688B (zh) 墊結構及製造方法
JP6694932B2 (ja) 制御された孔隙率を有する印刷された化学機械研磨パッド
TWI833745B (zh) 親水性及z電位可調之化學機械研磨墊及其形成方法
TWI687312B (zh) 由積層製造製程所生產之研磨墊
JP4971028B2 (ja) 研磨パッドの製造方法
KR20100028294A (ko) 연마패드 및 그의 제조방법
US20230219190A1 (en) Additive manufacturing of polishing pads
JP2003048151A (ja) 研磨パッド
JP7383564B2 (ja) インプリント方法、インプリント装置、および物品の製造方法
JP2005166712A (ja) Cmp用研磨パッド、及び研磨方法
WO2021252540A1 (en) Additive manufacturing of polishing pads
KR20170099068A (ko) 사파이어 웨이퍼를 연마하는 방법
CN102484058B (zh) Cmp抛光垫及其制造方法
JP2010072214A (ja) 光導波路の製造方法及び製造装置
JP7693122B2 (ja) 樹脂液及び造形物形成方法
JP2005324302A (ja) 研磨パッドおよびその製造方法
JP5165923B2 (ja) 研磨パッドの製造方法
JP2023052103A (ja) 研磨パッド及びその製造方法
JP2024024727A (ja) 研磨パッド及びその製造方法、並びに、研磨加工品の製造方法

Legal Events

Date Code Title Description
A72 Notification of change in name of applicant

Free format text: JAPANESE INTERMEDIATE CODE: A721

Effective date: 20041026

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050112

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050112

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20071225

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080310

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20080708

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20080725

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110801

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110801

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120801

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120801

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130801

Year of fee payment: 5

EXPY Cancellation because of completion of term