JP4157001B2 - マルチチップ圧接型半導体装置 - Google Patents

マルチチップ圧接型半導体装置 Download PDF

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Publication number
JP4157001B2
JP4157001B2 JP2003304381A JP2003304381A JP4157001B2 JP 4157001 B2 JP4157001 B2 JP 4157001B2 JP 2003304381 A JP2003304381 A JP 2003304381A JP 2003304381 A JP2003304381 A JP 2003304381A JP 4157001 B2 JP4157001 B2 JP 4157001B2
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JP
Japan
Prior art keywords
chip
chips
diode
semiconductor device
active element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003304381A
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English (en)
Japanese (ja)
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JP2005079136A (ja
JP2005079136A5 (https=
Inventor
滋 長谷川
澤 秀 明 北
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2003304381A priority Critical patent/JP4157001B2/ja
Priority to US10/926,071 priority patent/US7196412B2/en
Priority to EP04020424A priority patent/EP1511078A2/en
Publication of JP2005079136A publication Critical patent/JP2005079136A/ja
Publication of JP2005079136A5 publication Critical patent/JP2005079136A5/ja
Application granted granted Critical
Publication of JP4157001B2 publication Critical patent/JP4157001B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP2003304381A 2003-08-28 2003-08-28 マルチチップ圧接型半導体装置 Expired - Fee Related JP4157001B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003304381A JP4157001B2 (ja) 2003-08-28 2003-08-28 マルチチップ圧接型半導体装置
US10/926,071 US7196412B2 (en) 2003-08-28 2004-08-26 Multi-chip press-connected type semiconductor device
EP04020424A EP1511078A2 (en) 2003-08-28 2004-08-27 Multi-chip press-connected type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003304381A JP4157001B2 (ja) 2003-08-28 2003-08-28 マルチチップ圧接型半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008126234A Division JP4802210B2 (ja) 2008-05-13 2008-05-13 マルチチップ圧接型半導体装置

Publications (3)

Publication Number Publication Date
JP2005079136A JP2005079136A (ja) 2005-03-24
JP2005079136A5 JP2005079136A5 (https=) 2006-08-31
JP4157001B2 true JP4157001B2 (ja) 2008-09-24

Family

ID=34101214

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003304381A Expired - Fee Related JP4157001B2 (ja) 2003-08-28 2003-08-28 マルチチップ圧接型半導体装置

Country Status (3)

Country Link
US (1) US7196412B2 (https=)
EP (1) EP1511078A2 (https=)
JP (1) JP4157001B2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005050534B4 (de) * 2005-10-21 2008-08-07 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul
CN102569276B (zh) * 2012-02-14 2014-11-19 株洲南车时代电气股份有限公司 一种igbt模块
CN103515365B (zh) * 2013-10-14 2016-04-20 国家电网公司 一种大功率压接式igbt器件
CN104241125B (zh) * 2014-08-22 2017-05-24 上海先进半导体制造股份有限公司 压接式igbt的正面金属工艺
CN114068515A (zh) * 2021-11-25 2022-02-18 南瑞联研半导体有限责任公司 一种压接式功率器件

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3258200B2 (ja) * 1995-05-31 2002-02-18 株式会社東芝 圧接型半導体装置
DE59107655D1 (de) * 1991-02-22 1996-05-09 Asea Brown Boveri Abschaltbares Hochleistungs-Halbleiterbauelement
JP3256636B2 (ja) * 1994-09-15 2002-02-12 株式会社東芝 圧接型半導体装置
JP3588503B2 (ja) * 1995-06-20 2004-11-10 株式会社東芝 圧接型半導体装置
JP3319569B2 (ja) * 1996-05-31 2002-09-03 株式会社東芝 圧接型半導体装置
JP3344552B2 (ja) * 1997-09-17 2002-11-11 株式会社東芝 圧接型半導体装置
JP2001036002A (ja) * 1999-07-23 2001-02-09 Fuji Electric Co Ltd 半導体装置
JP3923716B2 (ja) * 2000-09-29 2007-06-06 株式会社東芝 半導体装置
JP4088051B2 (ja) 2001-06-26 2008-05-21 株式会社東芝 半導体装置

Also Published As

Publication number Publication date
US7196412B2 (en) 2007-03-27
US20050087865A1 (en) 2005-04-28
JP2005079136A (ja) 2005-03-24
EP1511078A2 (en) 2005-03-02

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