DE69827789T2 - Verfahren zum herstellen von einem photolithographisch gemusterten kunststoffpolierkissen - Google Patents
Verfahren zum herstellen von einem photolithographisch gemusterten kunststoffpolierkissen Download PDFInfo
- Publication number
- DE69827789T2 DE69827789T2 DE69827789T DE69827789T DE69827789T2 DE 69827789 T2 DE69827789 T2 DE 69827789T2 DE 69827789 T DE69827789 T DE 69827789T DE 69827789 T DE69827789 T DE 69827789T DE 69827789 T2 DE69827789 T2 DE 69827789T2
- Authority
- DE
- Germany
- Prior art keywords
- pattern
- precursor
- photomask
- liquid precursor
- pillow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005498 polishing Methods 0.000 title claims description 18
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000002243 precursor Substances 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 22
- 230000005670 electromagnetic radiation Effects 0.000 claims description 17
- 239000012705 liquid precursor Substances 0.000 claims description 15
- 230000015572 biosynthetic process Effects 0.000 claims description 7
- 229920001730 Moisture cure polyurethane Polymers 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 4
- 230000004888 barrier function Effects 0.000 claims description 4
- 125000005395 methacrylic acid group Chemical group 0.000 claims description 4
- 238000003384 imaging method Methods 0.000 claims description 3
- 230000035515 penetration Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 description 24
- 230000005855 radiation Effects 0.000 description 16
- 238000000576 coating method Methods 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 239000010410 layer Substances 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- -1 alkyl benzoin Chemical compound 0.000 description 4
- 238000001723 curing Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 150000002902 organometallic compounds Chemical class 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 229920013730 reactive polymer Polymers 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 238000007655 standard test method Methods 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- ILBBNQMSDGAAPF-UHFFFAOYSA-N 1-(6-hydroxy-6-methylcyclohexa-2,4-dien-1-yl)propan-1-one Chemical compound CCC(=O)C1C=CC=CC1(C)O ILBBNQMSDGAAPF-UHFFFAOYSA-N 0.000 description 1
- OAMHTTBNEJBIKA-UHFFFAOYSA-N 2,2,2-trichloro-1-phenylethanone Chemical compound ClC(Cl)(Cl)C(=O)C1=CC=CC=C1 OAMHTTBNEJBIKA-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- AOGNACZDZNOTSN-UHFFFAOYSA-N 2,3-dihydroxy-1,2-diphenylpropan-1-one Chemical compound C=1C=CC=CC=1C(O)(CO)C(=O)C1=CC=CC=C1 AOGNACZDZNOTSN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000011325 microbead Substances 0.000 description 1
- 230000000269 nucleophilic effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 239000003351 stiffener Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000001429 visible spectrum Methods 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US3449297P | 1997-01-13 | 1997-01-13 | |
| US34492P | 1997-01-13 | ||
| PCT/US1998/000317 WO1998030356A1 (en) | 1997-01-13 | 1998-01-12 | Polymeric polishing pad having photolithographically induced surface pattern(s) and methods relating thereto |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69827789D1 DE69827789D1 (de) | 2004-12-30 |
| DE69827789T2 true DE69827789T2 (de) | 2005-11-10 |
Family
ID=21876756
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69827789T Expired - Lifetime DE69827789T2 (de) | 1997-01-13 | 1998-01-12 | Verfahren zum herstellen von einem photolithographisch gemusterten kunststoffpolierkissen |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US6036579A (https=) |
| EP (1) | EP0984846B1 (https=) |
| JP (1) | JP4163756B2 (https=) |
| KR (1) | KR100487455B1 (https=) |
| DE (1) | DE69827789T2 (https=) |
| WO (1) | WO1998030356A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102012017874A1 (de) * | 2012-09-11 | 2014-03-27 | Hoerbiger Antriebstechnik Holding Gmbh | Verfahren zur Herstellung eines Reibbelags sowie Reibbelag |
Families Citing this family (69)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BRPI9909678B8 (pt) * | 1998-04-17 | 2021-05-25 | Fujirebio Europe N V | aperfeiçoados ensaios de imunodiagnóstico usando agentes redutores |
| US6290589B1 (en) * | 1998-12-09 | 2001-09-18 | Applied Materials, Inc. | Polishing pad with a partial adhesive coating |
| US6354915B1 (en) * | 1999-01-21 | 2002-03-12 | Rodel Holdings Inc. | Polishing pads and methods relating thereto |
| US6234875B1 (en) | 1999-06-09 | 2001-05-22 | 3M Innovative Properties Company | Method of modifying a surface |
| US20010046834A1 (en) * | 2000-02-28 | 2001-11-29 | Anuradha Ramana | Pad surface texture formed by solid phase droplets |
| US20020058468A1 (en) * | 2000-05-03 | 2002-05-16 | Eppert Stanley E. | Semiconductor polishing pad |
| JP4615813B2 (ja) * | 2000-05-27 | 2011-01-19 | ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド | 化学機械平坦化用の研磨パッド |
| US6860802B1 (en) | 2000-05-27 | 2005-03-01 | Rohm And Haas Electric Materials Cmp Holdings, Inc. | Polishing pads for chemical mechanical planarization |
| US6736709B1 (en) | 2000-05-27 | 2004-05-18 | Rodel Holdings, Inc. | Grooved polishing pads for chemical mechanical planarization |
| US6749485B1 (en) | 2000-05-27 | 2004-06-15 | Rodel Holdings, Inc. | Hydrolytically stable grooved polishing pads for chemical mechanical planarization |
| US6685537B1 (en) * | 2000-06-05 | 2004-02-03 | Speedfam-Ipec Corporation | Polishing pad window for a chemical mechanical polishing tool |
| US6592443B1 (en) * | 2000-08-30 | 2003-07-15 | Micron Technology, Inc. | Method and apparatus for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates |
| US6652764B1 (en) * | 2000-08-31 | 2003-11-25 | Micron Technology, Inc. | Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates |
| JP2002141315A (ja) * | 2000-11-02 | 2002-05-17 | Hitachi Chem Co Ltd | 酸化セリウム研磨剤用cmpパッド及び基板の研磨方法 |
| CN100496896C (zh) | 2000-12-01 | 2009-06-10 | 东洋橡膠工业株式会社 | 研磨垫 |
| WO2002070200A1 (en) | 2001-03-01 | 2002-09-12 | Cabot Microelectronics Corporation | Method for manufacturing a polishing pad having a compressed translucent region |
| JPWO2003058698A1 (ja) * | 2001-12-28 | 2005-05-19 | 旭化成エレクトロニクス株式会社 | 研磨パッド、その製法及び研磨方法 |
| US7037184B2 (en) * | 2003-01-22 | 2006-05-02 | Raytech Innovation Solutions, Llc | Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same |
| US6852020B2 (en) * | 2003-01-22 | 2005-02-08 | Raytech Innovative Solutions, Inc. | Polishing pad for use in chemical—mechanical planarization of semiconductor wafers and method of making same |
| US20030194959A1 (en) * | 2002-04-15 | 2003-10-16 | Cabot Microelectronics Corporation | Sintered polishing pad with regions of contrasting density |
| US20050276967A1 (en) * | 2002-05-23 | 2005-12-15 | Cabot Microelectronics Corporation | Surface textured microporous polishing pads |
| US7025668B2 (en) * | 2002-06-18 | 2006-04-11 | Raytech Innovative Solutions, Llc | Gradient polishing pad made from paper-making fibers for use in chemical/mechanical planarization of wafers |
| WO2004073926A1 (en) * | 2003-02-18 | 2004-09-02 | Parker-Hannifin Corporation | Polishing article for electro-chemical mechanical polishing |
| US6802761B1 (en) * | 2003-03-20 | 2004-10-12 | Hitachi Global Storage Technologies Netherlands B.V. | Pattern-electroplated lapping plates for reduced loads during single slider lapping and process for their fabrication |
| US6852982B1 (en) * | 2003-07-14 | 2005-02-08 | Fei Company | Magnetic lens |
| US20050069949A1 (en) * | 2003-09-30 | 2005-03-31 | International Business Machines Corporation | Microfabricated Fluidic Structures |
| US20050069462A1 (en) * | 2003-09-30 | 2005-03-31 | International Business Machines Corporation | Microfluidics Packaging |
| US7204742B2 (en) * | 2004-03-25 | 2007-04-17 | Cabot Microelectronics Corporation | Polishing pad comprising hydrophobic region and endpoint detection port |
| JP4845347B2 (ja) * | 2004-05-17 | 2011-12-28 | 東洋ゴム工業株式会社 | 研磨パッドおよびその製造方法 |
| TWI254354B (en) * | 2004-06-29 | 2006-05-01 | Iv Technologies Co Ltd | An inlaid polishing pad and a method of producing the same |
| NZ562513A (en) * | 2005-04-14 | 2010-10-29 | Saint Gobain Abrasives Inc | Forming structured abrasive article by partially curing a binder through exposure to actinic radiation and forming a pattern in binder |
| US20070049164A1 (en) * | 2005-08-26 | 2007-03-01 | Thomson Clifford O | Polishing pad and method for manufacturing polishing pads |
| US8192249B2 (en) * | 2009-03-12 | 2012-06-05 | Hitachi Global Storage Technologies Netherlands, B.V. | Systems and methods for polishing a magnetic disk |
| KR101044279B1 (ko) * | 2009-07-30 | 2011-06-28 | 서강대학교산학협력단 | Cmp 연마패드와 그의 제조방법 |
| KR101044281B1 (ko) * | 2009-07-30 | 2011-06-28 | 서강대학교산학협력단 | 기공이 형성된 cmp 연마패드와 그의 제조방법 |
| TWI423307B (zh) | 2010-11-05 | 2014-01-11 | Far Eastern New Century Corp | 製造微結構的方法 |
| JPWO2012077592A1 (ja) * | 2010-12-07 | 2014-05-19 | Jsr株式会社 | 化学機械研磨パッドおよびそれを用いた化学機械研磨方法 |
| US8828650B2 (en) | 2011-09-13 | 2014-09-09 | Far Eastern New Century Corporation | Method for making a retarder |
| US8894799B2 (en) | 2011-09-22 | 2014-11-25 | Dow Global Technologies Llc | Method of forming layered-open-network polishing pads |
| US9108291B2 (en) | 2011-09-22 | 2015-08-18 | Dow Global Technologies Llc | Method of forming structured-open-network polishing pads |
| US8801949B2 (en) | 2011-09-22 | 2014-08-12 | Dow Global Technologies Llc | Method of forming open-network polishing pads |
| US9067299B2 (en) * | 2012-04-25 | 2015-06-30 | Applied Materials, Inc. | Printed chemical mechanical polishing pad |
| TWI538777B (zh) * | 2012-06-29 | 2016-06-21 | 三島光產股份有限公司 | 硏磨墊成形模具之製造方法,利用該方法製造之硏磨墊成形模具,及利用該模具所製造之硏磨墊 |
| US9993907B2 (en) * | 2013-12-20 | 2018-06-12 | Applied Materials, Inc. | Printed chemical mechanical polishing pad having printed window |
| US9873180B2 (en) * | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
| US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
| US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
| SG11201703114QA (en) | 2014-10-17 | 2017-06-29 | Applied Materials Inc | Cmp pad construction with composite material properties using additive manufacturing processes |
| US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
| US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| KR20230169424A (ko) * | 2015-10-30 | 2023-12-15 | 어플라이드 머티어리얼스, 인코포레이티드 | 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법 |
| US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
| US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
| CN109075057B (zh) * | 2016-03-09 | 2023-10-20 | 应用材料公司 | 垫结构及制造方法 |
| US20180304539A1 (en) | 2017-04-21 | 2018-10-25 | Applied Materials, Inc. | Energy delivery system with array of energy sources for an additive manufacturing apparatus |
| US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
| US11072050B2 (en) | 2017-08-04 | 2021-07-27 | Applied Materials, Inc. | Polishing pad with window and manufacturing methods thereof |
| WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
| US11260495B2 (en) * | 2018-07-27 | 2022-03-01 | Taiwan Semiconductor Manufacturing Company Ltd. | Apparatus and methods for chemical mechanical polishing |
| KR20210042171A (ko) | 2018-09-04 | 2021-04-16 | 어플라이드 머티어리얼스, 인코포레이티드 | 진보한 폴리싱 패드들을 위한 제형들 |
| JP7321052B2 (ja) * | 2019-10-17 | 2023-08-04 | 東京エレクトロン株式会社 | 基板処理装置および装置洗浄方法 |
| US11813712B2 (en) | 2019-12-20 | 2023-11-14 | Applied Materials, Inc. | Polishing pads having selectively arranged porosity |
| TWI779275B (zh) | 2020-03-31 | 2022-10-01 | 望隼科技股份有限公司 | 防藍光隱形眼鏡、其組合物及製備方法 |
| US11806829B2 (en) | 2020-06-19 | 2023-11-07 | Applied Materials, Inc. | Advanced polishing pads and related polishing pad manufacturing methods |
| US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
| US12220784B2 (en) | 2021-10-13 | 2025-02-11 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad and preparation thereof |
| US11679531B2 (en) | 2021-10-13 | 2023-06-20 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad and preparation thereof |
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| US34492A (en) | 1862-02-25 | Improvement in portable filters | ||
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-
1998
- 1998-01-12 KR KR10-1999-7006289A patent/KR100487455B1/ko not_active Expired - Lifetime
- 1998-01-12 WO PCT/US1998/000317 patent/WO1998030356A1/en not_active Ceased
- 1998-01-12 EP EP98903401A patent/EP0984846B1/en not_active Expired - Lifetime
- 1998-01-12 JP JP53109098A patent/JP4163756B2/ja not_active Expired - Lifetime
- 1998-01-12 DE DE69827789T patent/DE69827789T2/de not_active Expired - Lifetime
- 1998-01-12 US US09/005,708 patent/US6036579A/en not_active Expired - Lifetime
-
2000
- 2000-02-02 US US09/496,327 patent/US6210254B1/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102012017874A1 (de) * | 2012-09-11 | 2014-03-27 | Hoerbiger Antriebstechnik Holding Gmbh | Verfahren zur Herstellung eines Reibbelags sowie Reibbelag |
Also Published As
| Publication number | Publication date |
|---|---|
| US6036579A (en) | 2000-03-14 |
| KR20000070068A (ko) | 2000-11-25 |
| DE69827789D1 (de) | 2004-12-30 |
| KR100487455B1 (ko) | 2005-05-09 |
| EP0984846A4 (en) | 2000-03-15 |
| JP2001507997A (ja) | 2001-06-19 |
| US6210254B1 (en) | 2001-04-03 |
| EP0984846A1 (en) | 2000-03-15 |
| EP0984846B1 (en) | 2004-11-24 |
| JP4163756B2 (ja) | 2008-10-08 |
| WO1998030356A1 (en) | 1998-07-16 |
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