JP4130392B2 - 銅および銅合金の平面仕上げエッチング処理方法 - Google Patents
銅および銅合金の平面仕上げエッチング処理方法 Download PDFInfo
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- JP4130392B2 JP4130392B2 JP2003308666A JP2003308666A JP4130392B2 JP 4130392 B2 JP4130392 B2 JP 4130392B2 JP 2003308666 A JP2003308666 A JP 2003308666A JP 2003308666 A JP2003308666 A JP 2003308666A JP 4130392 B2 JP4130392 B2 JP 4130392B2
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- copper
- etching
- alloy
- copper alloy
- etching solution
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- Manufacturing Of Printed Circuit Boards (AREA)
- Weting (AREA)
Description
Claims (3)
- 第一と第二のエッチング工程による銅および銅合金の平面仕上げエッチング処理方法であって、
第一と第二のエッチング液が、主剤を過酸化水素水と硫酸との水溶液とし、第一のエッチング液は添加剤として脂肪族アミン類を含み、銅および銅合金を第一のエッチング液で処理した後、前記主剤に添加剤としてアゾール類を含む第二のエッチング液により、該第一のエッチング液で処理した銅および銅合金の表面を平面エッチング処理することを特徴とする銅および銅合金の平面仕上げエッチング処理方法。 - 前記第一と第二のエッチング工程に続き、超音波洗浄工程を実施することを特徴とする請求項1に記載の銅および銅合金の平面仕上げエッチング処理法方法。
- 前記超音波洗浄工程において、洗浄液として水若しくはアルカリ洗浄液を用いたことを特徴とする請求項2に記載の銅および銅合金の平面仕上げエッチング処理方法。
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JP2003308666A JP4130392B2 (ja) | 2003-09-01 | 2003-09-01 | 銅および銅合金の平面仕上げエッチング処理方法 |
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JP2003308666A JP4130392B2 (ja) | 2003-09-01 | 2003-09-01 | 銅および銅合金の平面仕上げエッチング処理方法 |
Publications (2)
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JP2005076090A JP2005076090A (ja) | 2005-03-24 |
JP4130392B2 true JP4130392B2 (ja) | 2008-08-06 |
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JP2003308666A Expired - Fee Related JP4130392B2 (ja) | 2003-09-01 | 2003-09-01 | 銅および銅合金の平面仕上げエッチング処理方法 |
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Families Citing this family (1)
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US20110056910A1 (en) * | 2008-02-12 | 2011-03-10 | Makoto Kato | Etching method |
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